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SN74AS871N1

Texas Instruments

SN74AS871N1 by Texas Instruments

SN74AS871N1 by Texas Instruments is a TTL technology IC with 28 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. With a rectangular plastic/epoxy body, it is commonly used in memory functions requiring dual terminal positions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,964 parts In-Stock

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7,964

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Digiode

USA . 98 parts In-Stock

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98

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One Stop Electronics

USA . 916 parts In-Stock

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$2.000

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916

$2.000

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Parana Technologies

USA . 452 parts In-Stock

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$5.174

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$5.775

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452

$5.174

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$5.775

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ChromeModa Solutions

Germany . 2,425 parts In-Stock

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$5.813

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$4.767

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2,425

$5.813

$4.767

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IDEA Electronic Components Group

UK . 1,488 parts In-Stock

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$5.813

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$5.232

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1,488

$5.813

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$5.232

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AZTECH Wire

Italy . 395 parts In-Stock

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$14.394

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395

$14.394

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Corphita

USA . 3,961 parts In-Stock

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3,961

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DigiPath Technology Company

USA . 1,724 parts In-Stock

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$5.241

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1,724

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Overview

Unlock endless possibilities with the Texas Instruments SN74AS871N1. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their products. This memory IC is versatile and suitable for various applications. From industrial automation to consumer electronics, this product offers exceptional value and performance. Experience seamless operation and enhanced efficiency with the SN74AS871N1, setting new standards in the world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the memory IC, making it suitable for a variety of applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit boards and other electronic devices.

No. of Terminals: 28

Having more terminals allows for more connectivity options, making this memory IC versatile in its applications.

Package Style (Meter): IN-LINE

The in-line package style provides easy connection and installation in a circuit, saving space and improving efficiency.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures that the memory IC can function reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the memory IC can operate efficiently even in colder environments.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in connection options, allowing for easier integration into different systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the memory IC is suitable for general commercial applications, making it a versatile choice.

Technology: TTL

TTL technology offers reliable performance and compatibility with other TTL-based devices, enhancing the overall reliability and functionality of the memory IC.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and robust connections, reducing the risk of disconnection or damage during operation.

Terminal Pitch: 2.54 mm

The standard 2.54 mm terminal pitch ensures compatibility with a wide range of connectors and circuit boards, making integration easier and more efficient.

Technical Specifications

Other Function Memory ICs SN74AS871N1 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS871N1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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