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M24SR64-YSG12I/2

STMicroelectronics

M24SR64-YSG12I/2 by STMicroelectronics

M24SR64-YSG12I/2 by STMicroelectronics is a synchronous memory IC with 8Kx8 organization and 65536-bit memory density. Operating at 3.3V, it is suitable for applications requiring uncased chip package style and CMOS technology. Ideal for surface mount setups, this rectangular-shaped IC supports a wide supply voltage range from 2.7V to 5.5V.

Median Price

$1.194

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$1.194

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$1.194

-

-

-

Vyrian

USA . 5,453 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,453

-

-

-

-

Anansix

USA . 1,905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,905

-

-

-

-

Digiode

USA . 1,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,272

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

$1.194

100+ parts

$1.134

1k+ parts

$1.078

10k+ parts

$1.063

800

$1.194

$1.134

$1.078

$1.063

IDEA Electronic Components Group

UK . 904 parts In-Stock

1+ parts

$4.395

100+ parts

-

1k+ parts

$3.955

10k+ parts

-

904

$4.395

-

$3.955

-

MKK Technologies

India . 486 parts In-Stock

1+ parts

$8.264

100+ parts

-

1k+ parts

-

10k+ parts

-

486

$8.264

-

-

-

DigiPath Technology Company

USA . 486 parts In-Stock

1+ parts

$8.264

100+ parts

-

1k+ parts

-

10k+ parts

-

486

$8.264

-

-

-

AZTECH Wire

Italy . 217 parts In-Stock

1+ parts

$14.005

100+ parts

-

1k+ parts

-

10k+ parts

-

217

$14.005

-

-

-

Ampacity Inc.

Singapore . 640 parts In-Stock

1+ parts

$26.000

100+ parts

-

1k+ parts

-

10k+ parts

-

640

$26.000

-

-

-

Corphita

USA . 3,107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,107

-

-

-

-

Parana Technologies

USA . 1,184 parts In-Stock

1+ parts

-

100+ parts

$5.255

1k+ parts

-

10k+ parts

-

1,184

-

$5.255

-

-

Overview

Get ready to experience top-notch performance and reliability with the M24SR64-YSG12I/2 by STMicroelectronics. This cutting-edge memory IC boasts unmatched quality and precision engineering, making it the go-to choice for a wide range of applications. From IoT devices to smart cards, this versatile product offers seamless operation and robust security features. Elevate your projects with the exceptional value and benefits that only STMicroelectronics can deliver. Trust in the M24SR64-YSG12I/2 to exceed your expectations and take your designs to the next level.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and providing flexibility in design.

Package Shape: RECTANGULAR

Provides a standard shape for easy integration into existing circuit layouts.

Operating Mode: SYNCHRONOUS

Ensures data is transmitted and processed efficiently, improving overall performance.

Nominal Supply Voltage / Vsup (V): 3.3

Offers a low power consumption option for energy-efficient applications.

Package Style (Meter): UNCASED CHIP

Ensures a compact and lightweight design for portable devices.

Organization: 8KX8

Provides a balanced structure for efficient data storage and retrieval.

Minimum Supply Voltage (Vsup): 2.7 V

Offers a wide range of operating voltages for versatile use in different systems.

Technology: CMOS

Utilizes a common and reliable technology for stable performance and compatibility.

No. of Words: 8192 words

Provides ample storage capacity for storing data and instructions.

Memory Width: 8

Enables efficient data transfer with the ability to handle multiple bits at once.

No. of Words Code: 8K

Indicates a high memory capacity suitable for diverse applications.

Maximum Supply Voltage (Vsup): 5.5 V

Offers flexibility in power input for reliable operation in various environments.

Memory Density: 65536 bit

Provides a high-density memory solution for storing large amounts of data in a compact space.

Memory IC Type: MEMORY CIRCUIT

Designed specifically for memory functions, ensuring reliable performance and compatibility.

Technical Specifications

Other Function Memory ICs M24SR64-YSG12I/2 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-XUUC-N

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Organization:

8KX8

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

M24SR64-YSG12I/2 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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