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SMC128AFB6E

STMicroelectronics

SMC128AFB6E by STMicroelectronics

SMC128AFB6E by STMicroelectronics is an industrial-grade, asynchronous memory IC with a density of 1 Gb and operates b/w -40 °C to 85 °C. It features a 128Mx8 organization and comes in a no-lead, uncasded chip package. Ideal for high-performance applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,687 parts In-Stock

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8,687

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Digiode

USA . 1,328 parts In-Stock

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1,328

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Anansix

USA . 652 parts In-Stock

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652

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Prism Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$4.377

100+ parts

$3.983

1k+ parts

$3.589

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-

20

$4.377

$3.983

$3.589

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IDEA Electronic Components Group

UK . 1,779 parts In-Stock

1+ parts

$4.392

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-

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$3.953

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1,779

$4.392

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$3.953

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MKK Technologies

India . 1,226 parts In-Stock

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$8.259

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$8.259

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DigiPath Technology Company

USA . 1,226 parts In-Stock

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$8.259

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$8.259

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AZTECH Wire

Italy . 548 parts In-Stock

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$9.000

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548

$9.000

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Component Stockers USA

USA . 251 parts In-Stock

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$99.990

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251

$99.990

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Parana Technologies

USA . 985 parts In-Stock

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$5.251

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985

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$5.251

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Corphita

USA . 353 parts In-Stock

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353

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Perfect Parts

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Overview

Unlock unparalleled performance with the SMC128AFB6E from STMicroelectronics, a leader in innovative memory solutions. Designed for industrial applications, this high-density asynchronous memory IC ensures reliability and efficiency, operating seamlessly in extreme temperatures. With its compact no-lead design, it saves space while delivering superior data management. Elevate your projects with a trusted product that promises quality, durability, and exceptional value for your next design challenge.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact circuit board layouts, making it ideal for space-constrained applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operating mode offers faster access times, allowing for quicker data retrieval and improved overall system performance.

Package Style (Meter): UNCASED CHIP

Uncased chip packaging provides flexibility in handling and integration, suitable for custom applications.

Maximum Operating Temperature: 85 °C

Withstanding temperatures up to 85 °C ensures reliability in high-temperature industrial environments.

Organization: 128MX8

The 128MX8 organization delivers a balance of high capacity and efficient data management, ideal for data-intensive applications.

Minimum Operating Temperature: -40 °C

Operating in temperatures as low as -40 °C makes this memory IC suitable for extreme conditions, enhancing its versatility.

Terminal Position: UPPER

Upper terminal position facilitates easier integration into various circuit layouts and simplifies assembly processes.

Temperature Grade: INDUSTRIAL

Industrial temperature grading assures robustness and long-term stability in harsh environments, making this IC reliable for critical applications.

Technology: CMOS

CMOS technology ensures low power consumption, allowing for energy-efficient operation, particularly in battery-powered devices.

Terminal Form: NO LEAD

No lead terminal form minimizes footprint and maximizes design flexibility, making it a great choice for modern compact electronic solutions.

No. of Words: 134217728 words

With 134217728 words, this memory IC provides substantial data capacity, perfect for applications that require large data storage.

Memory Width: 8

An 8-bit memory width strikes a balance between data throughput and complexity, allowing for effective performance across various applications.

No. of Words Code: 128M

Capacity of 128 million words enables extensive data handling capabilities, accommodating large datasets efficiently.

Memory Density: 1073741824 bit

A memory density of 1 Gigabit allows for high-volume data storage, making it suitable for applications such as telecommunications and data centers.

Memory IC Type: MEMORY CIRCUIT

Being classified as a memory circuit underlines its essential functionality in data storage and retrieval in modern computing applications.

Technical Specifications

Other Function Memory ICs SMC128AFB6E attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX8

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

SMC128AFB6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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