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SN74AS871DW

Texas Instruments

SN74AS871DW by Texas Instruments

SN74AS871DW by Texas Instruments is a TTL technology IC with 28 terminals in a small outline package. Operating temperature range is 0-70°C, suitable for commercial applications. It features gull wing terminals and is surface mountable, ideal for various memory functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,661 parts In-Stock

1+ parts

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8,661

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Digiode

USA . 2,494 parts In-Stock

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2,494

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 604 parts In-Stock

1+ parts

$3.420

100+ parts

-

1k+ parts

$3.945

10k+ parts

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604

$3.420

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$3.945

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DigiPath Technology Company

USA . 1,600 parts In-Stock

1+ parts

$3.766

100+ parts

$3.465

1k+ parts

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1,600

$3.766

$3.465

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ChromeModa Solutions

Germany . 1,361 parts In-Stock

1+ parts

$3.843

100+ parts

$3.151

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1,361

$3.843

$3.151

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IDEA Electronic Components Group

UK . 658 parts In-Stock

1+ parts

$3.843

100+ parts

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$3.459

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658

$3.843

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$3.459

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AZTECH Wire

Italy . 649 parts In-Stock

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$13.926

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649

$13.926

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One Stop Electronics

USA . 891 parts In-Stock

1+ parts

$15.000

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891

$15.000

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Corphita

USA . 639 parts In-Stock

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639

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Overview

Discover the innovative SN74AS871DW by Texas Instruments, a high-quality memory IC designed to meet your electronic needs. With Texas Instruments' reputation for excellence in manufacturing, this product offers unmatched reliability and performance. Ideal for a wide range of applications, this small outline package with dual terminal position provides convenience and flexibility. Experience the value and benefits of this commercial-grade technology, ensuring optimal performance in any environment. Trust Texas Instruments to deliver cutting-edge solutions for all your electronic projects with the SN74AS871DW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, ensuring long-lasting performance.

Surface Mount: YES

Surface mount technology allows for easy installation and soldering onto circuit boards, saving time and space.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and makes it easier to integrate into various electronic devices.

No. of Terminals: 28

Having 28 terminals allows for more connections and flexibility in the product's functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in saving space on the circuit board and makes the product suitable for compact devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high-temperature environments without compromising performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the product can function effectively in a wide range of temperature conditions.

Terminal Position: DUAL

Dual terminal position provides additional stability and reliability in connections, reducing the risk of signal interference or loss.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliability and consistency in performance for commercial applications.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making the product suitable for high-speed digital applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and makes soldering easier, enhancing the overall durability of the product.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product offers precise and reliable connections, ensuring optimal performance in electronic circuits.

Technical Specifications

Other Function Memory ICs SN74AS871DW attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS871DW Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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