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SMC512AFB6E

STMicroelectronics

SMC512AFB6E by STMicroelectronics

SMC512AFB6E by STMicroelectronics is an industrial-grade, asynchronous memory IC with a density of 4 Gb and operates b/w -40 °C to 85 °C. It features a 512M x 8 organization in a no-lead package, ideal for space-constrained applications. This CMOS technology ensures reliable performance in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 21,400 parts In-Stock

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21,400

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Vyrian

USA . 4,194 parts In-Stock

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4,194

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Digiode

USA . 3,549 parts In-Stock

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3,549

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Anansix

USA . 2,688 parts In-Stock

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2,688

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ComSIT Distribution GmbH

Germany . 15 parts In-Stock

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15

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Prism Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 300 parts In-Stock

1+ parts

$2.610

100+ parts

$2.610

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$2.610

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300

$2.610

$2.610

$2.610

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IDEA Electronic Components Group

UK . 1,486 parts In-Stock

1+ parts

$4.992

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$4.493

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1,486

$4.992

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$4.493

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MKK Technologies

India . 253 parts In-Stock

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$9.387

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253

$9.387

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DigiPath Technology Company

USA . 253 parts In-Stock

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$9.387

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253

$9.387

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AZTECH Wire

Italy . 1,178 parts In-Stock

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$13.360

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1,178

$13.360

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Component Stockers USA

USA . 485 parts In-Stock

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$99.990

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485

$99.990

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Parana Technologies

USA . 697 parts In-Stock

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$5.969

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697

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Corphita

USA . 105 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Unlock unparalleled performance with the SMC512AFB6E from STMicroelectronics, a trusted leader in innovative semiconductor solutions. Designed for demanding industrial applications, this high-density memory IC ensures reliability and efficiency in extreme temperatures. Its asynchronous operation and compact no-lead package make it ideal for space-constrained environments. Elevate your projects with this cutting-edge technology that enhances data handling and boosts overall system performance.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration onto PCBs, saving space and enabling high-density applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides flexibility in timing, making it suitable for various systems without demanding synchronous clock signals.

Package Style (Meter): UNCASED CHIP

The unencased chip form factor is ideal for custom designs and environments where weight and space are constraints.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this memory IC is reliable for applications in moderately hot environments.

Organization: 512MX8

The 512MX8 organization implies efficient data handling and storage in an 8-bit width, suitable for various applications requiring large capacities.

Minimum Operating Temperature: -40 °C

The capability to operate at a minimum temperature of -40 °C enhances the IC's reliability and suitability for harsh environments, including industrial applications.

Terminal Position: UPPER

Upper terminal positioning offers easy access for connections in mounting configurations, simplifying assembly and integration.

Temperature Grade: INDUSTRIAL

The industrial temperature grade confirms the IC's robustness, making it ideal for demanding environments with extreme temperature fluctuations.

Technology: CMOS

CMOS technology provides low power consumption and high efficiency, making this memory IC suitable for battery-operated devices and power-sensitive applications.

Terminal Form: NO LEAD

The no-lead terminal form minimizes the footprint and allows for a more environmentally friendly design, reducing the overall material usage.

No. of Words: 536870912 words

With 536,870,912 words, this memory IC offers substantial capacity, supporting data-intensive applications without compromising performance.

Memory Width: 8

An 8-bit memory width aligns well with most microcontroller architectures, ensuring effective data processing and transfer.

No. of Words Code: 512M

The 512M word code confirms a large data storage capacity, suitable for applications requiring significant memory resources.

Memory Density: 4294967296 bit

The memory density of 4294967296 bits indicates a high storage capacity, advantageous for applications that require extensive data retention.

Memory IC Type: MEMORY CIRCUIT

Classified as a memory circuit, this product is specifically designed for effective data storing solutions in various electronic devices.

Technical Specifications

Other Function Memory ICs SMC512AFB6E attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

4294967296 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Words:

536870912 words

No. of Words Code:

512M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512MX8

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

SMC512AFB6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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