Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
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Other Function Memory ICs THGBMHG9C4LBAIR attributes and parameters. Explore more Other Function Memory ICs devices from Toshiba
JESD-30 Code:
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Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
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THGBMHG9C4LBAIR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
LL4148
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
1N4148
Panjit International
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
2N2222A
Boca Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
SMBJ18CA
Db Lectro
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW06030000Z0EAHP
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
LM358M
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Cheng-yi Electronic
Formosa Microsemi
BAV99-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NC7WZ07P6X
The Onsemi NC7WZ07P6X is a logic gate with 2 functions, featuring a propagation delay of 4.8 ns at 1.8V supply voltage. With open-drain output characteristics, it operates in industrial temperatures from -40 to 85°C. Ideal for applications requiring fast signal processing and low power consumption in compact designs.
SN54AS8834GB
SN54AS8834GB by Texas Instruments is a 64x40 memory circuit IC with 2560-bit memory density. Operating at 5V, it features synchronous mode and MILITARY temperature grade. Its square GRID ARRAY package suits applications requiring high-performance memory in harsh environments.
DS1207-G03
Analog Devices
DS1207-G03 by Analog Devices is a CMOS MEMORY CIRCUIT with 5 terminals. It operates SYNCHRONOUSLY at temperatures ranging from 0 °C to 70°C. This IC is used in applications requiring Other Function Memory ICs, featuring a RECTANGULAR package shape for commercial-grade temperature environments.
TC528257J-70
Toshiba
Toshiba TC528257J-70 is a 256Kx8 VIDEO DRAM IC with 2097152-bit memory density. Operating at 5V, it has a max access time of 70ns and consumes up to 160mA. Ideal for applications requiring high-speed video data processing in commercial temperature environments.
DS2502X1+U
Maxim Integrated
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 4; Qualification: Not Qualified; No. of Words: 128 words; Moisture Sensitivity Level (MSL): 1;
M36LLR8860B1ZAQ
STMicroelectronics
M36LLR8860B1ZAQ by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of FLASH+PSRAM with a supply voltage range of 1.7-1.95V. It operates b/w -25 °C and 85 °C, making it ideal for compact electronic applications. With an 88-terminal grid array design, it ensures efficient space utilization in devices.
TMS4C1050-40SD
TMS4C1050-40SD by Texas Instruments is a 20-terminal MEMORY CIRCUIT IC with 5V supply, 30ns access time, and 45mA max supply current. It operates b/w 0-70°C in commercial grade applications requiring reliable memory storage solutions.
TMS27C64-45
Other Memory ICs;
DS2401P+T&R-C01
MEMORY CIRCUIT;
TMS27PC32-120NE
M36W216B100ZA6T
M36W216B100ZA6T from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal voltage. It features 1M x 16 organization and operates in temperatures ranging from -40 °C to 85 °C. Ideal for industrial applications, it offers high-density storage in a compact package.
SN74ACT2151-25FN
SN74ACT2151-25FN by Texas Instruments is a 1Kx12 MEMORY CIRCUIT IC with 25ns access time, suitable for commercial applications. It operates at 5V, has 28 terminals in a square chip carrier package, and uses CMOS technology. With a memory density of 12288 bits and operating temperature range of 0 to 70°C, it offers high performance in various electronic systems.
TMS4C1070-60SD
TMS4C1070-60SD by Texas Instruments is a 20-terminal memory IC with 5V supply voltage. It operates b/w 0 to 70°C, consuming a max of 35mA current. Ideal for commercial applications requiring fast access time of 50ns in a rectangular plastic package.
TMS27C32-10NE4
MR2A16ACYS35R
Everspin Technologies
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Organization: 256KX16;
DS2411P+T&R
Analog Devices' DS2411P+T&R is a 64-bit memory circuit IC with 64x1 organization. Operating in asynchronous mode, it has a supply voltage range of 1.5V to 5.25V and operates in industrial temperature grades. This small outline package IC is suitable for applications requiring low standby current and compact design.
M36P0R9070E0ZACE
M36P0R9070E0ZACE by STMicroelectronics is a versatile memory IC featuring 32M words of mixed FLASH+PSRAM, operating at 1.8V with a max access time of 70ns. Its compact design (11x8mm) and asynchronous mode make it ideal for space-constrained applications. It operates in extreme temperatures from -30 °C to 85°C, ensuring reliability in various environments.
TMX27C512-30
TMS27PC49-5JL
TMS27P32A30
TMS4C1050-60N
TMS4C1050-60N by Texas Instruments is a 16-terminal MEMORY CIRCUIT IC with 5V supply, 50ns access time, and 35mA max supply current. It operates b/w 0-70°C in COMMERCIAL grade applications. Ideal for systems requiring fast memory access and low standby current consumption.
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THGBMDG5D1LBAIT
The Toshiba THGBMDG5D1LBAIT is a 4GX8 memory IC with 34359738368-bit density and CMOS technology. It features a rectangular GRID ARRAY package with 153 terminals, suitable for applications requiring high memory capacity and efficient data processing in devices operating b/w -25°C to 85°C.
THGBMGT0U8LBAIG
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
THGBMHG7C2LBAAR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Terminal Position: BOTTOM;
THGBMHG8C4LBAU7
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
THGBMHG6C1LBAWL
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
THGBMHG9C8LBAAG
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY; Package Body Material: PLASTIC/EPOXY;
THGBM3G5D1FBAIE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: TFBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
THGBMHG6C1LBAAL
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words Code: 8G; Screening Level: AEC-Q100;
THGBMHG7C2LBAU7
THGBMHG7C2LBAWR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;
THGBMHG8C4LBAAR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words Code: 32G; Operating Mode: ASYNCHRONOUS;
THGBMHG6C1LBAU6
THGBMHG8C4LBAWR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Surface Mount: YES;
THGBMGG9U4LBAIR
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
THGBMHG7C1LBAIL
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
THGBM3G4D1FBAIG
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH;
THGBMHG8C2LBAIL
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Memory Width: 8;
THGBMHG6C1LBAIL
THGBMHG8C2LBAILH40
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
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