Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Toshiba THGBMDG5D1LBAIT is a 4GX8 memory IC with 34359738368-bit density and CMOS technology. It features a rectangular GRID ARRAY package with 153 terminals, suitable for applications requiring high memory capacity and efficient data processing in devices operating b/w -25°C to 85°C.
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This material is durable and cost-effective, making it a practical choice for electronic components.
This feature allows for easy and secure installation on PCBs, saving time and effort during assembly.
The rectangular shape maximizes space efficiency, making it suitable for compact devices and crowded PCBs.
With a high number of terminals, this memory IC can handle complex data processing tasks efficiently.
The grid array style offers excellent thermal performance and signal integrity, ensuring reliable operation.
This high maximum operating temperature range allows for reliable performance in various environmental conditions.
The organization of 4GX8 indicates a high level of data organization and storage capacity, suitable for demanding applications.
The wide temperature range ensures reliable operation even in harsh environmental conditions.
The bottom terminal position simplifies PCB design and assembly, facilitating a more efficient manufacturing process.
CMOS technology offers low power consumption, making this memory IC an energy-efficient choice.
The ball terminal form provides a reliable electrical connection and is suitable for high-density PCB designs.
The high number of words signifies a large storage capacity, suitable for data-intensive applications.
The memory width of 8 bits enables the processing of data in larger chunks, improving efficiency and speed.
The 4G code indicates a large storage capacity, making this memory IC suitable for handling extensive data sets.
The high memory density allows for storing a significant amount of data in a compact form factor, ideal for space-constrained applications.
This memory circuit type ensures reliable data storage and retrieval, making it a dependable choice for various electronic devices.
Other Function Memory ICs THGBMDG5D1LBAIT attributes and parameters. Explore more Other Function Memory ICs devices from Toshiba
JESD-30 Code:
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THGBMDG5D1LBAIT Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.
M39029/56-351
Amphenol
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Additional Features: STANDARD: MIL-DTL-38999; Contact Gender: FEMALE; MIL-Connector Accessory Name: CONTACT; Associated Military - Specifications: MIL-DTL-38999;
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
MC7805CTG
Onsemi
MC7805CTG by Onsemi is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation. The package style is flange mount with through-hole terminals, ensuring easy installation and reliability in diverse electronic designs.
STM32H753BIT6
STMicroelectronics
STM32H753BIT6 by STMicroelectronics is a 32-bit microcontroller with 208 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and extensive peripherals for industrial applications like CAN, Ethernet, and USB connectivity. With a wide temperature range of -40 to +85 °C, it's ideal for demanding environments requiring high-speed processing capabilities.
NE555D
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
Frontier Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
1N4148WT
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
LM7805CT
Fairchild Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
LL4148
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Toshiba
Central Semiconductor
Sangdest Microelectronics (Nanjing)
2N2222A
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
BAV99
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
47L04-E/ST
Microchip Technology
47L04-E/ST by Microchip Technology is a small outline, thin profile memory IC with 512x8 organization. It operates synchronously and combines EEPROM with SRAM technology. Ideal for automotive applications, it has a temperature range of -40 to 125°C and requires a supply voltage b/w 2.7V to 3.6V.
MR2A16ACYS35
Freescale Semiconductor
MR2A16ACYS35 by Freescale Semiconductor is a 256Kx16 memory IC with 3.3V supply, operating in industrial temperature range of -40 to 85°C. It features asynchronous mode, 35ns access time, and GULL WING terminals. Ideal for applications requiring high-speed memory operations in compact electronic devices.
DS2411X
Dallas Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 4; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words: 64 words;
DS2422P/T&R
Analog Devices
DS2422P/T&R by Analog Devices is a 1KX1 MEMORY CIRCUIT with 1024 bit Memory Density. It operates in ASYNCHRONOUS mode at 5V, suitable for INDUSTRIAL applications. This SMALL OUTLINE IC has PLASTIC/EPOXY body, DUAL terminals, and can function b/w -40 to 85 °C.
TMS44C250-10SD
Texas Instruments
TMS44C250-10SD by Texas Instruments is a 256KX4 MEMORY CIRCUIT IC with 1048576 bit Memory Density. It operates at 5V, has 100 ns Max Access Time, and consumes up to 110 mA. Ideal for applications requiring fast data access in commercial temperature environments.
DS1963S-F5+
MEMORY CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MR2A16AMYS35R
Everspin Technologies
MR2A16AMYS35R by Everspin Technologies is a 256Kx16 memory IC with CMOS technology. Operating at 3.3V, it has a temperature range of -40 to 125°C and is AEC-Q100 compliant for automotive applications. This small outline, thin profile package with 44 terminals is ideal for high-performance asynchronous memory needs in automotive electronics.
MB85RS256BPNF-G-JNE1
Fujitsu
Fujitsu's MB85RS256BPNF-G-JNE1 is a 262Kb memory IC with 32Kx8 organization, operating at 3.3V. It features synchronous operation, industrial temperature grade, and small outline package suitable for various applications requiring reliable non-volatile memory storage.
DS2401AZ+
MEMORY CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
M36W216TI70ZA1T
M36W216TI70ZA1T from STMicroelectronics is a low-profile, asynchronous memory IC featuring 16Mbit density with FLASH+SRAM technology. It operates at 3V and supports a max access time of 70ns. Ideal for commercial applications requiring efficient data storage and retrieval.
TMS44C251-10DJ
TMS44C251-10DJ by Texas Instruments is a 256KX4 memory IC with 262144 words, 1048576 bit memory density, and 100 ns max access time. It operates at a nominal voltage of 5V and is suitable for commercial applications requiring small outline package style and dual terminal position.
DS2411R/TR
DS2411R/TR by Dallas Semiconductor is a 3-terminal memory IC with plastic/epoxy package. It operates in industrial temperature range (-40 to 85°C) and requires 2/5V power supply. Ideal for applications requiring low standby current (0.000001A) and minimal supply current (0.1mA).
SN74170N3
SN74170N3 by Texas Instruments is a TTL technology IC with 16 terminals, operating at 5V. It has a rectangular package shape made of plastic/epoxy material. Ideal for commercial applications, it operates b/w 0°C to 70°C and features through-hole terminals with a pitch of 2.54mm.
TMX27PC256N25
Other Memory ICs;
MR2A16AYS35
MR2A16AYS35 by Freescale Semiconductor is a 256KX16 MEMORY CIRCUIT with 4194304 bit Memory Density. Operating at 3.3V, it has an Access Time of 35ns and supports ASYNCHRONOUS mode. This PLASTIC/EPOXY IC in SMALL OUTLINE, THIN PROFILE package is ideal for applications requiring high-speed memory access in commercial temperature environments.
TMS27C32-120NL
TMS27PC49-4TL
FM25L256-GC
Infineon Technologies
MT43A4G40200NFA-S15:A
Micron Technology
Micron Technology's MT43A4G40200NFA-S15:A is a 4GX4 memory IC with 17179869184 bit density. Operating at 1.2V, it features synchronous mode and 896 terminals in a square GRID ARRAY package. Ideal for applications requiring high memory capacity and fast data processing in electronic devices.
NMB1XXD128GPSU4
Intel
The Intel NMB1XXD128GPSU4 is a CMOS memory circuit with 128GX8 organization, offering 1099511627776 bit memory density. With a rectangular package shape and dual terminal position, it operates b/w 0-85 °C, suitable for high-density memory applications.
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THGBMGT0U8LBAIG
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
THGBMHG9C4LBAIR
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
THGBMHG7C2LBAAR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Terminal Position: BOTTOM;
THGBMHG8C4LBAU7
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
THGBMHG6C1LBAWL
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
THGBMHG9C8LBAAG
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY; Package Body Material: PLASTIC/EPOXY;
THGBM3G5D1FBAIE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: TFBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
THGBMHG6C1LBAAL
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words Code: 8G; Screening Level: AEC-Q100;
THGBMHG7C2LBAU7
THGBMHG7C2LBAWR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;
THGBMHG8C4LBAAR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words Code: 32G; Operating Mode: ASYNCHRONOUS;
THGBMHG6C1LBAU6
THGBMHG8C4LBAWR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Surface Mount: YES;
THGBMGG9U4LBAIR
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
THGBMHG7C1LBAIL
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
THGBM3G4D1FBAIG
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH;
THGBMHG8C2LBAIL
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Memory Width: 8;
THGBMHG6C1LBAIL
THGBMHG8C2LBAILH40
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
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