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SN74HC670JP4

Texas Instruments

SN74HC670JP4 by Texas Instruments

SN74HC670JP4 by Texas Instruments is a CMOS memory IC with 16 terminals in an IN-LINE package. It operates b/w -40°C to 85°C, suitable for industrial applications. With power supplies ranging from 2V to 6V, it offers reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,173 parts In-Stock

1+ parts

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2,173

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Digiode

USA . 1,025 parts In-Stock

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1,025

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,801 parts In-Stock

1+ parts

$3.103

100+ parts

-

1k+ parts

$3.621

10k+ parts

-

1,801

$3.103

-

$3.621

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DigiPath Technology Company

USA . 1,334 parts In-Stock

1+ parts

$3.416

100+ parts

$3.143

1k+ parts

-

10k+ parts

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1,334

$3.416

$3.143

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ChromeModa Solutions

Germany . 6,540 parts In-Stock

1+ parts

$3.486

100+ parts

$2.859

1k+ parts

-

10k+ parts

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6,540

$3.486

$2.859

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IDEA Electronic Components Group

UK . 1,462 parts In-Stock

1+ parts

$3.486

100+ parts

-

1k+ parts

$3.137

10k+ parts

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1,462

$3.486

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$3.137

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One Stop Electronics

USA . 296 parts In-Stock

1+ parts

$4.000

100+ parts

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296

$4.000

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AZTECH Wire

Italy . 650 parts In-Stock

1+ parts

$15.324

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650

$15.324

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Corphita

USA . 104 parts In-Stock

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104

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Overview

Elevate your electronic projects with the SN74HC670JP4 by Texas Instruments. Known for their top-tier quality and innovation, Texas Instruments delivers excellence in the category of Other Function Memory ICs. This versatile component offers unmatched reliability and performance, making it ideal for a wide range of applications. Whether you're creating cutting-edge technology or simply looking to enhance existing systems, this product provides exceptional value, benefits, and advantages. Trust Texas Instruments to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent heat dissipation and electrical insulation, ensuring the reliability and longevity of the memory IC.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on circuit boards, optimizing space and providing easy integration into various electronic devices.

Power Supplies (V): 2/6

Support for a wide range of power supplies (2-6V) ensures compatibility with different systems and applications, adding flexibility to the product's usage.

No. of Terminals: 16

With 16 terminals, this memory IC offers a good level of connectivity and functionality, allowing for data transfer and communication with other components.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C ensures that the memory IC can withstand demanding industrial conditions without compromising performance.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this memory IC is suitable for use in extreme cold environments, making it versatile for various applications.

Technology: CMOS

CMOS technology in this memory IC offers low power consumption and high speed performance, making it energy-efficient and reliable for data processing tasks.

Technical Specifications

Other Function Memory ICs SN74HC670JP4 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC670JP4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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