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ST25TA64K-AB6G3

STMicroelectronics

ST25TA64K-AB6G3 by STMicroelectronics

ST25TA64K-AB6G3 from STMicroelectronics is a CMOS memory IC with 8K x 8 organization, operating b/w -40 °C to 85 °C. This surface-mount, no-lead chip is ideal for industrial applications requiring reliable asynchronous data storage. With a density of 65536 bits, it ensures efficient performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,786 parts In-Stock

1+ parts

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7,786

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Digiode

USA . 2,565 parts In-Stock

1+ parts

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2,565

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Anansix

USA . 2,556 parts In-Stock

1+ parts

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2,556

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 870 parts In-Stock

1+ parts

$4.890

100+ parts

-

1k+ parts

$4.401

10k+ parts

-

870

$4.890

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$4.401

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MKK Technologies

India . 1,625 parts In-Stock

1+ parts

$9.195

100+ parts

-

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-

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1,625

$9.195

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DigiPath Technology Company

USA . 1,625 parts In-Stock

1+ parts

$9.195

100+ parts

-

1k+ parts

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10k+ parts

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1,625

$9.195

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AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$15.610

100+ parts

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570

$15.610

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Corphita

USA . 4,683 parts In-Stock

1+ parts

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4,683

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Parana Technologies

USA . 1,794 parts In-Stock

1+ parts

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100+ parts

$5.846

1k+ parts

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1,794

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$5.846

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Overview

Unlock unparalleled performance with the ST25TA64K-AB6G3 from STMicroelectronics. Renowned for quality and innovation, STMicroelectronics brings you a versatile memory solution designed for industrial applications. This compact, surface-mount IC ensures reliability in extreme temperatures, making it ideal for automotive, IoT, and consumer electronics. Elevate your designs with enhanced efficiency and stability—experience the advantages of cutting-edge technology tailored to meet your needs.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability enables easy integration onto PCBs, allowing for reduced assembly time and electrical performance improvement.

Package Shape: ROUND

The round package shape can be beneficial for space-constrained applications, making it suitable for compact electronic devices.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for improved system performance as it doesn't require a clock signal, offering quicker response times.

Package Style (Meter): UNCASED CHIP

The uncased chip style can contribute to lower costs and more design flexibility in custom applications.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C makes this memory IC suitable for a variety of industrial environments, ensuring reliability.

Organization: 8KX8

The 8Kx8 organization offers a good balance of memory depth and width, making it suitable for various applications needing moderate data storage.

Minimum Operating Temperature: -40 °C

With a minimum temperature rating of -40 °C, this product can operate effectively in harsh environments, increasing its versatility.

Terminal Position: UPPER

Upper terminal positioning allows for more efficient integration in designs where vertical space is a constraint.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures this memory IC can withstand challenging conditions, making it ideal for industrial applications.

Technology: CMOS

CMOS technology provides low power consumption and high density, making this memory IC energy-efficient and suitable for battery-operated devices.

Terminal Form: NO LEAD

No lead terminal form contributes to a smaller footprint on PCBs, enhancing design flexibility and reducing weight.

No. of Words: 8192 words

With 8192 words, this memory IC offers ample data storage, supporting a variety of applications ranging from consumer electronics to industrial devices.

Memory Width: 8

An 8-bit memory width allows the IC to handle a byte of data per access, which is sufficient for many applications requiring moderate data throughput.

No. of Words Code: 8K

The 8K word count denotes adequate capacity for a multitude of projects, from embedded systems to data logging devices.

Memory Density: 65536 bit

A memory density of 65536 bits indicates a solid storage capability that can meet the needs of various digital applications.

Memory IC Type: MEMORY CIRCUIT

Classified as a memory circuit, this product plays a pivotal role in storing data for computing applications, ensuring essential functionality.

Technical Specifications

Other Function Memory ICs ST25TA64K-AB6G3 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

O-XUUC-N

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

ST25TA64K-AB6G3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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