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ST25TA02KD-C6H5

STMicroelectronics

ST25TA02KD-C6H5 by STMicroelectronics

ST25TA02KD-C6H5 from STMicroelectronics is a CMOS memory IC with 256x8 organization, operating b/w -40 °C to 85 °C. It features a compact chip carrier design and asynchronous mode for efficient data access. Ideal for industrial applications requiring reliable non-volatile storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,613 parts In-Stock

1+ parts

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3,613

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Digiode

USA . 1,239 parts In-Stock

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1,239

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Anansix

USA . 392 parts In-Stock

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392

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 277 parts In-Stock

1+ parts

$3.901

100+ parts

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1k+ parts

$3.511

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277

$3.901

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$3.511

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MKK Technologies

India . 1,789 parts In-Stock

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$7.335

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1,789

$7.335

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DigiPath Technology Company

USA . 1,789 parts In-Stock

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$7.335

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1,789

$7.335

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AZTECH Wire

Italy . 613 parts In-Stock

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$12.010

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613

$12.010

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Corphita

USA . 4,349 parts In-Stock

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4,349

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Parana Technologies

USA . 1,774 parts In-Stock

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$4.664

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1,774

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$4.664

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Overview

Unlock the potential of your applications with the ST25TA02KD-C6H5 from STMicroelectronics, a leader in innovative technology. This compact, high-quality memory IC is designed for rugged environments, ensuring reliability from -40 °C to 85 °C. Its asynchronous operation and space-saving design make it perfect for industrial and consumer electronics alike. Experience superior performance and durability, empowering your projects with seamless data management and enhanced efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures that the memory IC is protected from environmental factors, enhancing reliability.

Surface Mount: YES

Surface mount technology allows for smaller designs and increased ease of assembly, making it ideal for compact applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, facilitating better layout options.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for simpler control signals, making the integration easier in various applications.

No. of Terminals: 5

With only 5 terminals, this IC minimizes the complexity of connections required, simplifying circuit design.

Package Style (Meter): CHIP CARRIER

The chip carrier style offers a quick and easy mounting solution, enhancing the assembly process.

Maximum Operating Temperature: 85 °C

Rated for a maximum temperature of 85 °C, this IC is suitable for industrial applications with moderate thermal requirements.

Organization: 256X8

This memory organization provides a good balance of data access speed and memory size, suitable for various applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliability in extreme environments, making it ideal for industrial applications.

Terminal Position: BOTTOM

Bottom terminal positioning allows for better heat dissipation and easier PCB layout for better space management.

Maximum Seated Height: 0.6 mm

A low seated height allows for compact designs, making it a perfect fit for space-constrained applications.

Width: 1.4 mm

The narrow width aids in fitting the IC into tight spaces on printed circuit boards, enhancing design flexibility.

Length: 1.7 mm

The length is optimized for dense circuit layouts, allowing for more efficient use of board space.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this memory IC is engineered to withstand demanding conditions for long-lasting performance.

Technology: CMOS

CMOS technology offers lower power consumption, making this IC suitable for battery-operated devices and energy-efficient designs.

Terminal Form: NO LEAD

No lead design provides a lower profile and higher durability, reducing the risk of damage during mounting.

No. of Words: 256 words

With 256 words, this memory capacity is suitable for a variety of applications that require moderate data storage.

Memory Width: 8

An 8-bit memory width allows for efficient data handling, making it compatible with popular microcontroller architectures.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch supports densely packed PCB designs, vital for modern electronics.

No. of Words Code: 256

This attribute ensures there is a sufficient number of addressable words, suitable for applications requiring straightforward data access.

Memory Density: 2048 bit

With a density of 2048 bits, this memory IC provides a compact storage solution that is efficient for many embedded applications.

Memory IC Type: MEMORY CIRCUIT

As a memory circuit, this product is versatile and indispensable in both consumer and industrial electronics.

Technical Specifications

Other Function Memory ICs ST25TA02KD-C6H5 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-N5

Length:

1.7 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

5

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.6 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.4 mm

Trade Compliance

ST25TA02KD-C6H5 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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