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ST25TA16KAB6G3

STMicroelectronics

ST25TA16KAB6G3 by STMicroelectronics

ST25TA16KAB6G3 from STMicroelectronics is an industrial-grade memory IC with a density of 65536 bits and operates asynchronously. It features a wide temperature range from -40 °C to 85 °C, making it ideal for harsh environments. This surface-mount, no-lead chip is perfect for various applications in electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,476 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,476

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Digiode

USA . 2,916 parts In-Stock

1+ parts

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2,916

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Anansix

USA . 2,784 parts In-Stock

1+ parts

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2,784

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,595 parts In-Stock

1+ parts

$4.445

100+ parts

-

1k+ parts

$4.000

10k+ parts

-

1,595

$4.445

-

$4.000

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MKK Technologies

India . 2,368 parts In-Stock

1+ parts

$8.358

100+ parts

-

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-

10k+ parts

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2,368

$8.358

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DigiPath Technology Company

USA . 2,368 parts In-Stock

1+ parts

$8.358

100+ parts

-

1k+ parts

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10k+ parts

-

2,368

$8.358

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AZTECH Wire

Italy . 88 parts In-Stock

1+ parts

$15.690

100+ parts

-

1k+ parts

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10k+ parts

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88

$15.690

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-

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Corphita

USA . 1,160 parts In-Stock

1+ parts

-

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1,160

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Parana Technologies

USA . 198 parts In-Stock

1+ parts

-

100+ parts

$5.314

1k+ parts

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10k+ parts

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198

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$5.314

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Overview

Unlock unparalleled performance and reliability with the ST25TA16KAB6G3 memory IC from STMicroelectronics. Renowned for their cutting-edge technology, STMicroelectronics ensures that this industrial-grade memory component thrives in extreme conditions, making it ideal for diverse applications—from automotive systems to smart appliances. Experience enhanced efficiency, robust data management, and seamless integration, empowering your designs with superior quality and longevity.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design enables efficient use of PCB space, allowing for more compact and versatile circuit designs.

Package Shape: ROUND

The round package shape can provide better thermal management and fitting in various device designs compared to traditional shapes.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for simple interfacing and integration into systems where timing flexibility is required.

Package Style (Meter): UNCASED CHIP

The uncased chip style allows for custom packaging options, optimizing integration into a variety of applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in various environments, making it suitable for industrial applications.

Organization: 8KX8

An 8Kx8 organization provides a large enough capacity for a wide range of applications, catering to diverse memory needs.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this memory IC can function effectively in extreme environments, enhancing its applicability in rugged conditions.

Terminal Position: UPPER

The upper terminal position facilitates easier access for soldering and enhances connectivity in compact designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures robust performance and reliability in demanding environments, ideal for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making this memory IC energy-efficient for battery-powered devices.

Terminal Form: NO LEAD

No lead termination allows for a more compact design and reduction in the overall footprint, benefiting space-constrained applications.

No. of Words: 8192 words

Offering 8192 words of memory gives sufficient space for data storage and processing in various devices and applications.

Memory Width: 8

An 8-bit memory width supports efficient data processing, making it suitable for applications requiring standard data sizes.

No. of Words Code: 8K

This capability indicates a good balance of memory storage suitable for a wide variety of applications.

Memory Density: 65536 bit

A memory density of 65536 bits implies substantial data storage capacity in a compact form, beneficial for densely packed circuits.

Memory IC Type: MEMORY CIRCUIT

Being classified as a memory circuit confirms its core functionality, ensuring it meets essential data storage needs.

Technical Specifications

Other Function Memory ICs ST25TA16KAB6G3 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

O-XUUC-N

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

ST25TA16KAB6G3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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