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ST25TA512-AC6B5

STMicroelectronics

ST25TA512-AC6B5 by STMicroelectronics

ST25TA512-AC6B5 from STMicroelectronics is a CMOS memory IC with a density of 512 bits, organized as 64x8. It operates asynchronously and supports temperatures from -40 °C to 85 °C. Ideal for industrial applications, it features a no-lead design for efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,916 parts In-Stock

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3,916

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Digiode

USA . 1,990 parts In-Stock

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1,990

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Anansix

USA . 208 parts In-Stock

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208

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,308 parts In-Stock

1+ parts

$2.314

100+ parts

-

1k+ parts

$2.082

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2,308

$2.314

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$2.082

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MKK Technologies

India . 1,210 parts In-Stock

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$4.351

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$4.351

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DigiPath Technology Company

USA . 1,210 parts In-Stock

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$4.351

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1,210

$4.351

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AZTECH Wire

Italy . 222 parts In-Stock

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$19.060

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222

$19.060

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QUARKTWIN TECHNOLOGY LTD

USA . 10,489 parts In-Stock

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10,489

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Corphita

USA . 3,981 parts In-Stock

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Parana Technologies

USA . 2,105 parts In-Stock

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$2.766

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2,105

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$2.766

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Overview

Unlock the power of innovation with the ST25TA512-AC6B5 from STMicroelectronics! Renowned for its exceptional quality and reliability, this versatile memory IC is perfect for a wide range of industrial applications. With its robust temperature range, it ensures optimal performance in demanding environments. Experience seamless integration and enhanced efficiency, making it an ideal choice for developers seeking top-tier solutions that deliver outstanding value and performance.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact layout and ease of integration into modern electronic systems.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables faster access times, enhancing the overall performance of data processing applications.

Package Style: UNCASED CHIP

The unencased chip format provides flexibility for customized applications and optimizes space utilization on printed circuit boards.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures reliability in a range of environments, making it suitable for various industrial applications.

Organization: 64X8

The 64X8 organization allows for efficient data organization and retrieval, ideal for applications requiring compact data storage solutions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is capable of functioning in extreme environmental conditions, enhancing its usability in harsh settings.

Terminal Position: UPPER

Upper terminal positioning facilitates easier connections and integration into various circuit designs.

Temperature Grade: INDUSTRIAL

Classified as industrial grade, this memory IC is designed for durability and reliability in long-term and challenging applications.

Technology: CMOS

CMOS technology provides low power consumption, ensuring energy efficiency and extended battery life in portable applications.

Terminal Form: NO LEAD

No lead terminals allow for a more compact design and reduce potential lead-related issues during manufacturing and assembly.

No. of Words: 64 words

The capability to store 64 words makes this IC suitable for small to medium data applications where memory space is at a premium.

Memory Width: 8

An 8-bit memory width provides adequate data handling for many applications, allowing for compatibility with standard data architectures.

No. of Words Code: 64

The defined code of 64 words ensures consistency in data handling and ease of integration into existing systems.

Memory Density: 512 bit

A memory density of 512 bits supports efficient data storage while keeping the form factor small, making it ideal for space-constrained designs.

Memory IC Type: MEMORY CIRCUIT

Being a dedicated memory circuit ensures optimized performance for data storage tasks, critical for various electronic applications.

Technical Specifications

Other Function Memory ICs ST25TA512-AC6B5 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

512 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X8

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

ST25TA512-AC6B5 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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