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ST25TA02KD-C6C5

STMicroelectronics

ST25TA02KD-C6C5 by STMicroelectronics

ST25TA02KD-C6C5 from STMicroelectronics is a compact, dual-terminal memory IC with an industrial temperature range of -40 °C to 85 °C. It features asynchronous operation, 256x8 organization, and a very thin profile (0.6mm height). Ideal for space-constrained applications in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,367 parts In-Stock

1+ parts

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6,367

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Digiode

USA . 3,758 parts In-Stock

1+ parts

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3,758

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Anansix

USA . 1,372 parts In-Stock

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1,372

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 32 parts In-Stock

1+ parts

$3.907

100+ parts

-

1k+ parts

$3.517

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32

$3.907

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$3.517

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MKK Technologies

India . 2,146 parts In-Stock

1+ parts

$7.347

100+ parts

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2,146

$7.347

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DigiPath Technology Company

USA . 2,146 parts In-Stock

1+ parts

$7.347

100+ parts

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2,146

$7.347

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AZTECH Wire

Italy . 600 parts In-Stock

1+ parts

$13.090

100+ parts

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600

$13.090

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QUARKTWIN TECHNOLOGY LTD

USA . 12,429 parts In-Stock

1+ parts

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12,429

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Parana Technologies

USA . 1,679 parts In-Stock

1+ parts

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100+ parts

$4.672

1k+ parts

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1,679

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$4.672

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

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Corphita

USA . 158 parts In-Stock

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158

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Overview

Unlock new possibilities with the ST25TA02KD-C6C5 from STMicroelectronics, a leader in innovative memory solutions. This compact and reliable memory IC is designed for seamless integration in various applications, from industrial automation to consumer electronics. Experience superior performance in extreme temperatures and enjoy the ease of surface mount installation. Elevate your projects with a trusted product that ensures durability, efficiency, and exceptional value, all backed by ST's commitment to quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into modern circuit boards, saving space.

Package Shape: RECTANGULAR

Rectangular packaging provides efficient layout design and optimized use of PCB space.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for improved flexibility and performance in various applications.

No. of Terminals: 8

Eight terminals enable a wide range of connectivity options while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style is ideal for applications requiring efficient thermal management and compact design.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliability and performance in high-temperature environments, suitable for industrial use.

Organization: 256X8

This organization provides a good balance of storage capacity and data handling capabilities.

Minimum Operating Temperature: -40 °C

The capability to function in extreme cold environments enhances its versatility for various industrial applications.

Terminal Position: DUAL

Dual terminal position facilitates better integration and connection options within circuit designs.

Maximum Seated Height: 0.6 mm

A low seated height allows for stacking multiple components in tight spaces, optimizing the PCB layout.

Width: 2 mm

Compact width makes this IC well-suited for space-constrained applications.

Length: 3 mm

Short length contributes to the overall miniaturization of electronic assemblies.

Temperature Grade: INDUSTRIAL

Industrial-grade components are built for long-term reliability and performance in demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making it efficient for various applications.

Terminal Form: NO LEAD

No lead configuration improves environmental safety and allows for a more compact design.

No. of Words: 256 words

A capacity of 256 words provides significant data storage, meeting the needs for various applications.

Memory Width: 8

An 8-bit memory width aligns well with standard data processing needs in multiple applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables denser packaging and connection options, allowing for high-performance circuit designs.

No. of Words Code: 256

The data coding capability of 256 words supports efficient data handling and management.

Memory Density: 2048 bit

With a memory density of 2048 bits, this product offers substantial storage in a compact format.

Memory IC Type: MEMORY CIRCUIT

As a dedicated memory circuit, it is optimized for data storage and retrieval, essential for many electronic applications.

Technical Specifications

Other Function Memory ICs ST25TA02KD-C6C5 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-N8

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.6 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Trade Compliance

ST25TA02KD-C6C5 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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