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TNETV2685FIBZUTA7

Texas Instruments

TNETV2685FIBZUTA7 by Texas Instruments

TNETV2685FIBZUTA7 by Texas Instruments is a DSP with 32-bit external data bus, 720 MHz clock frequency, and industrial temperature grade. Ideal for digital signal processing applications requiring low power mode and fixed point format.

Median Price

$87.367

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 64 parts In-Stock

1+ parts

-

100+ parts

$87.367

1k+ parts

$78.460

10k+ parts

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64

-

$87.367

$78.460

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,039 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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7,039

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-

-

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Digiode

USA . 717 parts In-Stock

1+ parts

-

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1k+ parts

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717

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,339 parts In-Stock

1+ parts

$9.000

100+ parts

-

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1,339

$9.000

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AZTECH Wire

Italy . 703 parts In-Stock

1+ parts

$19.819

100+ parts

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703

$19.819

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Parana Technologies

USA . 1,903 parts In-Stock

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$52.587

100+ parts

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1,903

$52.587

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Corohmni

South Africa . 5,213 parts In-Stock

1+ parts

$56.994

100+ parts

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5,213

$56.994

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DigiPath Technology Company

USA . 725 parts In-Stock

1+ parts

$57.904

100+ parts

$53.272

1k+ parts

-

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725

$57.904

$53.272

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ChromeModa Solutions

Germany . 2,209 parts In-Stock

1+ parts

$59.086

100+ parts

$48.451

1k+ parts

-

10k+ parts

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2,209

$59.086

$48.451

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IDEA Electronic Components Group

UK . 815 parts In-Stock

1+ parts

$59.086

100+ parts

$56.132

1k+ parts

$53.177

10k+ parts

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815

$59.086

$56.132

$53.177

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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Corphita

USA . 3,429 parts In-Stock

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3,429

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Microchip USA

USA . 201 parts In-Stock

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201

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Overview

Experience unparalleled performance and reliability with the TNETV2685FIBZUTA7 by Texas Instruments, a cutting-edge Digital Signal Processor (DSP) designed to meet the demands of today's digital applications. As a leader in semiconductor manufacturing, Texas Instruments ensures top-notch quality and innovation in every product they produce. Ideal for a wide range of applications, this DSP offers customers unmatched value and benefits, from its high clock frequency of 720 MHz to its low power mode feature. Trust Texas Instruments to elevate your products to the next level of performance and efficiency with the TNETV2685FIBZUTA7.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product on circuit boards, saving time and costs in manufacturing.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage allows for flexibility in power requirements while ensuring reliable performance.

Address Bus Width: 14

The wide address bus width enables the processor to access a larger memory space, enhancing its capability to handle complex digital signal processing tasks.

Package Shape: SQUARE

The square shape of the package provides efficient use of space on circuit boards, allowing for compact designs in electronic devices.

No. of Terminals: 520

The large number of terminals enables the processor to interface with multiple external components and peripherals, expanding its functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style offers high density mounting capability, enabling efficient use of space and enhancing signal integrity.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and heat dissipation, making the product energy-efficient.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures the processor can perform reliably in harsh environmental conditions, increasing its versatility.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows the product to function in extreme cold environments, making it suitable for diverse applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability of the connections.

Terminal Position: BOTTOM

The bottom terminal position simplifies the assembly process and enhances heat dissipation, contributing to the overall performance of the product.

Maximum Seated Height: 3.3 mm

The low seated height allows for slim and compact designs, making the product suitable for space-constrained applications.

Width: 19 mm

The compact width of the product enables versatile placement on circuit boards, facilitating efficient integration into electronic systems.

Boundary Scan: YES

The boundary scan feature simplifies testing and diagnostics of the product during production, ensuring high quality and reliability.

External Data Bus Width: 32

The wide external data bus width enables fast data transfer and processing, enhancing the speed and efficiency of digital signal processing tasks.

Maximum Clock Frequency: 720 MHz

The high maximum clock frequency allows for rapid processing of signals, making the product suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes thermal stress on components during manufacturing, ensuring product reliability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature enables robust solder joints, enhancing the durability of the product in harsh operating conditions.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture supports parallel processing of data, improving throughput and efficiency in digital signal processing tasks.

Length: 19 mm

The compact length of the product allows for flexibility in board layout and design, optimizing space utilization in electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand rugged operating environments, increasing its reliability and longevity.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The incorporation of various peripheral IC types enhances the versatility and functionality of the product, enabling a wide range of applications.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, contributing to the efficiency and reliability of the product.

Terminal Form: BALL

The ball terminal form enables reliable connections and simplifies the soldering process, enhancing the overall manufacturability of the product.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage ensures consistent performance of the processor, contributing to reliable operation in various applications.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting, enabling compact designs and efficient use of space on circuit boards.

Format: FIXED POINT

The fixed-point format simplifies data representation and processing, making the product suitable for applications that require precision and accuracy.

Moisture Sensitivity Level (MSL): 4

The moderate moisture sensitivity level ensures the product can withstand typical exposure to humidity during storage and operation.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation, reducing power consumption and heat generation during idle or low-demand periods.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2685FIBZUTA7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

720 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B520

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

520

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TNETV2685FIBZUTA7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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