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TMX320C6457CMH2

Texas Instruments

TMX320C6457CMH2 by Texas Instruments

TMX320C6457CMH2 by Texas Instruments is a 32-bit DSP with 64-bit external data bus width, operating at a max clock frequency of 100 MHz. It features 8192 RAM words and supports low power mode, making it ideal for digital signal processing applications requiring high-speed performance in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,277 parts In-Stock

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Digiode

USA . 1,700 parts In-Stock

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1,700

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Distributors (Availability)

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AZTECH Wire

Italy . 572 parts In-Stock

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$10.587

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572

$10.587

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Corohmni

South Africa . 2,673 parts In-Stock

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$24.653

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2,673

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One Stop Electronics

USA . 1,201 parts In-Stock

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$31.000

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$31.000

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Parana Technologies

USA . 661 parts In-Stock

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$55.482

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661

$55.482

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ChromeModa Solutions

Germany . 6,252 parts In-Stock

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$62.339

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$51.118

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6,252

$62.339

$51.118

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IDEA Electronic Components Group

UK . 1,524 parts In-Stock

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$62.339

100+ parts

$59.222

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$56.105

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1,524

$62.339

$59.222

$56.105

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Corphita

USA . 2,248 parts In-Stock

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DigiPath Technology Company

USA . 330 parts In-Stock

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$56.205

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330

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$56.205

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Microchip USA

USA . 111 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMX320C6457CMH2 by Texas Instruments, a leading manufacturer renowned for its high-quality products. As a top player in the Digital Signal Processors category, this product offers unparalleled performance and versatility. Whether you're in the telecommunications, automotive, or consumer electronics industry, this DSP provides a wide range of benefits, including faster processing speeds, low power consumption, and seamless integration. Elevate your projects to new heights with the TMX320C6457CMH2 and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable makes the product easier to assemble on circuit boards, saving space and improving reliability.

Maximum Supply Voltage: 1.236 V

The product can operate efficiently within a higher voltage range, providing flexibility in power supply configurations.

Address Bus Width: 20

With a wide address bus, the product can handle large amounts of data efficiently, improving overall performance.

Package Shape: SQUARE

The square shape allows for easier integration into circuit designs, optimizing space usage.

Bit Size: 32

A 32-bit architecture allows for fast and efficient processing of data, making the product suitable for demanding applications.

Power Supplies (V): 1.2, 1.8, 3.3

With multiple voltage options, the product can be adapted to different power supply configurations for versatility in usage.

No. of Terminals: 688

The high number of terminals provides ample connectivity options, enabling the product to interface with various components seamlessly.

Package Style (Meter): GRID ARRAY

The grid array package style offers robust mechanical support and electrical connections, ensuring reliability in operation.

Minimum Supply Voltage: 1.164 V

The lower minimum supply voltage allows for energy-efficient operation, helping to reduce power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C6457CMH2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B688

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

688

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA688,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.236 V

Minimum Supply Voltage:

1.164 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMX320C6457CMH2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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