Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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SNJ54ACT3641HFP by Texas Instruments is a 1Kx36 CMOS FIFO memory IC with 20ns cycle time, operating at 5V. It features synchronous operation, MIL-PRF-38535 screening level, and a max clock frequency of 50MHz. Ideal for military-grade applications requiring high-speed data storage and retrieval in harsh environments.
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The ceramic and glass-sealed package body material ensures durability and reliable performance in various environmental conditions.
The fast cycle time of 20 ns allows for efficient data transfer and processing, making this FIFO product suitable for high-speed applications.
The synchronous operating mode ensures precise timing and synchronization, enhancing the overall performance of the product.
With a high memory density of 36864 bit, this FIFO product offers ample storage capacity for data storage and retrieval.
The maximum clock frequency of 50 MHz allows for rapid data transfer and efficient processing, making this product suitable for high-performance applications.
FIFO SNJ54ACT3641HFP attributes and parameters. Explore more FIFO devices from Texas Instruments
Maximum Access Time:
Maximum Clock Frequency (fCLK):
Cycle Time:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Power Supplies (V):
Qualification:
Screening Level:
Maximum Seated Height:
Sub-Category:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
SNJ54ACT3641HFP Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LM358DR2G
Onsemi
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
LL4148
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBF170LT1G
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
1N4148
Rochester Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Crimson Semiconductor
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
LM358AN
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
1N4148WT
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
SN54LS228W
SN54LS228W by Texas Instruments is a 16x4 FIFO memory IC with TTL technology. It operates asynchronously at temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. This flatpack package features 16 terminals on a rectangular ceramic body, designed for surface mount installation with a terminal pitch of 1.27mm.
SN74ABT7819-15PN
SN74ABT7819-15PN by Texas Instruments is a FIFO memory with 512x18 organization, operating at 67 MHz clock frequency. It features 3-STATE output characteristics and synchronous operation mode. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V275L10PFG8
Renesas Electronics
Renesas Electronics 72V275L10PFG8 FIFO operates at 100MHz with a cycle time of 10ns. It has an organization of 32KX18 and memory density of 589824 bit. Ideal for applications requiring high-speed data storage and retrieval in commercial temperature environments.
IDT7203L15PI
Integrated Device Technology
IDT7203L15PI by Integrated Device Technology is a FIFO memory chip with 2Kx9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can function in industrial temperature ranges. This chip is suitable for applications requiring fast data storage and retrieval in parallel processing systems.
CD74HC40105M
CD74HC40105M by Texas Instruments is a FIFO memory IC with 16x4 organization, 64-bit memory density, and 3-STATE output characteristics. It operates in synchronous mode at a max clock frequency of 10 MHz and has a cycle time of 500 ns. This small outline package is ideal for military-grade applications requiring fast data storage and retrieval.
IDT7202LA25SOI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Cycle Time: 35 ns;
SN74ACT7200L20RJ
SN74ACT7200L20RJ by Texas Instruments is a FIFO chip with 256x9 organization, operating in asynchronous mode at 5V. It features a memory density of 2304 bits and operates in parallel mode. This chip is ideal for applications requiring high-speed data transfer and storage in commercial temperature environments.
SN74ABT7820-25PHR
SN74ABT7820-25PHR by Texas Instruments is a FIFO with 512x18 organization, operating at 5V. It features a cycle time of 25ns, synchronous mode, and 3-STATE output characteristics. Ideal for applications requiring fast data transfer in commercial temperature environments.
7201LA15SOGI
Renesas Electronics' 7201LA15SOGI FIFO features 512x9 organization, 25ns cycle time, and 40MHz clock frequency. Ideal for industrial applications requiring fast data processing with a small outline package style and operating temperature range of -40 to 85°C.
SN74ACT2236-20PM
SN74ACT2236-20PM by Texas Instruments is a 2Kx9 FIFO with synchronous operation and 3-state output. It operates at 5V, has 64 terminals in a flatpack package, and uses CMOS technology. Ideal for applications requiring high-speed data transfer and temporary storage in parallel systems.
SN74ACT2236-30PAG
SN74ACT2236-30PAG by Texas Instruments is a 64-terminal FIFO with 2Kx9 organization, operating at 5V. It features a flatpack, thin profile package and offers 3-state output characteristics. Ideal for synchronous applications requiring high memory density and parallel data transfer in compact spaces.
SN74ACT7205L-15DVR
SN74ACT7205L-15DVR by Texas Instruments is a FIFO with 8KX9 organization, 25 ns cycle time, and 15 ns access time. It operates asynchronously at a supply voltage of 4.5V to 5.5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT72V841L15PFI8
IDT72V841L15PFI8 by Integrated Device Technology is a FIFO with 4Kx9 organization, operating at 66.7MHz clock frequency and 15ns cycle time. It is suitable for industrial applications requiring synchronous operation and a memory density of 36864 bits in a low profile flatpack package style.
5962-8986305YA
Renesas Electronics 5962-8986305YA FIFO operates at 25 MHz with 512x9 organization. Ideal for military applications, it has a cycle time of 40 ns and can withstand temperatures from -55 to 125 °C.
IDT72801L25PF
IDT72801L25PF by Integrated Device Technology is a FIFO memory with 256x9 organization, 25ns cycle time, and 40MHz clock frequency. It operates synchronously at 5V and is ideal for applications requiring fast data storage and retrieval in commercial-grade environments.
IDT7200L25JI8
IDT7200L25JI8 by Integrated Device Technology is a FIFO chip with 256x9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is used in industrial applications requiring fast asynchronous data storage and retrieval capabilities.
IDT72V36110L7-5PFGI
IDT72V36110L7-5PFGI by Renesas Electronics is a FIFO with 128KX36 organization, operating at 3.3V. It features a cycle time of 7.5 ns and max access time of 5 ns, suitable for industrial applications requiring fast synchronous memory operations in a compact FLATPACK package.
SN74ABT7820-30PHR
SN74ABT7820-30PHR by Texas Instruments is a FIFO with 512x18 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and communication systems.
SN74ACT7201LA-50RJR
SN74ACT7201LA-50RJR by Texas Instruments is a FIFO chip with 512x9 organization, 65 ns cycle time, and 3-STATE output characteristics. It operates asynchronously at a nominal voltage of 5V. This chip is commonly used in applications requiring fast data storage and retrieval in parallel processing systems.
7201LA15JGI
Renesas Electronics 7201LA15JGI FIFO chip carrier operates at 40MHz with 512x9 organization. Suitable for industrial applications, it has a cycle time of 25ns and operates on a 5V supply voltage.
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LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
SNJ54ALS232AFK
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: QCCN; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
SNJ54ABT7819GB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: PGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
SNJ54ALS229AFK
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: QCCN; Package Shape: SQUARE; Output Enable: YES;
SNJ54ACT7881HV
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFF; Package Shape: SQUARE; Power Supplies (V): 5;
SNJ54ACT3632HFP
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Cycle Time: 20 ns;
SNJ54ALS232AJ
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP16,.3;
SNJ54ABT3614HFPR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Width: 24.13 mm;
SNJ54ACT3641PCB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: QFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G120;
SNJ54ABT7819HT
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: QFP; Package Shape: SQUARE; Maximum Access Time: 12 ns;
SNJ54ACT7881PNR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Maximum Operating Temperature: 125 Cel;
SNJ54ACT7881HVR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFF; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SNJ54ABT7820GB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: PGA; Package Shape: SQUARE; Terminal Pitch: 2.54 mm;
SNJ54ALS229AJ
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
SNJ54ABT3614PCBR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: HLFQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
SNJ54ACT3632HFPR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SNJ54ABT3614HFP
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Length: 24.13 mm;
SNJ54ABT3614PCB
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: HLFQFP; Package Shape: SQUARE; Terminal Form: GULL WING;
SNJ54ABT7819HTR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: QFP; Package Shape: SQUARE; Length: 16.51 mm;
SNJ54ACT7881PN
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
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