Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
SNJ54ACT3641HFP by Texas Instruments is a 1Kx36 CMOS FIFO memory IC with 20ns cycle time, operating at 5V. It features synchronous operation, MIL-PRF-38535 screening level, and a max clock frequency of 50MHz. Ideal for military-grade applications requiring high-speed data storage and retrieval in harsh environments.
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One Stop Electronics
$1.000
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$2.922
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ChromeModa Solutions
$3.283
$2.692
IDEA Electronic Components Group
$2.955
Advanced Electronics
$4.482
$4.079
$3.675
AZTECH Wire
$18.195
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DigiPath Technology Company
$2.960
The ceramic and glass-sealed package body material ensures durability and reliable performance in various environmental conditions.
The fast cycle time of 20 ns allows for efficient data transfer and processing, making this FIFO product suitable for high-speed applications.
The synchronous operating mode ensures precise timing and synchronization, enhancing the overall performance of the product.
With a high memory density of 36864 bit, this FIFO product offers ample storage capacity for data storage and retrieval.
The maximum clock frequency of 50 MHz allows for rapid data transfer and efficient processing, making this product suitable for high-performance applications.
FIFO SNJ54ACT3641HFP attributes and parameters. Explore more FIFO devices from Texas Instruments
Maximum Access Time:
Maximum Clock Frequency (fCLK):
Cycle Time:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Power Supplies (V):
Qualification:
Screening Level:
Maximum Seated Height:
Sub-Category:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
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Width:
SNJ54ACT3641HFP Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
SS14
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
LIS3DHTR
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
LM555CMX
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Bytesonic Electronics
MBRS1100T3G
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
Cobham Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 100; Maximum Turn Off Time (toff): 300 ns;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
BAV99
Plessey Semiconductors Discrete Components Div
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
SMBJ18CA
Silicon Standard
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Rectron
BAV99-7-F
DP83848IVVX/NOPB
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
SN74ABT7819A-12PH
SN74ABT7819A-12PH by Texas Instruments is a 512Kx18 BI-DIRECTIONAL FIFO memory IC with 80 terminals. It operates at a cycle time of 12ns and max clock frequency of 80MHz, suitable for synchronous applications. This PLASTIC/EPOXY package has a rectangular shape, GULL WING terminal form, and can be surface mounted.
SN74ABT3612-15PQG4
SN74ABT3612-15PQG4 by Texas Instruments is a FIFO memory with 64x36 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. It is ideal for applications requiring fast synchronous data transfer in commercial temperature environments.
SN74ACT7202-35N
SN74ACT7202-35N by Texas Instruments is a FIFO with 1Kx9 organization, 45ns cycle time, and 22MHz max clock frequency. It operates at 5V, has 28 terminals in an IN-LINE package style, and is ideal for parallel data storage applications.
SN74ABT3611-20PCB
SN74ABT3611-20PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 20ns cycle time, and 50MHz clock frequency. It operates synchronously at 5V, has a low profile flatpack package style, and is ideal for parallel data storage applications.
SN74ACT7201LA-25RJR
SN74ACT7201LA-25RJR by Texas Instruments is a FIFO chip with 512x9 organization, 35ns cycle time, and 3-STATE output characteristics. It operates asynchronously at a nominal voltage of 5V. This chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT7203L15RJ
SN74ACT7203L15RJ by Texas Instruments is a FIFO chip with 2Kx9 organization, operating at 40MHz clock frequency and 25ns cycle time. It is designed for parallel operation in commercial temperature grade applications.
7201LA35SOG8
Integrated Device Technology
7201LA35SOG8 by Integrated Device Technology is a FIFO with 512x9 organization, operating at 45ns cycle time. It features a small outline package, suitable for commercial temperature grade applications. With parallel operation and 4608-bit memory density, it offers fast access times for various electronic systems.
SN74ABT7820-15PN
SN74ABT7820-15PN by Texas Instruments is a FIFO memory IC with 512x18 organization, 15 ns cycle time, and 67 MHz clock frequency. It operates synchronously at 5V and features a low profile flatpack package. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN54ACT7811HVR
SN54ACT7811HVR by Texas Instruments is a 1Kx18 FIFO with synchronous operation and 35.08 ns cycle time. It features a 3-STATE output, operates in parallel mode, and has a memory density of 18432 bits. Ideal for military applications requiring fast data transfer and reliable storage in harsh environments.
SN74ACT3651-20PCB
SN74ACT3651-20PCB by Texas Instruments is a FIFO memory IC with 2Kx36 organization, operating at 20ns cycle time and 50MHz clock frequency. It features a parallel interface, synchronous operation, and 3-state output characteristics. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT7204L35RJ
SN74ACT7204L35RJ by Texas Instruments is a 4Kx9 FIFO chip carrier with CMOS technology. It operates asynchronously at 5V, with a memory density of 36864 bits and 4096 words. This rectangular package is surface-mountable and ideal for commercial applications requiring parallel data storage.
SN74ACT72231L-25RJ
SN74ACT72231L-25RJ by Texas Instruments is a FIFO chip with 2Kx9 organization, operating at 25ns cycle time and 40MHz clock frequency. It is used in applications requiring synchronous operation, such as data buffering and communication systems.
SN74ABT3613PQ
SN74ABT3613PQ by Texas Instruments is a FIFO with 64x36 organization, operating at 5V. It has a cycle time of 15ns and max access time of 10ns, suitable for synchronous applications. This PLASTIC/EPOXY package with GULL WING terminals is ideal for commercial temperature grade environments.
CD74HCT40105M
CD74HCT40105M by Texas Instruments is a FIFO IC with 16x4 organization, operating at 5V. It features a cycle time of 100ns, synchronous operation, and output enable function. This small outline package has a max clock frequency of 10MHz and is suitable for military-grade applications requiring fast data storage and retrieval.
7201LA15SOGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
SN74ACT2235-60FNR
SN74ACT2235-60FNR by Texas Instruments is a FIFO chip with 1Kx9 organization, operating at 60 ns cycle time. It features 3-STATE output characteristics and operates in parallel mode. This chip is commonly used in applications requiring fast data storage and retrieval with a memory density of 9216 bits.
SN74ACT2236-20FNR
SN74ACT2236-20FNR by Texas Instruments is a 2Kx9 FIFO chip with 20ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a memory density of 18432 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7201LA15SOGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
SN74ACT7201A-35N
SN74ACT7201A-35N by Texas Instruments is a FIFO with 512x9 organization, 45ns cycle time, and 22.2MHz max clock frequency. It operates synchronously at 5V and is ideal for parallel memory applications requiring fast access times in commercial temperature environments.
SN74ACT7206L-25RJR
SN74ACT7206L-25RJR by Texas Instruments is a 16Kx9 FIFO chip with a cycle time of 35ns, operating at 5V. It features an asynchronous mode, 3-STATE output characteristics, and parallel organization. This CMOS technology device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
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DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
SNJ54ALS232AFK
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: QCCN; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
SNJ54ABT7819GB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: PGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
SNJ54ALS229AFK
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: QCCN; Package Shape: SQUARE; Output Enable: YES;
SNJ54ACT7881HV
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFF; Package Shape: SQUARE; Power Supplies (V): 5;
SNJ54ACT3632HFP
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Cycle Time: 20 ns;
SNJ54ALS232AJ
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP16,.3;
SNJ54ABT3614HFPR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Width: 24.13 mm;
SNJ54ACT3641PCB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: QFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G120;
SNJ54ABT7819HT
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: QFP; Package Shape: SQUARE; Maximum Access Time: 12 ns;
SNJ54ACT7881PNR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Maximum Operating Temperature: 125 Cel;
SNJ54ACT7881HVR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFF; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SNJ54ABT7820GB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: PGA; Package Shape: SQUARE; Terminal Pitch: 2.54 mm;
SNJ54ALS229AJ
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
SNJ54ABT3614PCBR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: HLFQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
SNJ54ACT3632HFPR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SNJ54ABT3614HFP
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Length: 24.13 mm;
SNJ54ABT3614PCB
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: HLFQFP; Package Shape: SQUARE; Terminal Form: GULL WING;
SNJ54ABT7819HTR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: QFP; Package Shape: SQUARE; Length: 16.51 mm;
SNJ54ACT7881PN
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
Supply Digital Components
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