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SNJ54ACT3641PCB

Texas Instruments

SNJ54ACT3641PCB by Texas Instruments

SNJ54ACT3641PCB by Texas Instruments is a 1Kx36 BI-DIRECTIONAL FIFO memory IC with 50 MHz clock frequency, operating at -55 to 125 °C. It has 120 terminals in a FLATPACK package style and uses CMOS technology. Ideal for military applications requiring fast data access and synchronous operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,713 parts In-Stock

1+ parts

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4,713

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Digiode

USA . 4,094 parts In-Stock

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4,094

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,412 parts In-Stock

1+ parts

$2.000

100+ parts

-

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1,412

$2.000

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Parana Technologies

USA . 644 parts In-Stock

1+ parts

$4.356

100+ parts

-

1k+ parts

$4.772

10k+ parts

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644

$4.356

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$4.772

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DigiPath Technology Company

USA . 400 parts In-Stock

1+ parts

$4.796

100+ parts

$4.412

1k+ parts

-

10k+ parts

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400

$4.796

$4.412

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ChromeModa Solutions

Germany . 5,100 parts In-Stock

1+ parts

$4.894

100+ parts

$4.013

1k+ parts

-

10k+ parts

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5,100

$4.894

$4.013

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IDEA Electronic Components Group

UK . 888 parts In-Stock

1+ parts

$4.894

100+ parts

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1k+ parts

$4.405

10k+ parts

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888

$4.894

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$4.405

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AZTECH Wire

Italy . 197 parts In-Stock

1+ parts

$15.120

100+ parts

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197

$15.120

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Corphita

USA . 975 parts In-Stock

1+ parts

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975

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Overview

Enhance your electronic designs with the high-quality SNJ54ACT3641PCB FIFO from Texas Instruments. Designed with precision and reliability in mind, this bi-directional FIFO offers seamless data storage and retrieval for a wide range of applications. With a robust construction and advanced technology, this device is ideal for military-grade projects requiring fast and efficient data processing. Trust Texas Instruments for exceptional performance and durability in every product. Elevate your projects with the SNJ54ACT3641PCB and experience unparalleled value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into various electronic designs, providing flexibility in the manufacturing process.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures that data is transferred at a consistent rate, making the product reliable for real-time applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes the product compatible with a wide range of electronic systems, ensuring ease of integration.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand harsh environmental conditions, making it suitable for industrial and military applications.

Technology: CMOS

The CMOS technology used in the product provides low power consumption and fast operation, making it energy-efficient and reliable for long-term use.

Technical Specifications

FIFO SNJ54ACT3641PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Maximum Clock Frequency (fCLK):

50 MHz

JESD-30 Code:

S-PQFP-G120

Memory Density:

36864 bit

Memory IC Type:

Memory Width:

36

No. of Terminals:

120

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

1KX36

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

FIFOs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trade Compliance

SNJ54ACT3641PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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