Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
SNJ54ACT3632HFPR by Texas Instruments is a FIFO with 512x36 organization, operating at 5V. It features a cycle time of 20ns and synchronous operation, suitable for military-grade applications requiring fast access times. With a ceramic, metal-sealed co-fired package and flatpack style, it offers robust construction for reliable performance in harsh environments.
Median Price
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2
In-Stock Inventory
1k+
Vyrian
1+ parts
100+ parts
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Digiode
Parana Technologies
$3.404
$3.931
DigiPath Technology Company
$3.748
$3.449
ChromeModa Solutions
$3.825
$3.136
IDEA Electronic Components Group
$3.442
AZTECH Wire
$16.230
One Stop Electronics
$26.000
Corphita
This material ensures durability and reliability, making the product suitable for harsh environments.
With a fast cycle time, this product offers efficient data processing and retrieval.
Operating at a standard voltage of 5V, this product is compatible with common power sources.
Having a high number of terminals allows for versatile connectivity options.
With a high maximum operating temperature, this product can withstand extreme heat conditions.
The high memory density offers ample storage capacity for data-intensive applications.
FIFO SNJ54ACT3632HFPR attributes and parameters. Explore more FIFO devices from Texas Instruments
Maximum Access Time:
Additional Features:
Cycle Time:
JESD-30 Code:
Length:
Memory Density:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Enable:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Qualification:
Maximum Seated Height:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
SNJ54ACT3632HFPR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N2222A
Aeroflex/metelics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Package Shape: ROUND; Transistor Application: SWITCHING;
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
Texas Instruments
LM555CMX by Texas Instruments is an Analog Waveform Generation IC with 8 terminals. It operates at a nominal voltage of 5V and supports power supplies ranging from 5V to 15V. This versatile IC, housed in a small outline package, is commonly used for pulse and rectangular waveform generation in commercial temperature environments.
Promax-johnton
Good-ark Electronics
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
RC0603JR-070RL
Yageo
Yageo's RC0603JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. Its metal glaze/thick film technology and 0.1 W power dissipation make it ideal for jumper applications in various electronic devices.
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
1N4148
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Eic Semiconductor
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
STMicroelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Leshan Radio
LP2950CDT-3.3G
Onsemi
LP2950CDT-3.3G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.1A. It has a small outline package style, operates at temperatures ranging from -40 to 125 °C, and is suitable for applications requiring low dropout voltage and precise voltage regulation in electronic circuits.
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
SN54LS228W
SN54LS228W by Texas Instruments is a 16x4 FIFO memory IC with TTL technology. It operates asynchronously at temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. This flatpack package features 16 terminals on a rectangular ceramic body, designed for surface mount installation with a terminal pitch of 1.27mm.
SN74ACT3641-30PQR
SN74ACT3641-30PQR by Texas Instruments is a FIFO with 1KX36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments, this device offers parallel access with a memory width of 36 bits.
CD40105BH
CD40105BH by Texas Instruments is a FIFO chip with 16X4 organization, operating in asynchronous mode. It features a memory width of 4, memory density of 64 bit, and operates in parallel mode. This military-grade CMOS technology has an operating temperature range from -55°C to 125°C, making it suitable for rugged applications requiring reliable data storage and retrieval.
SN54ACT7881PN
SN54ACT7881PN by Texas Instruments is a FIFO with 1KX18 organization, operating at 5V. It features a cycle time of 20ns, output enable function, and 3-STATE output characteristics. Ideal for military applications due to its temperature grade and CMOS technology.
7202LA25SOI8
Integrated Device Technology
7202LA25SOI8 by Integrated Device Technology is a FIFO with 1KX9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is ideal for industrial applications requiring fast data processing and storage in a compact small outline package.
SN74ACT72235-30FN
SN74ACT72235-30FN by Texas Instruments is a FIFO chip with 1KX9 organization, 30.3 ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and communication systems. The chip comes in a square plastic/epoxy package with 44 terminals for surface mount installation.
SN74ACT3631-30PCBR
SN74ACT3631-30PCBR by Texas Instruments is a FIFO with 512x36 organization, 30 ns cycle time, and 5V nominal voltage. It operates in synchronous mode and has a memory density of 18432 bits. This device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ABT3612-15PQG4
SN74ABT3612-15PQG4 by Texas Instruments is a FIFO memory with 64x36 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. It is ideal for applications requiring fast synchronous data transfer in commercial temperature environments.
SN74ABT7819A-10PN
SN74ABT7819A-10PN by Texas Instruments is a 512Kx18 BI-DIRECTIONAL FIFO with 10ns cycle time, operating at 100MHz. It features a 5V nominal voltage and GULL WING terminal form. Ideal for applications requiring fast data transfer and synchronization in commercial temperature environments.
SN74ACT72231L-50RJR
SN74ACT72231L-50RJR by Texas Instruments is a FIFO chip with 2KX9 organization, 50 ns cycle time, and 3-STATE output characteristics. It operates synchronously at 5V and is used in applications requiring fast data storage and retrieval in commercial temperature environments.
IDT7202LA12PDG
Renesas Electronics
The Renesas Electronics IDT7202LA12PDG is a FIFO memory with 1Kx9 organization, operating at 20ns cycle time and 50MHz clock frequency. It is used in applications requiring fast data storage and retrieval, with a max supply voltage of 5.5V and temperature range of 0-70°C.
72V255LA15PFGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Width: 14 mm;
72V273L7-5BCGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
74HC40105PW,118
Nexperia
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Access Time: 600 ns;
72V2113L6PFG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Memory Width: 18;
SN74ABT3612-20PQ
SN74ABT3612-20PQ by Texas Instruments is a 64x36 bi-directional FIFO memory IC with a cycle time of 20 ns and max clock frequency of 50 MHz. It operates in synchronous mode, has a memory density of 2304 bit, and supports parallel data transfer. This device is ideal for applications requiring fast and efficient data storage and retrieval in commercial temperature environments.
72V221L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Length: 7 mm;
SN74ACT2235-60PM
SN74ACT2235-60PM by Texas Instruments is a FIFO memory IC with 1Kx9 organization, operating at 60ns cycle time and 16.7MHz clock frequency. It features a 64-terminal flatpack package suitable for commercial temperature grades, ideal for parallel data storage applications requiring fast access times.
SN74ACT2235-40FN
SN74ACT2235-40FN by Texas Instruments is a FIFO chip with 1Kx9 organization, operating at 25MHz clock frequency and 40ns cycle time. It features a memory density of 9216 bit and supports parallel operation. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN74ACT7204L15RJ
SN74ACT7204L15RJ by Texas Instruments is a FIFO chip with 4Kx9 organization, operating at 40 MHz clock frequency and 25 ns cycle time. It is designed for parallel operation in commercial temperature grade applications, featuring a memory density of 36864 bits and max access time of 15 ns.
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
SNJ54ALS232AFK
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: QCCN; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
SNJ54ACT3641HFP
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFF; Package Shape: SQUARE; Terminal Form: FLAT;
SNJ54ABT7819GB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: PGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
SNJ54ALS229AFK
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: QCCN; Package Shape: SQUARE; Output Enable: YES;
SNJ54ACT7881HV
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFF; Package Shape: SQUARE; Power Supplies (V): 5;
SNJ54ACT3632HFP
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Cycle Time: 20 ns;
SNJ54ALS232AJ
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP16,.3;
SNJ54ABT3614HFPR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Width: 24.13 mm;
SNJ54ACT3641PCB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: QFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G120;
SNJ54ABT7819HT
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: QFP; Package Shape: SQUARE; Maximum Access Time: 12 ns;
SNJ54ACT7881PNR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Maximum Operating Temperature: 125 Cel;
SNJ54ACT7881HVR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFF; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SNJ54ABT7820GB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: PGA; Package Shape: SQUARE; Terminal Pitch: 2.54 mm;
SNJ54ALS229AJ
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
SNJ54ABT3614PCBR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: HLFQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
SNJ54ABT3614HFP
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Length: 24.13 mm;
SNJ54ABT3614PCB
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: HLFQFP; Package Shape: SQUARE; Terminal Form: GULL WING;
SNJ54ABT7819HTR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: QFP; Package Shape: SQUARE; Length: 16.51 mm;
SNJ54ACT7881PN
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
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