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SN74ABT3614-15PQ

Texas Instruments

SN74ABT3614-15PQ by Texas Instruments

SN74ABT3614-15PQ by Texas Instruments is a FIFO memory IC with 64x36 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. It features a parallel interface, synchronous operation, and 3-STATE output characteristics. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$33.041

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,852 parts In-Stock

1+ parts

-

100+ parts

$29.370

1k+ parts

$26.280

10k+ parts

$24.740

5,852

-

$29.370

$26.280

$24.740

DigiKey

USA . 5,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,852

-

-

-

-

Verical

USA . 5,852 parts In-Stock

1+ parts

-

100+ parts

$36.712

1k+ parts

$32.850

10k+ parts

$30.925

5,852

-

$36.712

$32.850

$30.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,108 parts In-Stock

1+ parts

$31.008

100+ parts

-

1k+ parts

-

10k+ parts

-

2,108

$31.008

-

-

-

Vyrian

USA . 3,147 parts In-Stock

1+ parts

$32.640

100+ parts

-

1k+ parts

-

10k+ parts

-

3,147

$32.640

-

-

-

DigiKey Marketplace

USA . 5,852 parts In-Stock

1+ parts

$33.950

100+ parts

-

1k+ parts

-

10k+ parts

-

5,852

$33.950

-

-

-

Bristol Electronics

USA . 262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

262

-

-

-

-

Microfarads

USA . 15 parts In-Stock

1+ parts

-

100+ parts

-

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-

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15

-

-

-

-

Electronic Expediters

USA . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14

-

-

-

-

LWI Electronics Inc

India . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,341 parts In-Stock

1+ parts

$2.448

100+ parts

-

1k+ parts

$2.941

10k+ parts

-

2,341

$2.448

-

$2.941

-

DigiPath Technology Company

USA . 2,064 parts In-Stock

1+ parts

$2.695

100+ parts

$2.479

1k+ parts

-

10k+ parts

-

2,064

$2.695

$2.479

-

-

ChromeModa Solutions

Germany . 2,060 parts In-Stock

1+ parts

$2.750

100+ parts

$2.255

1k+ parts

-

10k+ parts

-

2,060

$2.750

$2.255

-

-

IDEA Electronic Components Group

UK . 417 parts In-Stock

1+ parts

$2.750

100+ parts

-

1k+ parts

$2.475

10k+ parts

-

417

$2.750

-

$2.475

-

Corphita

USA . 4,624 parts In-Stock

1+ parts

$29.376

100+ parts

-

1k+ parts

-

10k+ parts

-

4,624

$29.376

-

-

-

Component Stockers USA

USA . 3,970 parts In-Stock

1+ parts

$33.000

100+ parts

$31.010

1k+ parts

$28.040

10k+ parts

-

3,970

$33.000

$31.010

$28.040

-

Microchip USA

USA . 404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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404

-

-

-

-

Overview

Discover the top-quality SN74ABT3614-15PQ FIFO by Texas Instruments, a reliable solution for your electronic needs. With a focus on innovation and excellence, Texas Instruments ensures superior performance in every product they create. This FIFO device offers seamless operation, fast cycle times, and a wide range of applications, making it an essential component for your projects. Trust in Texas Instruments for unbeatable value, efficiency, and unmatched reliability in the world of electronic components. Elevate your designs with the SN74ABT3614-15PQ today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product easy to handle and resistant to damage.

Cycle Time: 15 ns

The quick cycle time of 15 ns ensures efficient and fast data processing, making this product suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

SYNCHRONOUS operation allows for precise synchronization of data transfer, ensuring accurate and reliable communication between components.

Maximum Clock Frequency (fCLK): 66.7 MHz

With a high maximum clock frequency of 66.7 MHz, this FIFO can handle rapid data input and output, making it ideal for demanding tasks.

Memory Density: 2304 bit

The high memory density of 2304 bit allows for the storage of a large amount of data, making this FIFO suitable for applications requiring extensive memory capabilities.

Technical Specifications

FIFO SN74ABT3614-15PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

10 ns

Additional Features:

PARITY GENERATOR/CHECKER, MAILBOX

Maximum Clock Frequency (fCLK):

66.7 MHz

Cycle Time:

15 ns

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

24.13 mm

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

132

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FIFOs

Maximum Supply Current:

130 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.13 mm

Trade Compliance

SN74ABT3614-15PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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