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SN74V245-10PAG

Texas Instruments

SN74V245-10PAG by Texas Instruments

SN74V245-10PAG by Texas Instruments is a FIFO with 4Kx18 organization, operating at 166 MHz. It features a cycle time of 10 ns and operates at a supply voltage of 3.3 V. Ideal for applications requiring fast synchronous data transfer in commercial temperature environments.

Median Price

$20.322

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,092 parts In-Stock

1+ parts

$19.520

100+ parts

$17.051

1k+ parts

$11.759

10k+ parts

-

1,092

$19.520

$17.051

$11.759

-

Rochester

USA . 870 parts In-Stock

1+ parts

-

100+ parts

$16.900

1k+ parts

$15.120

10k+ parts

$14.230

870

-

$16.900

$15.120

$14.230

DigiKey

USA . 870 parts In-Stock

1+ parts

-

100+ parts

$22.240

1k+ parts

-

10k+ parts

-

870

-

$22.240

-

-

Verical

USA . 749 parts In-Stock

1+ parts

-

100+ parts

$21.125

1k+ parts

$18.900

10k+ parts

$17.788

749

-

$21.125

$18.900

$17.788

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,685 parts In-Stock

1+ parts

$15.514

100+ parts

-

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-

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2,685

$15.514

-

-

-

Nova Conductors

Japan . 35 parts In-Stock

1+ parts

$16.959

100+ parts

-

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-

10k+ parts

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35

$16.959

-

-

-

Vyrian

USA . 3,684 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,684

-

-

-

-

DigiKey Marketplace

USA . 888 parts In-Stock

1+ parts

-

100+ parts

-

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888

-

-

-

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LWI Electronics Inc

India . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 454 parts In-Stock

1+ parts

$3.313

100+ parts

-

1k+ parts

$3.836

10k+ parts

-

454

$3.313

-

$3.836

-

DigiPath Technology Company

USA . 522 parts In-Stock

1+ parts

$3.649

100+ parts

$3.357

1k+ parts

-

10k+ parts

-

522

$3.649

$3.357

-

-

ChromeModa Solutions

Germany . 6,491 parts In-Stock

1+ parts

$3.723

100+ parts

$3.053

1k+ parts

-

10k+ parts

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6,491

$3.723

$3.053

-

-

IDEA Electronic Components Group

UK . 1,177 parts In-Stock

1+ parts

$3.723

100+ parts

-

1k+ parts

$3.351

10k+ parts

-

1,177

$3.723

-

$3.351

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Ampacity Inc.

Singapore . 681 parts In-Stock

1+ parts

$13.880

100+ parts

-

1k+ parts

-

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681

$13.880

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-

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Semicontronic

India . 604 parts In-Stock

1+ parts

$13.880

100+ parts

$13.533

1k+ parts

$13.464

10k+ parts

-

604

$13.880

$13.533

$13.464

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Corphita

USA . 4,163 parts In-Stock

1+ parts

$14.697

100+ parts

-

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4,163

$14.697

-

-

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Continental Prestige Electronics

USA . 1,838 parts In-Stock

1+ parts

$16.959

100+ parts

-

1k+ parts

-

10k+ parts

$16.619

1,838

$16.959

-

-

$16.619

Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

$16.960

100+ parts

$16.112

1k+ parts

-

10k+ parts

$15.094

800

$16.960

$16.112

-

$15.094

Corohmni

South Africa . 635 parts In-Stock

1+ parts

$17.497

100+ parts

-

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-

10k+ parts

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635

$17.497

-

-

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Microchip USA

USA . 1,734 parts In-Stock

1+ parts

$47.540

100+ parts

$46.860

1k+ parts

$46.530

10k+ parts

$46.190

1,734

$47.540

$46.860

$46.530

$46.190

A-Z Elektronik GmbH

Germany . 5,946 parts In-Stock

1+ parts

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5,946

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Argo Parts USA

USA . 463 parts In-Stock

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463

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Kepictronics

USA . 150 parts In-Stock

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150

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-

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Perfect Parts

USA . 65 parts In-Stock

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65

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-

Overview

Enhance your electronic projects with the SN74V245-10PAG by Texas Instruments, a top-of-the-line FIFO memory IC designed for seamless data transfer and storage. With Texas Instruments' renowned reputation for quality and innovation, this device offers fast cycle times, a wide operating voltage range, and superior reliability. Whether you're working on telecommunications, networking, or industrial automation applications, this FIFO memory IC provides the performance and efficiency you need to bring your designs to life. Upgrade your projects today with the SN74V245-10PAG and experience unmatched value and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that provides protection for internal components while keeping overall weight of the product low.

Cycle Time: 10 ns

Fast data transfer speed ensures efficient operation and performance.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise control and timing in data processing.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal voltage supply for reliable and stable performance.

Maximum Clock Frequency (fCLK): 166 MHz

High clock frequency allows for fast data processing and transfer rates.

Memory Density: 73728 bit

High memory density provides ample storage capacity for data handling tasks.

Output Enable: YES

Output enable feature allows for efficient control over data output, improving overall system functionality.

Technical Specifications

FIFO SN74V245-10PAG attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

6.5 ns

Maximum Clock Frequency (fCLK):

166 MHz

Cycle Time:

10 ns

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Memory Density:

73728 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4KX18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

SN74V245-10PAG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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