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SN74V215-10PAG

Texas Instruments

SN74V215-10PAG by Texas Instruments

SN74V215-10PAG by Texas Instruments is a FIFO with 512x18 organization, operating at 133 MHz. It features a cycle time of 10 ns and operates at a nominal voltage of 3.3V. This device is suitable for applications requiring fast synchronous data transfer in commercial temperature environments.

Median Price

$19.041

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 540 parts In-Stock

1+ parts

$18.257

100+ parts

$15.947

1k+ parts

$10.998

10k+ parts

-

540

$18.257

$15.947

$10.998

-

Rochester

USA . 4,929 parts In-Stock

1+ parts

-

100+ parts

$15.860

1k+ parts

$14.190

10k+ parts

$13.350

4,929

-

$15.860

$14.190

$13.350

DigiKey

USA . 4,929 parts In-Stock

1+ parts

-

100+ parts

$20.860

1k+ parts

-

10k+ parts

-

4,929

-

$20.860

-

-

Verical

USA . 3,290 parts In-Stock

1+ parts

-

100+ parts

$19.825

1k+ parts

$17.738

10k+ parts

$16.688

3,290

-

$19.825

$17.738

$16.688

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 316 parts In-Stock

1+ parts

$14.516

100+ parts

-

1k+ parts

-

10k+ parts

-

316

$14.516

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$15.130

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$15.130

-

-

-

DigiKey Marketplace

USA . 4,948 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

4,948

-

-

-

-

Vyrian

USA . 3,090 parts In-Stock

1+ parts

-

100+ parts

-

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-

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3,090

-

-

-

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R&J Components

USA . 1,966 parts In-Stock

1+ parts

-

100+ parts

-

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1,966

-

-

-

-

LWI Electronics Inc

India . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,370 parts In-Stock

1+ parts

$2.804

100+ parts

-

1k+ parts

$3.290

10k+ parts

-

1,370

$2.804

-

$3.290

-

DigiPath Technology Company

USA . 902 parts In-Stock

1+ parts

$3.088

100+ parts

$2.841

1k+ parts

-

10k+ parts

-

902

$3.088

$2.841

-

-

ChromeModa Solutions

Germany . 3,295 parts In-Stock

1+ parts

$3.151

100+ parts

$2.584

1k+ parts

-

10k+ parts

-

3,295

$3.151

$2.584

-

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

1+ parts

$3.151

100+ parts

-

1k+ parts

$2.836

10k+ parts

-

1,473

$3.151

-

$2.836

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Ampacity Inc.

Singapore . 2,986 parts In-Stock

1+ parts

$12.990

100+ parts

-

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-

10k+ parts

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2,986

$12.990

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Corphita

USA . 4,709 parts In-Stock

1+ parts

$13.752

100+ parts

-

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-

10k+ parts

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4,709

$13.752

-

-

-

Continental Prestige Electronics

USA . 564 parts In-Stock

1+ parts

$15.130

100+ parts

-

1k+ parts

-

10k+ parts

$14.827

564

$15.130

-

-

$14.827

Microchip USA

USA . 1,441 parts In-Stock

1+ parts

$44.490

100+ parts

$43.860

1k+ parts

$43.540

10k+ parts

$43.220

1,441

$44.490

$43.860

$43.540

$43.220

Argo Parts USA

USA . 1,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,468

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Overview

Discover the cutting-edge technology of the SN74V215-10PAG by Texas Instruments, a top-of-the-line FIFO memory IC that offers unmatched performance and reliability. With a lightning-fast cycle time of 10 ns and a maximum clock frequency of 133 MHz, this device ensures seamless data storage and retrieval. Whether used in telecommunications, industrial automation, or consumer electronics, the SN74V215-10PAG delivers superior functionality and efficiency. Trust in Texas Instruments' reputation for quality and innovation, and elevate your products to the next level with this advanced FIFO memory IC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FIFO, ensuring a longer lifespan.

Cycle Time: 10 ns

The fast cycle time of 10 ns allows for quick data storage and retrieval, making this FIFO ideal for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is common and widely available, making it easy to integrate this FIFO into existing systems.

Maximum Clock Frequency (fCLK): 133 MHz

With a high clock frequency of 133 MHz, this FIFO can handle data at a rapid pace, suitable for high-performance applications.

Memory Density: 9216 bit

The high memory density of 9216 bits allows for the storage of a large amount of data, making this FIFO versatile for various data processing tasks.

Technical Specifications

FIFO SN74V215-10PAG attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

6.5 ns

Maximum Clock Frequency (fCLK):

133 MHz

Cycle Time:

10 ns

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

SN74V215-10PAG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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