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SN74ACT7202LA25NP

Texas Instruments

SN74ACT7202LA25NP by Texas Instruments

SN74ACT7202LA25NP by Texas Instruments is a FIFO memory with 1Kx9 organization, 35ns cycle time, and 28.5MHz clock frequency. It operates at 5V, has a temperature range of 0-70°C, and is ideal for applications requiring fast data storage and retrieval in parallel processing systems.

Median Price

$6.638

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$5.310

1k+ parts

$4.750

10k+ parts

$4.470

115

-

$5.310

$4.750

$4.470

DigiKey

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$6.990

1k+ parts

-

10k+ parts

-

115

-

$6.990

-

-

Verical

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$6.638

1k+ parts

$5.938

10k+ parts

$5.588

115

-

$6.638

$5.938

$5.588

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$5.260

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$5.260

-

-

-

Digiode

USA . 1,919 parts In-Stock

1+ parts

$5.605

100+ parts

-

1k+ parts

-

10k+ parts

-

1,919

$5.605

-

-

-

Vyrian

USA . 2,208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,208

-

-

-

-

DigiKey Marketplace

USA . 115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

115

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,800 parts In-Stock

1+ parts

$1.915

100+ parts

-

1k+ parts

$2.453

10k+ parts

-

1,800

$1.915

-

$2.453

-

DigiPath Technology Company

USA . 209 parts In-Stock

1+ parts

$2.109

100+ parts

$1.940

1k+ parts

-

10k+ parts

-

209

$2.109

$1.940

-

-

ChromeModa Solutions

Germany . 3,939 parts In-Stock

1+ parts

$2.152

100+ parts

$1.765

1k+ parts

-

10k+ parts

-

3,939

$2.152

$1.765

-

-

IDEA Electronic Components Group

UK . 2,081 parts In-Stock

1+ parts

$2.152

100+ parts

-

1k+ parts

$1.937

10k+ parts

-

2,081

$2.152

-

$1.937

-

Ampacity Inc.

Singapore . 115 parts In-Stock

1+ parts

$5.020

100+ parts

-

1k+ parts

-

10k+ parts

-

115

$5.020

-

-

-

Semicontronic

India . 115 parts In-Stock

1+ parts

$5.020

100+ parts

$4.894

1k+ parts

$4.869

10k+ parts

-

115

$5.020

$4.894

$4.869

-

Corohmni

South Africa . 114 parts In-Stock

1+ parts

$5.260

100+ parts

-

1k+ parts

-

10k+ parts

-

114

$5.260

-

-

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Continental Prestige Electronics

USA . 6,764 parts In-Stock

1+ parts

$5.260

100+ parts

-

1k+ parts

-

10k+ parts

$5.155

6,764

$5.260

-

-

$5.155

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.260

100+ parts

-

1k+ parts

$4.997

10k+ parts

$4.892

100

$5.260

-

$4.997

$4.892

Corphita

USA . 1,506 parts In-Stock

1+ parts

$5.310

100+ parts

-

1k+ parts

-

10k+ parts

-

1,506

$5.310

-

-

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AZTECH Wire

Italy . 814 parts In-Stock

1+ parts

$11.640

100+ parts

-

1k+ parts

-

10k+ parts

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814

$11.640

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-

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Argo Parts USA

USA . 1,529 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,529

-

-

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Overview

Elevate your electronic designs with the SN74ACT7202LA25NP by Texas Instruments, a top-tier FIFO memory IC that guarantees superior performance and reliability. Manufactured with precision and expertise, this product is ideal for a wide range of applications in the tech industry. Offering seamless operation and lightning-fast data transfer speeds, this FIFO memory IC is a game-changer for any project. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and propels your creations to new heights. Choose quality, choose innovation, choose the SN74ACT7202LA25NP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and insulation, making the product resistant to external factors such as heat and moisture.

Cycle Time: 35 ns

The fast cycle time of 35ns ensures efficient data retrieval and transmission, making this FIFO ideal for high-speed applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operation allows for independent and simultaneous data transfers, improving overall system efficiency.

Maximum Clock Frequency: 28.5 MHz

With a high clock frequency of 28.5 MHz, this FIFO can handle rapid data processing and communication requirements.

Memory Density: 9216 bit

The high memory density of 9216 bits enables the storage of a large amount of data, making this FIFO suitable for applications with extensive data buffering needs.

Technical Specifications

FIFO SN74ACT7202LA25NP attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

25 ns

Maximum Clock Frequency (fCLK):

28.5 MHz

Cycle Time:

35 ns

JESD-30 Code:

R-PDIP-T28

Length:

34.545 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0005 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

125 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74ACT7202LA25NP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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