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SN74ABT7819-10PHR

Texas Instruments

SN74ABT7819-10PHR by Texas Instruments

SN74ABT7819-10PHR by Texas Instruments is a 512x18 FIFO with 10ns cycle time, operating at 5V. It features synchronous operation, parallel interface, and output enable function. This device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,917 parts In-Stock

1+ parts

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3,917

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Digiode

USA . 1,759 parts In-Stock

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1,759

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,675 parts In-Stock

1+ parts

$1.870

100+ parts

-

1k+ parts

$2.416

10k+ parts

-

1,675

$1.870

-

$2.416

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ChromeModa Solutions

Germany . 6,418 parts In-Stock

1+ parts

$2.101

100+ parts

$1.723

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-

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6,418

$2.101

$1.723

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IDEA Electronic Components Group

UK . 437 parts In-Stock

1+ parts

$2.101

100+ parts

-

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$1.891

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437

$2.101

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$1.891

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AZTECH Wire

Italy . 709 parts In-Stock

1+ parts

$12.624

100+ parts

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709

$12.624

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One Stop Electronics

USA . 1,313 parts In-Stock

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$20.000

100+ parts

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1,313

$20.000

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Corphita

USA . 1,707 parts In-Stock

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1,707

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DigiPath Technology Company

USA . 503 parts In-Stock

1+ parts

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100+ parts

$1.894

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503

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$1.894

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Overview

Unlock seamless data storage and retrieval with the SN74ABT7819-10PHR FIFO by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that guarantee reliability and performance. Ideal for various applications, this FIFO device offers fast cycle times, synchronous operation, and a wide supply voltage range. With its 512x18 organization and parallel access capabilities, customers can experience efficient data handling with ease. Upgrade your system today and enjoy the benefits of speed, precision, and superior functionality with the SN74ABT7819-10PHR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and reliability for the product, making it a good choice for long-term use.

Cycle Time: 10 ns

With a fast cycle time of 10 ns, this FIFO product is suitable for high-speed applications and efficient data transfer.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this FIFO product is compatible with standard power sources and can be easily integrated into existing systems.

No. of Terminals: 80

The 80 terminals provide ample connectivity options, making this FIFO product versatile and suitable for a variety of applications.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70°C ensures that this FIFO product can perform reliably even in harsh environmental conditions.

Technical Specifications

FIFO SN74ABT7819-10PHR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

9 ns

Cycle Time:

10 ns

JESD-30 Code:

R-PQFP-G80

Length:

20 mm

Memory Density:

9216 bit

Memory Width:

18

No. of Functions:

1

No. of Terminals:

80

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

3.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

SN74ABT7819-10PHR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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