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SN74V263-6PZA

Texas Instruments

SN74V263-6PZA by Texas Instruments

SN74V263-6PZA by Texas Instruments is a FIFO memory with 8Kx18 organization, operating at 166 MHz with a cycle time of 6 ns. It features synchronous operation, 3-state output characteristics, and a low profile flatpack package. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$29.210

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,060 parts In-Stock

1+ parts

$31.311

100+ parts

$27.350

1k+ parts

$18.862

10k+ parts

-

1,060

$31.311

$27.350

$18.862

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Rochester

USA . 269 parts In-Stock

1+ parts

-

100+ parts

$27.110

1k+ parts

$24.260

10k+ parts

$22.830

269

-

$27.110

$24.260

$22.830

DigiKey

USA . 269 parts In-Stock

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-

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269

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Digiode

USA . 348 parts In-Stock

1+ parts

$24.890

100+ parts

-

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348

$24.890

-

-

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$25.950

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870

$25.950

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Vyrian

USA . 4,264 parts In-Stock

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4,264

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LWI Electronics Inc

India . 6 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 1,684 parts In-Stock

1+ parts

$2.716

100+ parts

-

1k+ parts

$2.608

10k+ parts

$2.608

1,684

$2.716

-

$2.608

$2.608

Parana Technologies

USA . 485 parts In-Stock

1+ parts

$5.260

100+ parts

-

1k+ parts

$5.882

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485

$5.260

-

$5.882

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DigiPath Technology Company

USA . 392 parts In-Stock

1+ parts

$5.792

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392

$5.792

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IDEA Electronic Components Group

UK . 584 parts In-Stock

1+ parts

$5.910

100+ parts

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$5.319

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584

$5.910

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$5.319

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ChromeModa Solutions

Germany . 184 parts In-Stock

1+ parts

$5.910

100+ parts

$4.846

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184

$5.910

$4.846

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Semicontronic

India . 558 parts In-Stock

1+ parts

$22.270

100+ parts

$21.713

1k+ parts

$21.602

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558

$22.270

$21.713

$21.602

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Ampacity Inc.

Singapore . 165 parts In-Stock

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$22.270

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165

$22.270

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Corphita

USA . 1,347 parts In-Stock

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$23.580

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$23.580

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Continental Prestige Electronics

USA . 5,714 parts In-Stock

1+ parts

$25.950

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$25.431

5,714

$25.950

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$25.431

Netroflash

USA . 500 parts In-Stock

1+ parts

$25.950

100+ parts

-

1k+ parts

$24.653

10k+ parts

$24.134

500

$25.950

-

$24.653

$24.134

Argo Parts USA

USA . 711 parts In-Stock

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711

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Overview

Upgrade your system with the SN74V263-6PZA FIFO from Texas Instruments, a reliable and high-quality solution for seamless data storage and retrieval. Perfect for applications requiring fast cycle times and synchronous operation, this FIFO offers superior performance with a 166 MHz clock frequency. With a low profile flatpack design and 3-state output characteristics, it provides flexibility and efficiency in managing data flow. Trust Texas Instruments for cutting-edge technology and unlock the potential of your system with the SN74V263-6PZA FIFO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, making it suitable for various application environments.

Cycle Time: 6 ns

Fast cycle time of 6 ns ensures efficient and quick data processing, making this FIFO suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures coordinated data transfer and processing, resulting in reliable and accurate performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, making it compatible with common power supply systems.

Maximum Clock Frequency (fCLK): 166 MHz

High maximum clock frequency of 166 MHz enables fast data transfer rates and overall high performance.

Memory IC Type: OTHER FIFO

Specifically designed as a FIFO memory IC, ensuring efficient data handling and storage for FIFO applications.

Technical Specifications

FIFO SN74V263-6PZA attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

4.5 ns

Additional Features:

CAN ALSO BE CONFIGURED AS 16384 X 9

Alternate Memory Width:

9

Maximum Clock Frequency (fCLK):

166 MHz

Cycle Time:

6 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

147456 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

80

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.015 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74V263-6PZA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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