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SN74ACT7205L15RJ

Texas Instruments

SN74ACT7205L15RJ by Texas Instruments

SN74ACT7205L15RJ by Texas Instruments is a FIFO chip with 8Kx9 organization, operating at 40 MHz with a cycle time of 25 ns. It has a memory density of 73728 bits and can operate in commercial temperature grades. This chip is suitable for applications requiring fast data storage and retrieval in parallel mode.

Median Price

$15.625

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,464 parts In-Stock

1+ parts

-

100+ parts

$12.500

1k+ parts

$11.190

10k+ parts

$10.530

6,464

-

$12.500

$11.190

$10.530

DigiKey

USA . 6,464 parts In-Stock

1+ parts

-

100+ parts

$16.450

1k+ parts

-

10k+ parts

-

6,464

-

$16.450

-

-

Verical

USA . 6,432 parts In-Stock

1+ parts

-

100+ parts

$15.625

1k+ parts

$13.988

10k+ parts

$13.162

6,432

-

$15.625

$13.988

$13.162

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 845 parts In-Stock

1+ parts

$13.196

100+ parts

-

1k+ parts

-

10k+ parts

-

845

$13.196

-

-

-

Vyrian

USA . 4,755 parts In-Stock

1+ parts

$13.890

100+ parts

-

1k+ parts

-

10k+ parts

-

4,755

$13.890

-

-

-

DigiKey Marketplace

USA . 6,464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,464

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,817 parts In-Stock

1+ parts

$1.846

100+ parts

-

1k+ parts

$2.394

10k+ parts

-

1,817

$1.846

-

$2.394

-

DigiPath Technology Company

USA . 1,893 parts In-Stock

1+ parts

$2.033

100+ parts

$1.870

1k+ parts

-

10k+ parts

-

1,893

$2.033

$1.870

-

-

IDEA Electronic Components Group

UK . 1,852 parts In-Stock

1+ parts

$2.074

100+ parts

-

1k+ parts

$1.867

10k+ parts

-

1,852

$2.074

-

$1.867

-

ChromeModa Solutions

Germany . 642 parts In-Stock

1+ parts

$2.074

100+ parts

$1.701

1k+ parts

-

10k+ parts

-

642

$2.074

$1.701

-

-

Semicontronic

India . 6,419 parts In-Stock

1+ parts

$11.810

100+ parts

$11.515

1k+ parts

$11.456

10k+ parts

-

6,419

$11.810

$11.515

$11.456

-

Corphita

USA . 4,287 parts In-Stock

1+ parts

$12.501

100+ parts

-

1k+ parts

-

10k+ parts

-

4,287

$12.501

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-

-

Overview

Unlock seamless data transfer and enhance your system's performance with the SN74ACT7205L15RJ FIFO by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products that guarantee reliability and efficiency. Ideal for applications requiring fast and asynchronous operation, this FIFO chip offers a cycle time of 25 ns and a maximum clock frequency of 40 MHz. With a memory density of 73728 bits and a memory width of 9, this chip is designed to meet the demands of modern technology. Trust Texas Instruments to provide you with cutting-edge solutions for your system integration needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Cycle Time: 25 ns

The fast cycle time of 25 ns ensures quick data transfer and processing, making the product efficient in handling high-speed data.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for independent and simultaneous read and write operations, enhancing overall performance.

Nominal Supply Voltage: 5V

The nominal supply voltage of 5V ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C allows the product to function reliably in a wide range of temperature conditions.

Memory Width: 9

The memory width of 9 bits allows for efficient storage and retrieval of data, making the product suitable for applications requiring larger data transfers.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity, contributing to the product's reliability and efficiency.

Parallel or Serial: PARALLEL

The parallel data transfer mode enables faster data transmission compared to serial communication, making the product suitable for high-speed applications.

Technical Specifications

FIFO SN74ACT7205L15RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Maximum Clock Frequency (fCLK):

40 MHz

Cycle Time:

25 ns

JESD-30 Code:

R-PQCC-J32

Memory Density:

73728 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.002 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

120 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ACT7205L15RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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