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SN74ACT7200L-15DVR

Texas Instruments

SN74ACT7200L-15DVR by Texas Instruments

SN74ACT7200L-15DVR by Texas Instruments is a FIFO with 256x9 organization, 25ns cycle time, and 15ns access time. It operates asynchronously at a supply voltage of 4.5V to 5.5V. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,226 parts In-Stock

1+ parts

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9,226

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Digiode

USA . 1,965 parts In-Stock

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1,965

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 430 parts In-Stock

1+ parts

$3.858

100+ parts

-

1k+ parts

$4.343

10k+ parts

-

430

$3.858

-

$4.343

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DigiPath Technology Company

USA . 1,068 parts In-Stock

1+ parts

$4.248

100+ parts

-

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1,068

$4.248

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ChromeModa Solutions

Germany . 6,353 parts In-Stock

1+ parts

$4.335

100+ parts

$3.555

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6,353

$4.335

$3.555

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IDEA Electronic Components Group

UK . 1,203 parts In-Stock

1+ parts

$4.335

100+ parts

-

1k+ parts

$3.902

10k+ parts

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1,203

$4.335

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$3.902

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AZTECH Wire

Italy . 856 parts In-Stock

1+ parts

$14.125

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856

$14.125

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One Stop Electronics

USA . 1,335 parts In-Stock

1+ parts

$30.000

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1,335

$30.000

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Corphita

USA . 3,644 parts In-Stock

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3,644

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Overview

Enhance the efficiency of your electronics with the SN74ACT7200L-15DVR by Texas Instruments. This FIFO device, designed with precision and reliability in mind, allows for seamless data storage and retrieval in various applications. With a focus on quality and performance, Texas Instruments ensures that this product delivers unmatched value to customers. Whether you're working on industrial automation or telecommunications systems, the SN74ACT7200L-15DVR is the perfect solution for your needs. Upgrade your projects today with this top-of-the-line component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, which is ideal for portable or rugged applications.

Cycle Time: 25 ns

The fast cycle time of 25 ns ensures quick data access and processing, making the product suitable for applications requiring high-speed data handling.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for independent operation of read and write functions, providing flexibility and efficiency in data transfer.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

Memory Width: 9

The memory width of 9 bits allows for storing and accessing larger chunks of data at once, improving overall efficiency and performance.

Technical Specifications

FIFO SN74ACT7200L-15DVR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

RETRANSMIT

Cycle Time:

25 ns

JESD-30 Code:

R-PDSO-G28

Length:

18.365 mm

Memory Density:

2304 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X9

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

8.765 mm

Trade Compliance

SN74ACT7200L-15DVR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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