Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Renesas Electronics 72V2111L15PFGI FIFO operates synchronously with a cycle time of 15 ns and a clock frequency of up to 66.7 MHz. It features a memory density of 4718592 bit, suitable for industrial applications requiring fast data processing and parallel operation at temperatures ranging from -40 to 85°C.
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The use of plastic/epoxy material in the package body makes this FIFO durable and lightweight, ideal for various applications.
With the ability to be surface mounted, this FIFO can be easily integrated into circuits and PCBs, saving space and simplifying assembly processes.
The fast cycle time of 15 ns ensures quick and efficient data processing, making this FIFO suitable for high-speed applications.
The square package shape provides a compact form factor, optimizing the use of space in electronic devices and systems.
Operating in synchronous mode ensures precise data transfer and synchronization, making this FIFO reliable for critical operations.
With a nominal supply voltage of 3.3V, this FIFO is energy-efficient and compatible with standard power sources.
The use of a single power supply at 3.3V simplifies the power management system and reduces complexity in design.
The ample number of terminals (64) allows for versatile connectivity options, making this FIFO versatile in different electronic setups.
The flatpack, low profile package style saves space and ensures compatibility with various PCB layouts, enhancing the overall design flexibility.
With a maximum operating temperature of 85°C, this FIFO can withstand high heat environments, making it suitable for industrial applications.
The organization of 512KX9 offers a balanced ratio of storage capacity and data width, making this FIFO efficient for storing and retrieving data.
The low minimum operating temperature of -40°C allows this FIFO to function reliably even in harsh environmental conditions.
The matte tin terminal finish provides excellent electrical conductivity and corrosion resistance, ensuring reliable connections in the FIFO.
The quad terminal position allows for easy mounting and soldering, facilitating the integration of this FIFO into circuit boards.
The low maximum seated height of 1.6 mm saves space in electronic devices, making this FIFO suitable for compact designs.
With a high maximum clock frequency of 66.7 MHz, this FIFO can handle rapid data processing, making it ideal for high-performance applications.
The compact width of 14 mm enables this FIFO to fit into tight spaces within electronic systems, ensuring efficient use of available space.
The low minimum supply voltage requirement of 3.15V ensures flexibility in power supply options and compatibility with different voltage sources.
The high peak reflow temperature of 260°C allows for reliable soldering and rework processes, ensuring a durable connection in the FIFO.
The moderate length of 14 mm provides a balanced form factor for this FIFO, allowing for easy integration into various electronic setups.
With an industrial temperature grade, this FIFO is designed to withstand demanding environmental conditions, making it suitable for rugged applications.
The CMOS technology used in this FIFO offers low power consumption and high noise immunity, ensuring efficient and reliable operation in various settings.
Operating in parallel mode allows for simultaneous data transfer, enhancing the speed and efficiency of this FIFO in handling large volumes of data.
The gull wing terminal form provides a strong mechanical connection and easy soldering, ensuring reliable performance in the FIFO.
With a maximum supply current of 55 mA, this FIFO consumes minimal power, making it energy-efficient and cost-effective to operate.
The large number of words (524288) supported by this FIFO allows for extensive data storage and retrieval capabilities, making it suitable for data-intensive applications.
The memory width of 9 bits provides sufficient data capacity for storing and processing information, making this FIFO versatile for various operations.
The small terminal pitch of 0.8 mm enables close placement of terminals, optimizing space usage and facilitating efficient signal transmission in the FIFO.
The use of 512K words code ensures compatibility with standard memory configurations, making this FIFO easy to integrate into existing systems.
With a moisture sensitivity level of 3, this FIFO offers good protection against moisture damage, ensuring long-term reliability in humid environments.
The maximum supply voltage of 3.45V provides a safe operating range for this FIFO, protecting it from potential overvoltage conditions.
The high memory density of 4718592 bits allows for extensive data storage capacity in this FIFO, enabling efficient data management in various applications.
The use of a specialized FIFO memory IC type ensures optimized performance and compatibility with specific data processing requirements.
The presence of an output enable function allows for flexible control over data output, enhancing the versatility and functionality of this FIFO.
With a maximum standby current of 0.02 Amp, this FIFO consumes minimal power during standby mode, conserving energy and reducing operational costs.
The fast maximum access time of 10 ns ensures quick data retrieval and processing, making this FIFO efficient for time-critical applications.
FIFO 72V2111L15PFGI attributes and parameters. Explore more FIFO devices from Renesas Electronics
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72V2111L15PFGI Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Design/Specification - All Dev Label Chg 1/Dec/2022
PCN Assembly/Origin - Mult Device Assembly Site Add 26/Aug/2016
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
2N2222A
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Weitron Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
1N4148WSF-7
1N4148WSF-7 by Diodes Inc. is a single silicon rectifier diode with max output current of 0.25A and max reverse voltage of 100V. It operates b/w -55 to 150°C, has a small outline package style, and is suitable for surface mount applications in various electronic circuits.
1N4148
Rectron
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
Bkc Semiconductors
SMBJ18CA
Multicomp Pro
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
SS14
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Micropac Industries
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
72V845L15PFGI8
Integrated Device Technology
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; Maximum Access Time: 10 ns;
SN74ACT7203L-15RJR
Texas Instruments
SN74ACT7203L-15RJR by Texas Instruments is a 2Kx9 FIFO chip with 25ns cycle time, operating at 5V. It features a 3-STATE output and is designed for parallel applications. This CMOS technology device has a temperature range of 0 to 70°C, making it suitable for commercial use in various electronic systems.
SN74ACT7201LA-50RJR
SN74ACT7201LA-50RJR by Texas Instruments is a FIFO chip with 512x9 organization, 65 ns cycle time, and 3-STATE output characteristics. It operates asynchronously at a nominal voltage of 5V. This chip is commonly used in applications requiring fast data storage and retrieval in parallel processing systems.
IDT7202LA50JG
Renesas Electronics
The Renesas Electronics IDT7202LA50JG is a FIFO chip with 1Kx9 organization, operating at 65ns cycle time. It features a CMOS technology, operates asynchronously, and has a memory density of 9216 bits. This chip is commonly used in applications requiring fast data storage and retrieval, such as networking equipment and communication systems.
SN74ACT7205L-25DVR
SN74ACT7205L-25DVR by Texas Instruments is a FIFO with 8Kx9 organization, 35ns cycle time, and 25ns access time. It operates asynchronously at a supply voltage of 4.5V to 5.5V, making it ideal for high-speed parallel data storage applications in commercial temperature environments.
1M7804-20DLG4
1M7804-20DLG4 by Texas Instruments is a FIFO with 512x18 organization, operating at 50MHz clock frequency. It has a small outline package and is suitable for commercial applications requiring synchronous operation and 15ns max access time.
SN74ABT3614-15PCB
SN74ABT3614-15PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 15ns cycle time, and 66.7MHz clock frequency. It operates synchronously at 5V and features a low profile flatpack package for commercial applications requiring fast data storage and retrieval.
SN74V245-15PAGEP
SN74V245-15PAGEP by Texas Instruments is a FIFO with 4Kx18 organization, operating at 66.7MHz clock frequency. It has a cycle time of 16ns and supports a max supply voltage of 3.6V. Ideal for military-grade applications requiring fast data transfer and reliable memory storage in compact spaces.
IDT7201LA35JG
IDT7201LA35JG by Renesas Electronics is a 512x9 FIFO chip with a cycle time of 45ns. Operating in asynchronous mode, it has a memory density of 4608 bits and offers 3-STATE output characteristics. This CMOS technology-based chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V291L10TFG8
The Renesas Electronics 72V291L10TFG8 FIFO operates synchronously with a cycle time of 10 ns and a clock frequency of up to 100 MHz. With a memory density of 1179648 bit, it is ideal for applications requiring fast data processing such as networking equipment and telecommunications devices. The device features parallel operation, low profile flatpack packaging, and a max operating temperature of 70°C.
CD74HCT40105M96
CD74HCT40105M96 by Texas Instruments is a 16x4 FIFO memory IC with 64-bit memory density and 10 MHz max clock frequency. Operating at -55 to 125 °C, it's ideal for military-grade applications requiring fast data storage and retrieval. With synchronous operation and output enable feature, this CMOS technology-based device offers reliable parallel data processing in compact small outline packaging.
5962-8986305YA
Qp Semiconductor
5962-8986305YA by Qp Semiconductor is a FIFO memory with a cycle time of 40 ns. It has an organization of 512X9 and a memory density of 4608 bit. This CMOS technology device operates in an asynchronous mode and is suitable for military applications.
SN74ACT72211L-25RJR
SN74ACT72211L-25RJR by Texas Instruments is a 512x9 FIFO chip with 25ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and an output enable function. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT2235-40FNR
SN74ACT2235-40FNR by Texas Instruments is a FIFO chip with 1Kx9 organization, 40ns cycle time, and 35ns access time. It operates at 5V with output enable feature for parallel applications. Ideal for systems requiring fast data transfer and storage in commercial temperature environments.
5962-9560901NXX
Texas Instruments' 5962-9560901NXX FIFO features a cycle time of 20ns, operating at 5V with an organization of 1KX36. Ideal for military applications due to its MIL-PRF-38535 Class N screening level and CMOS technology, this synchronous device offers fast access times and a memory density of 36864 bits.
SN74ACT7202LA-35DV
SN74ACT7202LA-35DV by Texas Instruments is a 1Kx9 FIFO with 5V supply voltage, CMOS technology, and 3-STATE output. It is ideal for parallel applications requiring high-speed data transfer in compact designs due to its small outline package and gull wing terminals.
1M7805-15DLG4
1M7805-15DLG4 by Texas Instruments is a 256x18 FIFO with 67MHz clock frequency, operating at 5V. Ideal for commercial applications, it features synchronous operation and GULL WING terminals in a small outline package.
SN54ALS2232JD
SN54ALS2232JD by Texas Instruments is a 64x8 FIFO memory IC with TTL technology, operating at -55 to 125°C. It has 24 terminals in an in-line package style, suitable for military-grade applications requiring asynchronous operation at a nominal voltage of 5V.
5962-9560901NXD
The Texas Instruments 5962-9560901NXD FIFO operates synchronously at a clock frequency of up to 50 MHz with a cycle time of 20 ns. It features a memory width of 36 bits and a density of 36864 bits, making it ideal for military-grade applications requiring fast data processing and storage in harsh environments. The device is designed for parallel operation with low power consumption and high reliability, suitable for critical military systems where speed and efficiency are paramount.
SN74ACT3638-15PCBR
SN74ACT3638-15PCBR by Texas Instruments is a FIFO with 512x32 organization, 15 ns cycle time, and 3-STATE output characteristics. It operates synchronously at 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
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72V2105L10PFG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Qualification: Not Qualified;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 262144 words;
72V2113L6PFG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Memory Width: 18;
72V2105L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
72V2111L15PFGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 524288 words;
72V2111L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Standby Current: .02 Amp;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
72V211L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, LOW PROFILE;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 512 words;
72V2111L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Functions: 1;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 3.15 V;
72V211L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Memory Density: 4608 bit;
72V241L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Surface Mount: YES;
72V241L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
72V2111L15PFG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Access Time: 10 ns;
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