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SN54LS228W

Texas Instruments

SN54LS228W by Texas Instruments

SN54LS228W by Texas Instruments is a 16x4 FIFO memory IC with TTL technology. It operates asynchronously at temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. This flatpack package features 16 terminals on a rectangular ceramic body, designed for surface mount installation with a terminal pitch of 1.27mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,575 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,575

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Digiode

USA . 826 parts In-Stock

1+ parts

-

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1k+ parts

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826

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 295 parts In-Stock

1+ parts

$4.356

100+ parts

-

1k+ parts

$4.772

10k+ parts

-

295

$4.356

-

$4.772

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DigiPath Technology Company

USA . 1,561 parts In-Stock

1+ parts

$4.796

100+ parts

$4.412

1k+ parts

-

10k+ parts

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1,561

$4.796

$4.412

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ChromeModa Solutions

Germany . 2,073 parts In-Stock

1+ parts

$4.894

100+ parts

$4.013

1k+ parts

-

10k+ parts

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2,073

$4.894

$4.013

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IDEA Electronic Components Group

UK . 1,792 parts In-Stock

1+ parts

$4.894

100+ parts

-

1k+ parts

$4.405

10k+ parts

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1,792

$4.894

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$4.405

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AZTECH Wire

Italy . 749 parts In-Stock

1+ parts

$18.885

100+ parts

-

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749

$18.885

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One Stop Electronics

USA . 1,210 parts In-Stock

1+ parts

$25.000

100+ parts

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10k+ parts

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1,210

$25.000

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Corphita

USA . 1,585 parts In-Stock

1+ parts

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1,585

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Overview

Enhance your electronic projects with Texas Instruments' SN54LS228W FIFO memory IC. Designed with precision and reliability in mind, this product offers seamless asynchronous operation in a compact rectangular package. Ideal for military-grade applications, this flatpack memory IC boasts a 16x4 organization and TTL technology for optimal performance. Trust Texas Instruments for quality components that deliver exceptional value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides durability and reliability, making the product suitable for harsh operating environments.

Surface Mount: YES

Surface mount design allows for easy installation and integration onto circuit boards.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables independent access to the data stored, allowing for flexible data management.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand elevated temperatures without compromising performance.

Technology: TTL

TTL technology offers a reliable and efficient way to manage data transfer within the FIFO product.

Technical Specifications

FIFO SN54LS228W attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Memory IC Type:

Memory Width:

4

No. of Terminals:

16

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

16X4

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

FIFOs

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

FLAT

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN54LS228W Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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