Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SN54ACT7811GB by Texas Instruments is a FIFO with 1KX18 organization, 28.5 MHz clock frequency, and 35.08 ns cycle time. Ideal for military applications requiring a memory density of 18432 bit, it operates synchronously at temperatures ranging from -55 to 125 °C.
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$16.033
Corphita
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This material combination ensures durability and protection for the internal components of the FIFO, making it suitable for harsh environments.
The fast cycle time of 35.08 ns allows for efficient data processing and transfer, making the FIFO ideal for high-speed applications.
The synchronous operation mode ensures precise data transfer and synchronization, making the FIFO reliable for real-time applications.
With a high maximum operating temperature of 125°C, this FIFO can withstand elevated temperatures without compromising performance.
The use of CMOS technology ensures low power consumption and high noise immunity, making the FIFO energy-efficient and reliable for data storage and retrieval.
FIFO SN54ACT7811GB attributes and parameters. Explore more FIFO devices from Texas Instruments
Maximum Access Time:
Maximum Clock Frequency (fCLK):
Cycle Time:
JESD-30 Code:
Length:
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Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
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Temperature Grade:
Terminal Form:
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Maximum Time At Peak Reflow Temperature (s):
Width:
SN54ACT7811GB Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N2222A
Telcom Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Philips Components
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
1N4148
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
NE555DR
Texas Instruments
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
Vishay Sprague
NPN; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JEDEC-95 Code: TO-18; Maximum Collector-Emitter Voltage: 40 V;
1N4148WS
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
SMBJ18CA
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
Synsemi
LM317T
Linear Technology
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Operating Temperature (TJ-Min): 0 Cel; No. of Functions: 1; JESD-609 Code: e0;
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SN74ACT2236-60PM
SN74ACT2236-60PM by Texas Instruments is a 2Kx9 FIFO with 64 terminals and operates at 5V. It features a CMOS technology, parallel interface, and 3-STATE output. Ideal for applications requiring high-speed data transfer in compact electronic devices.
SN54ACT7811HVR
SN54ACT7811HVR by Texas Instruments is a 1Kx18 FIFO with synchronous operation and 35.08 ns cycle time. It features a 3-STATE output, operates in parallel mode, and has a memory density of 18432 bits. Ideal for military applications requiring fast data transfer and reliable storage in harsh environments.
IDT7203L15PI
Integrated Device Technology
IDT7203L15PI by Integrated Device Technology is a FIFO memory chip with 2Kx9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can function in industrial temperature ranges. This chip is suitable for applications requiring fast data storage and retrieval in parallel processing systems.
SN74ACT72211L35RJ
SN74ACT72211L35RJ by Texas Instruments is a 512x9 FIFO chip with synchronous operation and 5V nominal voltage. It features a memory density of 4608 bits, operates in commercial temperature grade up to 70°C, and supports parallel data transfer. This chip is commonly used in applications requiring high-speed data buffering and storage.
IDT72V845L15PFI8
IDT72V845L15PFI8 by Integrated Device Technology is a FIFO memory with 4Kx18 organization, 15ns cycle time, and operates at 3.3V. It is suitable for industrial applications requiring fast access times and parallel data transfer, featuring a low profile flatpack package with gull wing terminals.
SN74ABT7819-15PN
SN74ABT7819-15PN by Texas Instruments is a FIFO memory with 512x18 organization, operating at 67 MHz clock frequency. It features 3-STATE output characteristics and synchronous operation mode. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V243L7-5PFGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Length: 14 mm;
SN54ALS235FK
SN54ALS235FK by Texas Instruments is a FIFO chip with 64x5 organization, operating at 25 MHz clock frequency. It features a cycle time of 50 ns and can function in asynchronous mode. This military-grade IC has a memory density of 320 bit and is suitable for parallel applications requiring fast access times.
7201LA12JG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
72V241L10PFG8
Renesas Electronics
The Renesas Electronics 72V241L10PFG8 FIFO operates in synchronous mode with a cycle time of 10 ns and a clock frequency of 100 MHz. It has a memory density of 36864 bit, suitable for applications requiring fast data access such as networking equipment and telecommunications devices.
SN74ACT2235-20PAG
Texas Instruments SN74ACT2235-20PAG FIFO operates at 50MHz with 1Kx9 organization and 20ns cycle time. Suitable for parallel applications, it features a 64-terminal flatpack package with a thin profile and fine pitch, ideal for commercial use in systems requiring bi-directional FIFO memory ICs.
SN74ACT3642-15PQ
SN74ACT3642-15PQ by Texas Instruments is a 1Kx36 CMOS FIFO memory with 15ns cycle time, operating at 5V. It features a max clock frequency of 66.7MHz and offers bi-directional parallel data transfer. This device is ideal for applications requiring fast synchronous data storage and retrieval in commercial temperature environments.
SN74ACT72235-40FNR
SN74ACT72235-40FNR by Texas Instruments is a FIFO chip with 1Kx9 organization, 40ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and communication systems. The chip comes in a square plastic/epoxy package with 44 terminals for surface mounting.
7200L25JI8
7200L25JI8 by Integrated Device Technology is a FIFO chip carrier with 256x9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. Ideal for industrial applications requiring fast access times and parallel memory technology.
IDT72V05L25JGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Organization: 8KX9;
7202
Teledyne E2v (Uk)
FIFOs;
SN74ACT3642-20PQ
SN74ACT3642-20PQ by Texas Instruments is a 1Kx36 BI-DIRECTIONAL FIFO with 20ns cycle time, operating at 5V. It features a max clock frequency of 50MHz and offers 3-STATE output characteristics. Ideal for applications requiring fast synchronous data transfer in commercial temperature environments.
SN74ACT7205L-50RJR
SN74ACT7205L-50RJR by Texas Instruments is a FIFO chip with 8Kx9 organization, 65ns cycle time, and 50ns access time. It operates asynchronously at a supply voltage of 4.5V to 5.5V, suitable for commercial temperature grades. Ideal for applications requiring fast data storage and retrieval in parallel processing systems.
SN74ACT7204L35NP
SN74ACT7204L35NP by Texas Instruments is a 4Kx9 FIFO with CMOS technology. It operates asynchronously at 5V, has a memory density of 36864 bits, and supports parallel data transfer. This rectangular package with 28 terminals is ideal for commercial applications requiring fast and efficient data storage and retrieval.
5962-8952305EA
Cypress Semiconductor
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Cycle Time: 100 ns;
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TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
SN54ACT7881HVR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFF; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SN54ACT3632HFPR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFF; Package Shape: SQUARE; Output Characteristics: 3-STATE;
SN54ABT3614PCBR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: HLFQFP; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFF; Package Shape: SQUARE; Terminal Form: FLAT;
SN54ACT3641PCB
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: LFQFP; Package Shape: SQUARE; Qualification: Not Qualified;
SN54ABT7820GB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: PGA; Package Shape: SQUARE; Maximum Access Time: 18 ns;
SN54ACT7881PN
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SN54ABT3614HFP
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFF; Package Shape: SQUARE; No. of Words Code: 64;
SN54ACT3641HFP
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFF; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
SN54ABT7819GB
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: PGA; Package Shape: SQUARE; Minimum Operating Temperature: -55 Cel;
SN54ACT7811HV
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFF; Package Shape: SQUARE; Package Equivalence Code: QFL68,.5SQ,25;
SN54ACT3641PCBR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: LFQFP; Package Shape: SQUARE; Output Characteristics: 3-STATE;
SN54ABT7819HTR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: QFF; Package Shape: SQUARE; Organization: 512X18;
SN54ACT7881HV
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFF; Package Shape: SQUARE; Output Enable: YES;
SN54ABT3614PCB
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 120; Package Code: HLFQFP; Package Shape: SQUARE; Additional Features: PARITY GENERATOR/CHECKER, MAILBOX;
SN54ACT3632HFP
BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFF; Package Shape: SQUARE; Technology: CMOS;
SN54ABT3614GB
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: PGA; Package Shape: SQUARE; JESD-30 Code: S-CPGA-P132;
SN54ABT3614HFPR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 132; Package Code: QFF; Package Shape: SQUARE; JESD-30 Code: S-GQFP-F132;
SN54ABT7819HT
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 84; Package Code: QFF; Package Shape: SQUARE; Width: 16.51 mm;
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