Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
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Nova Conductors
Ampacity Inc.
$2.000
AZTECH Wire
$12.411
Argo Parts USA
Continental Prestige Electronics
Aranea Global
7201LA35JG8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
LL4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Semtech Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
SS14
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MURS160T3G
Onsemi
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
BAV99LT1G
BAV99LT1G by Onsemi is a series connected diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.006 us and can handle up to 100V repetitive peak reverse voltage. Ideal for rectification applications, this diode operates b/w -65°C to 150°C temperature range.
FDV304P
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
2N2222A
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Laube Technology
New Jersey Semiconductor Products
Cheng-yi Electronic
SZNUP2105LT1G
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
SN74ACT3651-20PCBR
SN74ACT3651-20PCBR by Texas Instruments is a FIFO with 2KX36 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and storage, such as networking equipment and communication systems.
CD74HC40105M96
CD74HC40105M96 by Texas Instruments is a FIFO memory with 16x4 organization, 64-bit memory density, and 10 MHz clock frequency. It operates in synchronous mode with a cycle time of 500 ns and has a temperature range of -55 to 125°C. Ideal for military applications requiring fast data storage and retrieval.
IDT72V2111L10PFG8
Integrated Device Technology
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Qualification: Not Qualified;
SN74ACT7202LA-25DVR
SN74ACT7202LA-25DVR by Texas Instruments is a FIFO with 1KX9 organization, 35 ns cycle time, and 3-STATE output characteristics. It operates asynchronously at a nominal voltage of 5V. This device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7208L20JG
Renesas Electronics
Renesas Electronics 7208L20JG is a FIFO chip carrier with 64KX9 organization, operating at 33.3 MHz clock frequency. It has a memory density of 589824 bit and supports parallel operation. Ideal for applications requiring fast data processing in commercial temperature environments.
SN74ACT7202-50N
SN74ACT7202-50N by Texas Instruments is a FIFO with 1KX9 organization, 65 ns cycle time, and 15 MHz max clock frequency. Ideal for applications requiring fast synchronous operation in commercial temperature grades.
SN74ACT72235-30PMR
SN74ACT72235-30PMR by Texas Instruments is a FIFO with 1KX9 organization, 9216 bit memory density, and 30.3 ns cycle time. It operates synchronously at 5V and has a max access time of 25 ns. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT72V05L25JGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
72V255LA10PFG8
The Renesas Electronics 72V255LA10PFG8 FIFO features a cycle time of 10 ns, operating at a max clock frequency of 100 MHz. With an organization of 8KX18, it is suitable for applications requiring fast data processing and synchronization. This FIFO operates on a nominal voltage of 3.3 V and has a memory density of 147456 bit, making it ideal for commercial-grade projects with parallel data transfer needs.
72V05L15JG
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; JESD-30 Code: R-PQCC-J32;
SN74ACT7204L-50DV
SN74ACT7204L-50DV by Texas Instruments is a FIFO memory with 4Kx9 organization, 65ns cycle time, and 15MHz clock frequency. It operates at 5V, has a small outline package style, and is ideal for parallel data storage applications in commercial temperature environments.
SN74ACT7206L-15NP
SN74ACT7206L-15NP by Texas Instruments is a 16KX9 FIFO with 25ns cycle time, 40MHz clock frequency, and 147456-bit memory density. It operates at 5V, has a temperature range of 0-70°C, and is ideal for parallel data storage applications.
72V3664L10PFG8
The Renesas Electronics 72V3664L10PFG8 is a FIFO memory IC with 4Kx36 organization, operating at 3.3V. It features a cycle time of 10ns and synchronous operation mode, suitable for applications requiring fast data processing in commercial temperature environments. The device has a memory density of 147456 bits and supports parallel access with an output enable feature for efficient data retrieval.
72V263L7-5BCGI8
The Renesas Electronics 72V263L7-5BCGI8 is a FIFO memory with 8Kx18 organization, operating at 3.3V. It features a cycle time of 7.5ns and offers parallel access mode. This low-profile grid array package is ideal for industrial applications requiring fast data processing and high memory density.
72V3650L6PFG8
The Renesas Electronics 72V3650L6PFG8 FIFO operates synchronously with a cycle time of 6 ns and clock frequency up to 166 MHz. It has an organization of 2KX36, suitable for applications requiring fast data processing such as networking equipment and telecommunications systems. With a low profile flatpack package style, it offers parallel operation with output enable functionality.
IDT72V05L25JI
IDT72V05L25JI by Integrated Device Technology is a FIFO chip with 8Kx9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is designed for industrial applications requiring fast data storage and retrieval in parallel mode, featuring a memory density of 73728 bits and low standby current consumption of 0.005Amp.
FT245RQ-TUBE
FTDI
IDT72V271LA10PFG8
The Renesas Electronics IDT72V271LA10PFG8 FIFO features 32Kx9 organization, 10ns cycle time, and 3.3V nominal voltage. Ideal for applications requiring fast synchronous operation in commercial temperature environments.
SN74ABT7819-15PNR
SN74ABT7819-15PNR by Texas Instruments is a FIFO with 512x18 organization, operating at 5V. It features a cycle time of 14.92ns, synchronous mode, and 3-STATE output characteristics. This device is suitable for applications requiring fast data storage and retrieval in commercial temperature environments.
CY7C4255V-15ASXC
Cypress Semiconductor
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; No. of Functions: 1;
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7201LA15SOGI8
Renesas Electronics' 7201LA15SOGI8 FIFO features 512x9 organization, 25ns cycle time, and operates at a nominal voltage of 5V. Ideal for industrial applications requiring fast data access with parallel operation in a compact small outline package.
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
7201LA15JGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Output Enable: NO;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Additional Features: RETRANSMIT;
7201LA15JGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
7201LA12JG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
7201LA12SOG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Cycle Time: 20 ns;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN;
7201LA15JI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
7201LA15SOGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
7201LA25JGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
Renesas Electronics 7201LA25JGI8 FIFO chip features 512x9 organization, 35ns cycle time, and operates at 5V. Ideal for industrial applications requiring fast parallel access memory with a memory density of 4608 bits. The chip is designed in a rectangular chip carrier package style for surface mount assembly.
7201LA25SOI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 4608 bit;
7201LA35JG8
7201LA35SOG8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
7201LA15DGI
BI-DIRECTIONAL FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
7201LA35F
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DFP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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