Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BI-DIRECTIONAL FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
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FIFO 7201LA15DGI attributes and parameters. Explore more FIFO devices from Renesas Electronics
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7201LA15DGI Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
LM317AEMP/NOPB
Texas Instruments
LM317AEMP/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and a max output current of 1.5A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in a compact package.
1N4148
Microchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMMBT2222ALT1G
SMMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, 0.6A IC, and 40V VCE. It has a hFE of 75, fT of 300MHz, and operates up to 150°C. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance.
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
EU2B-YS3103F
Idec
ROTARY SWITCH;
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
LL4148
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM317LMX/NOPB
LM317LMX/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max input-output voltage differential of 40V. It operates in temperatures ranging from -40°C to 125°C and has a max output current of 0.1A, making it suitable for various applications requiring precise voltage regulation.
2N7002
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
SN74ACT3622-15PCBR
SN74ACT3622-15PCBR by Texas Instruments is a FIFO with 256x36 organization, 15 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 9216-bit memory density.
SN74ACT7206L50RJ
SN74ACT7206L50RJ by Texas Instruments is a FIFO chip with 16Kx9 organization, operating at 15 MHz with a cycle time of 65 ns. It has a memory density of 147456 bits and is suitable for applications requiring fast asynchronous data transfer in commercial temperature environments.
SN74ABT3611-15PCB
SN74ABT3611-15PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 15ns cycle time, and 66.7MHz clock frequency. It operates synchronously at 5V and has a low profile flatpack package style. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN54ABT7820GB
SN54ABT7820GB by Texas Instruments is a 512x18 BI-DIRECTIONAL FIFO memory IC with 3-STATE output characteristics. It operates at a max clock frequency of 40 MHz and has a cycle time of 25 ns, making it suitable for high-speed data buffering applications in military-grade systems.
SN74ABT3613-30PCB
SN74ABT3613-30PCB by Texas Instruments is a FIFO memory with 64x36 organization, 30 ns cycle time, and 33.4 MHz clock frequency. It operates synchronously at 5V and has a low profile flatpack package suitable for commercial temperature grade applications.
7202LA15JGI
Integrated Device Technology
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
SN74ACT2235-40FNR
SN74ACT2235-40FNR by Texas Instruments is a FIFO chip with 1Kx9 organization, 40ns cycle time, and 35ns access time. It operates at 5V with output enable feature for parallel applications. Ideal for systems requiring fast data transfer and storage in commercial temperature environments.
IDT72V05L25JGI8
Renesas Electronics
The Renesas Electronics IDT72V05L25JGI8 is a FIFO chip with 8Kx9 organization, operating at 28.5MHz clock frequency and 35ns cycle time. It is designed for industrial applications requiring fast asynchronous data storage and retrieval in parallel mode, with a memory density of 73728 bits.
SN74ABT7819A-30PN
SN74ABT7819A-30PN by Texas Instruments is a FIFO memory IC with 512Kx18 organization, operating at 33.3MHz cycle time. It features a 5V nominal voltage and synchronous operation mode, suitable for applications requiring fast data storage and retrieval in commercial temperature environments.
CD40105BF3AS2283
CD40105BF3AS2283 by Texas Instruments is a 16X4 FIFO with 64-bit memory density. Operating at -55 to 125 °C, it has an access time of 420 ns and supports parallel data transfer. Ideal for military applications requiring fast and reliable data storage and retrieval.
SN54LS222W
SN54LS222W by Texas Instruments is a 16x4 FIFO memory IC operating at 5V, with a temperature range of -55°C to 125°C. It features asynchronous operation, flatpack package style, and dual terminal position. Ideal for military-grade applications requiring reliable data storage and retrieval in harsh environments.
SN74ABT7819A-30PH
SN74ABT7819A-30PH by Texas Instruments is a 512KX18 BI-DIRECTIONAL FIFO with 30 ns cycle time, operating at 33.3 MHz clock frequency. It features synchronous operation and GULL WING terminals, suitable for applications requiring fast data transfer and memory management in commercial-grade environments.
CD74HCT40105M
Harris Semiconductor
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
72V265LA10PFG8
72V265LA10PFG8 by Renesas Electronics is a FIFO with 16Kx18 organization, operating at 100MHz clock frequency. It has a cycle time of 10ns and operates in synchronous mode. This device is suitable for applications requiring fast data processing and memory management in commercial-grade environments.
IDT7208L25JGI8
The Renesas Electronics IDT7208L25JGI8 is a FIFO chip with 64KX9 organization, operating at 35ns cycle time. It features asynchronous mode, CMOS technology, and parallel interface. Ideal for industrial applications requiring fast data storage and retrieval in a compact 32-terminal chip carrier package.
SN74ABT7819A-10PH
SN74ABT7819A-10PH by Texas Instruments is a 512Kx18 BI-DIRECTIONAL FIFO with 10ns cycle time, operating at up to 100MHz clock frequency. It features synchronous operation, parallel interface, and GULL WING terminals. Ideal for applications requiring fast data transfer and memory management in commercial-grade environments.
SN74ABT3611-15PCBR
SN74ABT3611-15PCBR by Texas Instruments is a FIFO with 64x36 organization, 15 ns cycle time, and 3-STATE output characteristics. It operates synchronously at 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT72V2111L10PFG8
IDT72V2111L10PFG8 by Renesas Electronics is a 512Kx9 FIFO with synchronous operation and 10ns cycle time. It features a low profile flatpack package, operates at temperatures from 0 to 70 °C, and has a memory density of 4718592 bits. Ideal for applications requiring fast data transfer and storage in commercial-grade environments.
SN74ABT7819-30PH
SN74ABT7819-30PH by Texas Instruments is a 512x18 FIFO with a cycle time of 30.03 ns and max clock frequency of 33.3 MHz. It operates synchronously, has a memory density of 9216 bit, and is ideal for commercial applications requiring fast data storage and retrieval.
SN74ACT7204L20NP
SN74ACT7204L20NP by Texas Instruments is a 4Kx9 FIFO with CMOS technology. It operates asynchronously at 5V, offering 36864 bits memory density. Ideal for applications requiring high-speed data buffering in commercial temperature environments.
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7201LA15SOGI8
Renesas Electronics' 7201LA15SOGI8 FIFO features 512x9 organization, 25ns cycle time, and operates at a nominal voltage of 5V. Ideal for industrial applications requiring fast data access with parallel operation in a compact small outline package.
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
7201LA15JGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Output Enable: NO;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Additional Features: RETRANSMIT;
7201LA15JGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
7201LA12JG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
7201LA12SOG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Cycle Time: 20 ns;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN;
7201LA15JI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
7201LA15SOGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
7201LA25JGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
Renesas Electronics 7201LA25JGI8 FIFO chip features 512x9 organization, 35ns cycle time, and operates at 5V. Ideal for industrial applications requiring fast parallel access memory with a memory density of 4608 bits. The chip is designed in a rectangular chip carrier package style for surface mount assembly.
7201LA25SOI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 4608 bit;
7201LA35JG8
FIFOs;
7201LA35SOG8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
7201LA15PI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 20;
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