Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
NXP Semiconductors' 74HC40105DB,112 is a FIFO IC with 16x4 organization, operating at 33MHz clock frequency. It features a cycle time of 71.428ns and can handle a max access time of 600ns. Ideal for automotive applications due to its temperature grade and memory width of 4 bits.
Median Price
$1.420
Lifecycle Status
Suppliers In-Stock
8
In-Stock Inventory
1k+
Rochester
1+ parts
-
100+ parts
1k+ parts
$1.180
10k+ parts
$1.050
DigiKey
$0.620
Verical
$1.475
$1.313
Nova Conductors
$0.560
Digiode
$0.566
Anansix
VNN
Vyrian
Corphita
$0.536
Argo Parts USA
$0.543
Continental Prestige Electronics
$0.548
Netroflash
Component Stockers USA
$0.610
$0.580
$0.520
Ampacity Inc.
$1.100
Corohmni
$2.854
Microchip USA
$4.030
Advanced Electronics
$4.790
$4.359
$3.928
QUARKTWIN TECHNOLOGY LTD
Perfect Parts
UNI Independent Distributors
This material is durable and lightweight, making the product suitable for various applications without adding unnecessary weight.
Being surface mountable allows for easy and efficient integration into circuit boards, saving space and simplifying the assembly process.
The fast cycle time ensures efficient data transfer operations, making this FIFO a high-performance solution.
The asynchronous operation mode allows for flexible and independent operation, enhancing overall system efficiency.
The 4.5V supply voltage offers a good balance between power efficiency and performance, making it suitable for a wide range of applications.
This dual voltage compatibility allows for versatile and adaptable power requirements, ensuring compatibility with different systems.
The 16 terminals provide ample connectivity options, allowing for easy integration and signal routing in complex systems.
With a high operating temperature range, this FIFO can withstand harsh environmental conditions, making it suitable for automotive and industrial applications.
The wide temperature range ensures reliable operation even in extreme cold environments, enhancing the product's durability and versatility.
This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.
The high clock frequency allows for fast data processing and efficient operation, making this FIFO suitable for high-speed applications.
The compact width saves space on the PCB while still providing enough room for terminal connections, making it an ideal choice for compact designs.
The low minimum supply voltage ensures energy efficiency and compatibility with low-power systems, making it suitable for a wide range of applications.
With a high peak reflow temperature, this FIFO can withstand the reflow soldering process, ensuring reliable assembly and long-term performance.
The automotive temperature grade ensures reliable operation in automotive environments, making this FIFO suitable for automotive applications.
The CMOS technology offers low power consumption and high noise immunity, making this FIFO energy-efficient and reliable in noisy environments.
The parallel operation allows for simultaneous data transfer, providing fast and efficient communication between the FIFO and other components.
The fast access time ensures quick retrieval of data, enhancing overall system performance and responsiveness.
FIFO 74HC40105DB,112 attributes and parameters. Explore more FIFO devices from NXP Semiconductors
Maximum Access Time:
Maximum Clock Frequency (fCLK):
Cycle Time:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
74HC40105DB,112 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
1N4148
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 200 Cel; No. of Elements: 1;
SMBJ18CA
Shenzhen Socay Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
EU2B-YS3203C
Idec
ROTARY SWITCH;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
DP83848IVVX/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
DS18B20Z
Maxim Integrated
DS18B20Z by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring precise temperature monitoring in compact spaces.
2N2222A
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
LL4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
NE555D
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM317T
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
CY7C4255V-15ASXC
Infineon Technologies
Infineon's CY7C4255V-15ASXC FIFO features 8Kx18 organization, 15ns cycle time, and 66.7MHz clock frequency. Ideal for applications requiring fast synchronous operation in commercial temperature grades.
SN74ACT7204L50RJ
Texas Instruments
SN74ACT7204L50RJ by Texas Instruments is a FIFO chip with 4Kx9 organization, operating at 15MHz clock frequency. It has a cycle time of 65ns and operates on a 5V supply voltage. This CMOS technology chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT7203L-25DV
SN74ACT7203L-25DV by Texas Instruments is a FIFO with 2KX9 organization, 35 ns cycle time, and 28.5 MHz clock frequency. It operates at 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7203L12JG
Renesas Electronics
Renesas Electronics 7203L12JG FIFO chip features 2Kx9 organization, 20ns cycle time, and operates at a max clock frequency of 50MHz. Ideal for applications requiring high-speed data buffering in commercial-grade environments.
SN74ACT2226DWR
SN74ACT2226DWR by Texas Instruments is a FIFO with 64x1 organization, operating at 60MHz clock frequency. It has a cycle time of 45.45ns and can function in industrial temperature grades. This device is ideal for applications requiring high-speed data storage and retrieval in compact electronic systems.
SN74ACT72231L35RJ
SN74ACT72231L35RJ by Texas Instruments is a 2Kx9 FIFO chip with CMOS technology. It operates synchronously at 5V, with a memory density of 18432 bits and output enable feature. This rectangular chip carrier package is surface mountable and suitable for commercial temperature grades in applications requiring parallel data transfer.
72V05L15JG
Integrated Device Technology
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; JESD-30 Code: R-PQCC-J32;
SN74ABT3611-30PQR
SN74ABT3611-30PQR by Texas Instruments is a FIFO with 64x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and storage, such as networking equipment and communication systems.
SN74ABT7820-15PN
SN74ABT7820-15PN by Texas Instruments is a FIFO memory IC with 512x18 organization, 15 ns cycle time, and 67 MHz clock frequency. It operates synchronously at 5V and features a low profile flatpack package. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT3631-20PCB
Texas Instruments SN74ACT3631-20PCB FIFO operates synchronously at 50MHz with 512x36 organization. It has a cycle time of 20ns, suitable for applications requiring fast data transfer and storage in commercial-grade environments. The device features a 3-STATE output characteristic and supports parallel operation with a memory width of 36 bits.
IDT7202LA50JG
The Renesas Electronics IDT7202LA50JG is a FIFO chip with 1Kx9 organization, operating at 65ns cycle time. It features a CMOS technology, operates asynchronously, and has a memory density of 9216 bits. This chip is commonly used in applications requiring fast data storage and retrieval, such as networking equipment and communication systems.
SN74ACT72221L-15RJR
SN74ACT72221L-15RJR by Texas Instruments is a FIFO chip with 1KX9 organization, 15 ns cycle time, and 3-STATE output characteristics. It operates synchronously at 5V and is used in applications requiring fast data storage and retrieval in parallel mode.
72V255LA15PFI8
72V255LA15PFI8 by Integrated Device Technology is a FIFO with 8Kx18 organization, operating at 66.7MHz clock frequency and 15ns cycle time. It is suitable for industrial applications requiring fast data processing and synchronous operation in a compact flatpack package style.
IDT72801L15PFI8
IDT72801L15PFI8 by Integrated Device Technology is a FIFO with 256x9 organization, operating at 66.7 MHz with a cycle time of 15 ns. It features synchronous operation and is suitable for industrial applications requiring fast data storage and retrieval. The device has a low profile flatpack package style, operates at temperatures ranging from -40 to 85 °C, and supports parallel communication.
7201LA25SOI8
7201LA25SOI8 by Integrated Device Technology is a FIFO memory with 512x9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is designed for industrial applications requiring fast data storage and retrieval in a compact small outline package.
IDT7201LA25SOI8
Rochester Electronics
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
SN74ACT2236-30PAG
SN74ACT2236-30PAG by Texas Instruments is a 64-terminal FIFO with 2Kx9 organization, operating at 5V. It features a flatpack, thin profile package and offers 3-state output characteristics. Ideal for synchronous applications requiring high memory density and parallel data transfer in compact spaces.
SN74ACT3631-15PCBR
SN74ACT3631-15PCBR by Texas Instruments is a FIFO with 512x36 organization, 15 ns cycle time, and operates at 5V. It is used in applications requiring fast data transfer and storage, such as networking equipment and communication systems.
IDT7201LA35JG
IDT7201LA35JG by Renesas Electronics is a 512x9 FIFO chip with a cycle time of 45ns. Operating in asynchronous mode, it has a memory density of 4608 bits and offers 3-STATE output characteristics. This CMOS technology-based chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7202LA25TPI
7202LA25TPI by Integrated Device Technology is a FIFO with 1KX9 organization, 35 ns cycle time, and 28.5 MHz clock frequency. Ideal for industrial applications requiring fast data storage and retrieval in an asynchronous operating mode. Package style is in-line with through-hole terminals, suitable for parallel data processing systems.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
74HC40105D,652
74HC40105D,652 by NXP Semiconductors is a FIFO memory IC with a cycle time of 71.428 ns and an operating mode of asynchronous. It is commonly used in automotive applications due to its temperature grade and moisture sensitivity level.
Nexperia
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
74HC40105D,653
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 9.9 mm;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 14 MHz;
74HC40105N
Philips Semiconductors
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T16;
74HC40105N,652
74HC40105N,652 by NXP Semiconductors is a FIFO IC with 16x4 organization, operating at 14 MHz clock frequency. It has a cycle time of 71.428 ns and supports an asynchronous mode. This CMOS technology device is ideal for automotive applications due to its wide temperature range and memory width of 4 bits.
74HC40105PW,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
74HC40105PW,118
74HC40105PW,118 by NXP Semiconductors is a FIFO device with a cycle time of 71.428 ns and an operating mode of asynchronous. It has a memory width of 4 and can be used in automotive applications due to its temperature grade.
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Access Time: 600 ns;
74HC7403D,512
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Access Time: 98 ns;
74HC40105NB
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Width: 7.62 mm;
74HC40105D
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
74HC40105PW
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
74HC40105PW-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
74HC40105DB,118
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
74HC40105DB-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2 V;
74HC40105D-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved