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74HC40105PW,112

NXP Semiconductors

74HC40105PW,112 by NXP Semiconductors

NXP Semiconductors' 74HC40105PW,112 FIFO chip features 16x4 organization, 33 MHz clock frequency, and 600 ns access time. Ideal for automotive applications, it operates in parallel mode with a supply voltage range of 2-6V.

Median Price

$1.475

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,114 parts In-Stock

1+ parts

-

100+ parts

$1.420

1k+ parts

$1.180

10k+ parts

$1.050

5,114

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$1.420

$1.180

$1.050

DigiKey

USA . 5,114 parts In-Stock

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$1.780

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$1.780

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Verical

USA . 2,400 parts In-Stock

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$1.475

10k+ parts

$1.313

2,400

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$1.475

$1.313

Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

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$0.560

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200

$0.560

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Digiode

USA . 3,083 parts In-Stock

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$0.566

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Vyrian

USA . 8,615 parts In-Stock

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VNN

France . 1,246 parts In-Stock

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Anansix

USA . 194 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,990 parts In-Stock

1+ parts

$0.536

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2,990

$0.536

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Continental Prestige Electronics

USA . 6,204 parts In-Stock

1+ parts

$0.560

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$0.548

6,204

$0.560

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$0.548

Argo Parts USA

USA . 3,727 parts In-Stock

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$0.560

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$0.543

3,727

$0.560

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$0.543

Netroflash

USA . 50 parts In-Stock

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$0.560

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$0.548

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50

$0.560

$0.548

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Component Stockers USA

USA . 6,907 parts In-Stock

1+ parts

$0.600

100+ parts

$0.570

1k+ parts

$0.510

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6,907

$0.600

$0.570

$0.510

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AZTECH Wire

Italy . 5,180 parts In-Stock

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$0.730

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$0.730

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Ampacity Inc.

Singapore . 3,720 parts In-Stock

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$1.100

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Microchip USA

USA . 1,031 parts In-Stock

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UNI Independent Distributors

Spain . 983 parts In-Stock

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Supply Digital

USA . 968 parts In-Stock

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Overview

Elevate your electronic designs with the high-quality 74HC40105PW,112 FIFO by NXP Semiconductors. This compact and versatile component offers seamless operation in a wide range of applications, from automotive systems to consumer electronics. With a reliable manufacturer like NXP Semiconductors behind it, you can trust that this FIFO will deliver exceptional performance and reliability. Experience the value and benefits of this product today, and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight yet durable, making the product suitable for various applications without adding unnecessary weight.

Cycle Time: 71.428 ns

The fast cycle time ensures quick and efficient operation of the FIFO, allowing for rapid data transfer and processing.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for independent operation of the FIFO, making it versatile and adaptable to different systems.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V provides a stable power source for the FIFO, ensuring reliable performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the FIFO to function effectively in various environments, including potentially hot conditions.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, enhancing the efficiency of the FIFO.

Output Enable: YES

The presence of an output enable feature provides control over data output, allowing for more flexibility in data management and processing.

Technical Specifications

FIFO 74HC40105PW,112 attributes and parameters. Explore more FIFO devices from NXP Semiconductors

Specs

Maximum Access Time:

600 ns

Maximum Clock Frequency (fCLK):

33 MHz

Cycle Time:

71.428 ns

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Memory Density:

64 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16X4

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74HC40105PW,112 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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