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74HC40105D,652

NXP Semiconductors

74HC40105D,652 by NXP Semiconductors

74HC40105D,652 by NXP Semiconductors is a FIFO memory IC with a cycle time of 71.428 ns and an operating mode of asynchronous. It is commonly used in automotive applications due to its temperature grade and moisture sensitivity level.

Median Price

$1.141

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 30 parts In-Stock

1+ parts

$1.020

100+ parts

$0.694

1k+ parts

$0.575

10k+ parts

$0.537

30

$1.020

$0.694

$0.575

$0.537

Rochester

USA . 1,262 parts In-Stock

1+ parts

-

100+ parts

$1.120

1k+ parts

$0.930

10k+ parts

$0.829

1,262

-

$1.120

$0.930

$0.829

DigiKey

USA . 1,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.400

10k+ parts

-

1,262

-

-

$1.400

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Verical

USA . 936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.162

10k+ parts

$1.036

936

-

-

$1.162

$1.036

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,227 parts In-Stock

1+ parts

$0.448

100+ parts

-

1k+ parts

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10k+ parts

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4,227

$0.448

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.581

100+ parts

-

1k+ parts

-

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10

$0.581

-

-

-

TME

Poland . 14 parts In-Stock

1+ parts

$1.900

100+ parts

$1.390

1k+ parts

$1.280

10k+ parts

-

14

$1.900

$1.390

$1.280

-

Chip Stock

USA . 164,000 parts In-Stock

1+ parts

-

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164,000

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Vyrian

USA . 7,156 parts In-Stock

1+ parts

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7,156

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DigiKey Marketplace

USA . 4,426 parts In-Stock

1+ parts

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4,426

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Anansix

USA . 595 parts In-Stock

1+ parts

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595

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VNN

France . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,437 parts In-Stock

1+ parts

$0.425

100+ parts

-

1k+ parts

-

10k+ parts

-

4,437

$0.425

-

-

-

AZTECH Wire

Italy . 13,500 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

-

10k+ parts

-

13,500

$0.550

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.569

100+ parts

-

1k+ parts

$0.546

10k+ parts

-

100

$0.569

-

$0.546

-

Argo Parts USA

USA . 2,083 parts In-Stock

1+ parts

$0.581

100+ parts

-

1k+ parts

-

10k+ parts

$0.563

2,083

$0.581

-

-

$0.563

Corohmni

South Africa . 101 parts In-Stock

1+ parts

$0.581

100+ parts

-

1k+ parts

-

10k+ parts

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101

$0.581

-

-

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Ampacity Inc.

Singapore . 551 parts In-Stock

1+ parts

$0.870

100+ parts

-

1k+ parts

-

10k+ parts

-

551

$0.870

-

-

-

Continental Prestige Electronics

USA . 4,426 parts In-Stock

1+ parts

$1.020

100+ parts

$0.694

1k+ parts

$0.575

10k+ parts

-

4,426

$1.020

$0.694

$0.575

-

Microchip USA

USA . 3,601 parts In-Stock

1+ parts

$3.185

100+ parts

-

1k+ parts

-

10k+ parts

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3,601

$3.185

-

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$5.964

100+ parts

$5.427

1k+ parts

$4.890

10k+ parts

-

2,500

$5.964

$5.427

$4.890

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UNI Independent Distributors

Spain . 3,147 parts In-Stock

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3,147

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Perfect Parts

USA . 2,744 parts In-Stock

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2,744

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Supply Digital

USA . 465 parts In-Stock

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465

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Overview

Discover the 74HC40105D,652 by NXP Semiconductors, a high-quality FIFO device that offers unmatched value and benefits for your applications. With its advanced technology and reliable performance, this product ensures seamless data transfer and efficient memory management. Whether you're working in automotive or other industries, this compact and versatile device is perfect for your needs. Say goodbye to data bottlenecks and experience the advantages of the 74HC40105D,652 today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material choice ensures durability and protection for the product, making it suitable for various environments.

Surface Mount:

YES - The surface mount feature enables easy integration into electronic circuits, saving space and enhancing convenience during assembly.

Cycle Time:

71.428 ns - With a fast cycle time, this product can efficiently process data and handle high-speed operations.

No. of Functions:

1 - The product offers a single functional unit, simplifying its use and making it straightforward to incorporate into a system.

Package Shape:

RECTANGULAR - The rectangular shape allows for efficient arrangement and placement of multiple units, maximizing space utilization.

Operating Mode:

ASYNCHRONOUS - The asynchronous operating mode enables independent operation, providing flexibility and adaptability for various applications.

Nominal Supply Voltage / Vsup (V):

4.5 - The nominal supply voltage ensures stable and reliable power delivery, consistent performance, and compatibility with a range of systems.

Power Supplies (V):

2/6 - The availability of multiple power supply options allows for compatibility with different voltage requirements, expanding the product's applicability.

No. of Terminals:

16 - With a sufficient number of terminals, this product can efficiently interface with other components, facilitating seamless integration.

Package Style (Meter):

SMALL OUTLINE - The small outline package style enhances space-saving without compromising functionality, making it suitable for compact designs.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature ensures the product's reliability and performance even in demanding conditions.

Organization:

16X4 - The 16X4 organization provides ample memory capacity for storing and accessing data, enabling robust data handling capabilities.

Output Characteristics:

3-STATE - The 3-STATE output characteristics offer flexibility in controlling the product's output signal and allow easy integration into a system.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature ensures the product's functionality in extreme cold environments, making it suitable for various applications.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - This terminal finish choice with a combination of metals ensures excellent connectivity and resistance to corrosion, enhancing the product's reliability and longevity.

Terminal Position:

DUAL - The dual terminal position provides versatility in circuit layout and connection options, accommodating various design requirements.

Maximum Seated Height:

1.75 mm - With a low maximum seated height, this product offers a compact form factor and facilitates space-efficient designs.

Maximum Clock Frequency (fCLK):

14 MHz - The high maximum clock frequency allows for rapid data processing and efficient operation at high speeds.

Width:

3.9 mm - The narrow width dimension contributes to space-saving design possibilities, giving flexibility in layout and compact system integration.

Minimum Supply Voltage (Vsup):

2 V - The low minimum supply voltage ensures compatibility with low-power circuits and increases energy efficiency.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature provides a guideline for appropriate soldering techniques, ensuring proper assembly and reliability.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature ensures effective solder joint formation during assembly, enhancing reliability and product performance.

Length:

9.9 mm - The length dimension contributes to space-optimized designs and efficient utilization of available area in electronic systems.

Temperature Grade:

AUTOMOTIVE - The automotive temperature grade indicates the product's suitability for automotive applications, ensuring performance under various temperature conditions.

Technology:

CMOS - The CMOS technology used in this product provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Parallel or Serial:

PARALLEL - The parallel data transmission capability offers fast and simultaneous data processing, making it suitable for applications requiring high throughput.

Terminal Form:

GULL WING - The gull wing terminal form allows for simple and reliable soldering during assembly, ensuring secure connections and robust electrical performance.

No. of Words:

16 words - With 16 words of memory, this product can efficiently store and retrieve data, offering ample capacity for data management.

Memory Width:

4 - The memory width of 4 bits enables efficient processing and manipulation of data, supporting a wide range of applications.

Terminal Pitch:

1.27 mm - The small terminal pitch allows for compact and precise connections, enabling high-density circuit designs and reducing PCB size.

No. of Words Code:

16 - The 16-word code capability adds versatility, allowing the product to handle different types of data or instructions effectively.

Moisture Sensitivity Level (MSL):

1 - The MSL level 1 indicates that the product has a low moisture absorption rate, ensuring performance stability and reliability during storage and assembly.

Maximum Supply Voltage (Vsup):

6 V - The high maximum supply voltage ensures compatibility with systems that require higher power levels, expanding the product's usability.

Memory Density:

64 bit - With a memory density of 64 bits, this product offers substantial storage capacity for data-intensive applications.

Memory IC Type:

OTHER FIFO - The specific memory IC type as a "FIFO" (First-In, First-Out) ensures efficient data management and retrieval, making it suitable for applications requiring data buffering.

Output Enable:

YES - The output enable function allows for easy control and activation of the product's outputs, enhancing flexibility and enabling system-level control.

Maximum Access Time:

600 ns - With a fast maximum access time, this product can retrieve stored data quickly, enabling efficient and timely data processing.

Technical Specifications

FIFO 74HC40105D,652 attributes and parameters. Explore more FIFO devices from NXP Semiconductors

Specs

Maximum Access Time:

600 ns

Additional Features:

REGISTER BASED; BUBBLE BACK 750NS

Maximum Clock Frequency (fCLK):

14 MHz

Cycle Time:

71.428 ns

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Memory Density:

64 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16X4

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74HC40105D,652 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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