Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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74HC40105D,652 by NXP Semiconductors is a FIFO memory IC with a cycle time of 71.428 ns and an operating mode of asynchronous. It is commonly used in automotive applications due to its temperature grade and moisture sensitivity level.
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PLASTIC/EPOXY - This material choice ensures durability and protection for the product, making it suitable for various environments.
YES - The surface mount feature enables easy integration into electronic circuits, saving space and enhancing convenience during assembly.
71.428 ns - With a fast cycle time, this product can efficiently process data and handle high-speed operations.
1 - The product offers a single functional unit, simplifying its use and making it straightforward to incorporate into a system.
RECTANGULAR - The rectangular shape allows for efficient arrangement and placement of multiple units, maximizing space utilization.
ASYNCHRONOUS - The asynchronous operating mode enables independent operation, providing flexibility and adaptability for various applications.
4.5 - The nominal supply voltage ensures stable and reliable power delivery, consistent performance, and compatibility with a range of systems.
2/6 - The availability of multiple power supply options allows for compatibility with different voltage requirements, expanding the product's applicability.
16 - With a sufficient number of terminals, this product can efficiently interface with other components, facilitating seamless integration.
SMALL OUTLINE - The small outline package style enhances space-saving without compromising functionality, making it suitable for compact designs.
125 °C - The high maximum operating temperature ensures the product's reliability and performance even in demanding conditions.
16X4 - The 16X4 organization provides ample memory capacity for storing and accessing data, enabling robust data handling capabilities.
3-STATE - The 3-STATE output characteristics offer flexibility in controlling the product's output signal and allow easy integration into a system.
40 °C - The low minimum operating temperature ensures the product's functionality in extreme cold environments, making it suitable for various applications.
Nickel/Palladium/Gold (Ni/Pd/Au) - This terminal finish choice with a combination of metals ensures excellent connectivity and resistance to corrosion, enhancing the product's reliability and longevity.
DUAL - The dual terminal position provides versatility in circuit layout and connection options, accommodating various design requirements.
1.75 mm - With a low maximum seated height, this product offers a compact form factor and facilitates space-efficient designs.
14 MHz - The high maximum clock frequency allows for rapid data processing and efficient operation at high speeds.
3.9 mm - The narrow width dimension contributes to space-saving design possibilities, giving flexibility in layout and compact system integration.
2 V - The low minimum supply voltage ensures compatibility with low-power circuits and increases energy efficiency.
30 - The maximum time at peak reflow temperature provides a guideline for appropriate soldering techniques, ensuring proper assembly and reliability.
260 - The high peak reflow temperature ensures effective solder joint formation during assembly, enhancing reliability and product performance.
9.9 mm - The length dimension contributes to space-optimized designs and efficient utilization of available area in electronic systems.
AUTOMOTIVE - The automotive temperature grade indicates the product's suitability for automotive applications, ensuring performance under various temperature conditions.
CMOS - The CMOS technology used in this product provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.
PARALLEL - The parallel data transmission capability offers fast and simultaneous data processing, making it suitable for applications requiring high throughput.
GULL WING - The gull wing terminal form allows for simple and reliable soldering during assembly, ensuring secure connections and robust electrical performance.
16 words - With 16 words of memory, this product can efficiently store and retrieve data, offering ample capacity for data management.
4 - The memory width of 4 bits enables efficient processing and manipulation of data, supporting a wide range of applications.
1.27 mm - The small terminal pitch allows for compact and precise connections, enabling high-density circuit designs and reducing PCB size.
16 - The 16-word code capability adds versatility, allowing the product to handle different types of data or instructions effectively.
1 - The MSL level 1 indicates that the product has a low moisture absorption rate, ensuring performance stability and reliability during storage and assembly.
6 V - The high maximum supply voltage ensures compatibility with systems that require higher power levels, expanding the product's usability.
64 bit - With a memory density of 64 bits, this product offers substantial storage capacity for data-intensive applications.
OTHER FIFO - The specific memory IC type as a "FIFO" (First-In, First-Out) ensures efficient data management and retrieval, making it suitable for applications requiring data buffering.
YES - The output enable function allows for easy control and activation of the product's outputs, enhancing flexibility and enabling system-level control.
600 ns - With a fast maximum access time, this product can retrieve stored data quickly, enabling efficient and timely data processing.
FIFO 74HC40105D,652 attributes and parameters. Explore more FIFO devices from NXP Semiconductors
Maximum Access Time:
Additional Features:
Maximum Clock Frequency (fCLK):
Cycle Time:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
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Terminal Pitch:
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Maximum Time At Peak Reflow Temperature (s):
Width:
74HC40105D,652 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
LM555CN
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LIS2DH12TR
STMicroelectronics
LIS2DH12TR by STMicroelectronics is a 3-axis accelerometer with digital voltage output. It operates b/w -40 to 85°C, with supply voltage range of 1.71-3.6V. Ideal for applications requiring precise motion sensing in compact spaces like wearables and IoT devices.
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
STM32H743BIT6
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
NE555D
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N7002
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
2N2222A
Transistor & Electronic
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
EU2B-YS3103F
Idec
ROTARY SWITCH;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
1N4148
Nte Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
SMBJ18CA
Semitron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
IDT72V851L10PFG8
Renesas Electronics
IDT72V851L10PFG8 by Renesas Electronics is a 8Kx9 FIFO with a cycle time of 10 ns. It operates in synchronous mode and has a nominal voltage of 3.3V. This FIFO is commonly used in applications that require high-speed data buffering and storage.
SN74ABT7820-20PH
Texas Instruments
SN74ABT7820-20PH by Texas Instruments is a FIFO with 512x18 organization, operating at 20 ns cycle time and 50 MHz clock frequency. It is ideal for applications requiring fast synchronous data transfer in commercial temperature environments.
SN74ACT2236-20PAG
SN74ACT2236-20PAG by Texas Instruments is a 2Kx9 FIFO with 3-STATE output, operating at 5V. It features a flatpack package style, 0.5mm terminal pitch, and GULL WING terminals. Ideal for synchronous applications requiring high memory density and parallel data transfer in compact spaces.
SN74ACT3622-15PCBR
SN74ACT3622-15PCBR by Texas Instruments is a FIFO with 256x36 organization, 15 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 9216-bit memory density.
IDT72V2105L10PFG8
IDT72V2105L10PFG8 by Renesas Electronics is a 256Kx18 FIFO with 10ns cycle time, operating at 3.3V. It features synchronous operation and GULL WING terminals in a low profile FLATPACK package. Ideal for applications requiring fast data transfer and memory management in commercial-grade environments.
7202LA15JI8
Integrated Device Technology
7202LA15JI8 by Integrated Device Technology is a FIFO chip with 1KX9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and memory density of 9216 bit. Ideal for industrial applications requiring fast data processing and storage in parallel mode.
SN54ALS232AJ
SN54ALS232AJ by Texas Instruments is a 16x4 FIFO with 40ns cycle time, operating at 25MHz clock frequency. It has a memory width of 4 bits and memory density of 64 bits, suitable for military-grade applications requiring fast data processing and storage.
SN74ACT7205L15NP
SN74ACT7205L15NP by Texas Instruments is a FIFO memory with 8Kx9 organization, 25ns cycle time, and 40MHz max clock frequency. It operates at 5V, has a temp range of 0-70°C, and is ideal for parallel data storage applications.
72V211L15PFGI8
The Renesas Electronics 72V211L15PFGI8 FIFO operates synchronously with a cycle time of 15 ns. It features a memory density of 4608 bit and an organization of 512X9, making it ideal for industrial applications requiring fast data processing. With a low profile flatpack package style and GULL WING terminal form, this FIFO is suitable for surface mount PCB designs in various electronic systems.
IDT7203L25JI8
IDT7203L25JI8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 28.5MHz clock frequency and 35ns cycle time. It is designed for industrial applications requiring fast asynchronous data storage and retrieval in parallel mode.
SN74ACT2236-30FN
SN74ACT2236-30FN by Texas Instruments is a 2Kx9 BI-DIRECTIONAL FIFO chip carrier with 3-STATE output, operating at 33MHz with a cycle time of 30.3ns. Ideal for industrial applications, it features synchronous operation and a memory density of 18432 bits, making it suitable for high-speed parallel data transfer.
SN74ACT7200L20NP
SN74ACT7200L20NP by Texas Instruments is a FIFO with 256x9 organization, operating at 5V. It features a CMOS technology, operates in parallel mode, and has a memory density of 2304 bits. This device is commonly used in applications requiring asynchronous operation and a memory width of 9 bits.
SN74ABT7819-20PN
SN74ABT7819-20PN by Texas Instruments is a FIFO memory with 512x18 organization, operating at 20ns cycle time and 50MHz clock frequency. It is used in applications requiring fast data storage and retrieval, featuring a 3-STATE output characteristic and GULL WING terminal form for parallel communication.
SN54LS222J
SN54LS222J by Texas Instruments is a 16x4 FIFO memory IC with 3-STATE output characteristics. Operating at 5V, it has a temperature range of -55 to 125°C and is MILITARY grade. With parallel interface and synchronous mode, it's ideal for high-reliability applications in harsh environments.
SN74ACT72221L-20RJ
SN74ACT72221L-20RJ by Texas Instruments is a FIFO chip with 1KX9 organization, 20 ns cycle time, and 50 MHz clock frequency. It operates synchronously at 5V and has a memory density of 9216 bit. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
CY7C4205-15AXCT
Cypress Semiconductor
CY7C4205-15AXCT by Cypress: FIFO with 256x18 organization, 15ns cycle time, and 5V nominal voltage. Ideal for synchronous operations in commercial-grade applications requiring fast access times and parallel data processing.
SN74ACT7204L35NP
SN74ACT7204L35NP by Texas Instruments is a 4Kx9 FIFO with CMOS technology. It operates asynchronously at 5V, has a memory density of 36864 bits, and supports parallel data transfer. This rectangular package with 28 terminals is ideal for commercial applications requiring fast and efficient data storage and retrieval.
IDT72V3650L6PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; Terminal Position: QUAD;
SN74V245-10PAG
SN74V245-10PAG by Texas Instruments is a FIFO with 4Kx18 organization, operating at 166 MHz. It features a cycle time of 10 ns and operates at a supply voltage of 3.3 V. Ideal for applications requiring fast synchronous data transfer in commercial temperature environments.
SN74ABT7820-20PNR
SN74ABT7820-20PNR by Texas Instruments is a FIFO with 512x18 organization, operating at 5V. It features a cycle time of 20ns, synchronous mode, and 3-STATE output characteristics. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
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74HC40105D,652
Nexperia
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
74HC40105D,653
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 9.9 mm;
NXP Semiconductors
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 14 MHz;
74HC40105DB,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; No. of Functions: 1;
74HC40105N
Philips Semiconductors
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T16;
74HC40105N,652
74HC40105N,652 by NXP Semiconductors is a FIFO IC with 16x4 organization, operating at 14 MHz clock frequency. It has a cycle time of 71.428 ns and supports an asynchronous mode. This CMOS technology device is ideal for automotive applications due to its wide temperature range and memory width of 4 bits.
74HC40105PW,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
74HC40105PW,118
74HC40105PW,118 by NXP Semiconductors is a FIFO device with a cycle time of 71.428 ns and an operating mode of asynchronous. It has a memory width of 4 and can be used in automotive applications due to its temperature grade.
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Access Time: 600 ns;
74HC7403D,512
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Access Time: 98 ns;
74HC40105NB
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Width: 7.62 mm;
74HC40105D
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
74HC40105PW
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
74HC40105PW-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
74HC40105DB,118
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
74HC40105DB-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2 V;
74HC40105D-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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