Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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74HC40105D,652 by NXP Semiconductors is a FIFO memory IC with a cycle time of 71.428 ns and an operating mode of asynchronous. It is commonly used in automotive applications due to its temperature grade and moisture sensitivity level.
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PLASTIC/EPOXY - This material choice ensures durability and protection for the product, making it suitable for various environments.
YES - The surface mount feature enables easy integration into electronic circuits, saving space and enhancing convenience during assembly.
71.428 ns - With a fast cycle time, this product can efficiently process data and handle high-speed operations.
1 - The product offers a single functional unit, simplifying its use and making it straightforward to incorporate into a system.
RECTANGULAR - The rectangular shape allows for efficient arrangement and placement of multiple units, maximizing space utilization.
ASYNCHRONOUS - The asynchronous operating mode enables independent operation, providing flexibility and adaptability for various applications.
4.5 - The nominal supply voltage ensures stable and reliable power delivery, consistent performance, and compatibility with a range of systems.
2/6 - The availability of multiple power supply options allows for compatibility with different voltage requirements, expanding the product's applicability.
16 - With a sufficient number of terminals, this product can efficiently interface with other components, facilitating seamless integration.
SMALL OUTLINE - The small outline package style enhances space-saving without compromising functionality, making it suitable for compact designs.
125 °C - The high maximum operating temperature ensures the product's reliability and performance even in demanding conditions.
16X4 - The 16X4 organization provides ample memory capacity for storing and accessing data, enabling robust data handling capabilities.
3-STATE - The 3-STATE output characteristics offer flexibility in controlling the product's output signal and allow easy integration into a system.
40 °C - The low minimum operating temperature ensures the product's functionality in extreme cold environments, making it suitable for various applications.
Nickel/Palladium/Gold (Ni/Pd/Au) - This terminal finish choice with a combination of metals ensures excellent connectivity and resistance to corrosion, enhancing the product's reliability and longevity.
DUAL - The dual terminal position provides versatility in circuit layout and connection options, accommodating various design requirements.
1.75 mm - With a low maximum seated height, this product offers a compact form factor and facilitates space-efficient designs.
14 MHz - The high maximum clock frequency allows for rapid data processing and efficient operation at high speeds.
3.9 mm - The narrow width dimension contributes to space-saving design possibilities, giving flexibility in layout and compact system integration.
2 V - The low minimum supply voltage ensures compatibility with low-power circuits and increases energy efficiency.
30 - The maximum time at peak reflow temperature provides a guideline for appropriate soldering techniques, ensuring proper assembly and reliability.
260 - The high peak reflow temperature ensures effective solder joint formation during assembly, enhancing reliability and product performance.
9.9 mm - The length dimension contributes to space-optimized designs and efficient utilization of available area in electronic systems.
AUTOMOTIVE - The automotive temperature grade indicates the product's suitability for automotive applications, ensuring performance under various temperature conditions.
CMOS - The CMOS technology used in this product provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.
PARALLEL - The parallel data transmission capability offers fast and simultaneous data processing, making it suitable for applications requiring high throughput.
GULL WING - The gull wing terminal form allows for simple and reliable soldering during assembly, ensuring secure connections and robust electrical performance.
16 words - With 16 words of memory, this product can efficiently store and retrieve data, offering ample capacity for data management.
4 - The memory width of 4 bits enables efficient processing and manipulation of data, supporting a wide range of applications.
1.27 mm - The small terminal pitch allows for compact and precise connections, enabling high-density circuit designs and reducing PCB size.
16 - The 16-word code capability adds versatility, allowing the product to handle different types of data or instructions effectively.
1 - The MSL level 1 indicates that the product has a low moisture absorption rate, ensuring performance stability and reliability during storage and assembly.
6 V - The high maximum supply voltage ensures compatibility with systems that require higher power levels, expanding the product's usability.
64 bit - With a memory density of 64 bits, this product offers substantial storage capacity for data-intensive applications.
OTHER FIFO - The specific memory IC type as a "FIFO" (First-In, First-Out) ensures efficient data management and retrieval, making it suitable for applications requiring data buffering.
YES - The output enable function allows for easy control and activation of the product's outputs, enhancing flexibility and enabling system-level control.
600 ns - With a fast maximum access time, this product can retrieve stored data quickly, enabling efficient and timely data processing.
FIFO 74HC40105D,652 attributes and parameters. Explore more FIFO devices from NXP Semiconductors
Maximum Access Time:
Additional Features:
Maximum Clock Frequency (fCLK):
Cycle Time:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
74HC40105D,652 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
STM32F405RGT6
STMicroelectronics
STM32F405RGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 16 external interrupts, and 196608 RAM bytes. Ideal for industrial applications, it features CAN(2), I2C(3), SPI(3) connectivity options and operates at a max clock frequency of 26 MHz. With low power mode and DMA support, it offers versatile performance in compact dimensions.
1N4148
American Power Devices
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BAV99LT1G
Onsemi
BAV99LT1G by Onsemi is a series connected diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.006 us and can handle up to 100V repetitive peak reverse voltage. Ideal for rectification applications, this diode operates b/w -65°C to 150°C temperature range.
SMBJ18CA
Daco Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Eic Semiconductor
Frontier Electronics
Crimson Semiconductor
1N4148WS
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
General Semiconductor
Lite-on Semiconductor
Sprague Electric
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1.3 V; Maximum Output Current: .1 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel;
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
SN54ALS232AFK
Texas Instruments
SN54ALS232AFK by Texas Instruments is a 16x4 FIFO chip carrier with 3-STATE output, operating at 25 MHz with a cycle time of 40 ns. It has a synchronous mode and operates b/w -55 to 125 °C. Ideal for military-grade applications requiring fast parallel memory access.
7202LA15SOGI
Renesas Electronics
The Renesas Electronics 7202LA15SOGI is a FIFO memory IC with a cycle time of 25 ns and a max clock frequency of 40 MHz. It is commonly used in industrial applications that require fast and reliable data storage and retrieval.
7201LA12SOG8
Renesas Electronics 7201LA12SOG8 FIFO features 512x9 organization, operates at 50 MHz clock frequency, and has a cycle time of 20 ns. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT7201LA12SOG8
Integrated Device Technology
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
SN74ACT3642-20PQR
SN74ACT3642-20PQR by Texas Instruments is a FIFO with 1KX36 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics.
CD54HCT40105F3A
CD54HCT40105F3A by Texas Instruments is a 16x4 FIFO with 100ns cycle time, operating at 5V. It has a max clock frequency of 10MHz and is suitable for military-grade applications requiring synchronous operation.
IDT7202LA12PDG
The Renesas Electronics IDT7202LA12PDG is a FIFO memory with 1Kx9 organization, operating at 20ns cycle time and 50MHz clock frequency. It is used in applications requiring fast data storage and retrieval, with a max supply voltage of 5.5V and temperature range of 0-70°C.
SN74ABT7819-12PNR
SN74ABT7819-12PNR by Texas Instruments is a FIFO with 512x18 organization, 12.5 ns cycle time, and operates at 5V. It is used in applications requiring fast synchronous data transfer, such as high-speed communication systems or memory buffering. The device features a low profile flatpack package with gull wing terminals for easy surface mounting.
SN74V235-7PAG
SN74V235-7PAG by Texas Instruments is a 2Kx18 FIFO with 7.5ns cycle time, operating at 166MHz clock frequency. It has a 3.3V nominal voltage and supports synchronous operation. Ideal for applications requiring fast data buffering in commercial temperature environments.
SN74ACT3642-30PCB
SN74ACT3642-30PCB by Texas Instruments is a FIFO memory IC with 1Kx36 organization, 30 ns cycle time, and 33.4 MHz clock frequency. It operates at 5V, has a memory density of 36864 bits, and is used in applications requiring fast synchronous data storage and retrieval.
SN54ALS236FK
SN54ALS236FK by Texas Instruments is a 64x4 FIFO chip with 40ns cycle time, operating at 5V. It features totem pole output, asynchronous mode, and military-grade temperature range. Ideal for applications requiring fast data storage and retrieval in harsh environments.
SN74ACT7204L-50DV
SN74ACT7204L-50DV by Texas Instruments is a FIFO memory with 4Kx9 organization, 65ns cycle time, and 15MHz clock frequency. It operates at 5V, has a small outline package style, and is ideal for parallel data storage applications in commercial temperature environments.
IDT72V7280L15BB
IDT72V7280L15BB by Integrated Device Technology is a 16Kx72 FIFO with 15ns cycle time, operating at 66.7MHz clock frequency. Suitable for commercial applications, it features synchronous operation, 256 terminals in a grid array package style, and a memory density of 1179648 bits.
SN74ACT7205L15RJ
SN74ACT7205L15RJ by Texas Instruments is a FIFO chip with 8Kx9 organization, operating at 40 MHz with a cycle time of 25 ns. It has a memory density of 73728 bits and can operate in commercial temperature grades. This chip is suitable for applications requiring fast data storage and retrieval in parallel mode.
72V05L25JGI
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Width: 9;
IDT72801L25TFI8
IDT72801L25TFI8 by Integrated Device Technology is a FIFO memory with 256x9 organization, operating at 25ns cycle time and 40MHz clock frequency. Suitable for industrial applications, it features synchronous operation, parallel interface, and a low profile flatpack package design.
7202LA15JGI
Renesas Electronics' 7202LA15JGI is a FIFO chip with 1Kx9 organization, operating at 40MHz clock frequency. It has a cycle time of 25ns and can handle a max supply voltage of 5.5V. Ideal for industrial applications requiring fast data processing in asynchronous mode with parallel terminal form.
5962-9562801QYX
Texas Instruments' 5962-9562801QYX FIFO operates at 20ns cycle time with 512x36 organization. Ideal for military applications, it features a ceramic, metal-sealed co-fired package and synchronous operating mode. With a memory density of 18432 bits, this parallel CMOS technology device has a temperature range from -55 to 125°C.
IDT72V241L10PFG
IDT72V241L10PFG by Renesas Electronics is a FIFO with 4Kx9 organization, operating at 3.3V. It features a cycle time of 10ns and synchronous operation, suitable for parallel applications requiring fast access times. This low-profile flatpack device has a memory density of 36864 bits and offers output enable functionality for efficient data processing.
72V265LA10PFG8
72V265LA10PFG8 by Renesas Electronics is a FIFO with 16Kx18 organization, operating at 100MHz clock frequency. It has a cycle time of 10ns and operates in synchronous mode. This device is suitable for applications requiring fast data processing and memory management in commercial-grade environments.
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74HC40105D,652
Nexperia
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
74HC40105D,653
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 9.9 mm;
NXP Semiconductors
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 14 MHz;
74HC40105DB,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; No. of Functions: 1;
74HC40105N
Philips Semiconductors
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T16;
74HC40105N,652
74HC40105N,652 by NXP Semiconductors is a FIFO IC with 16x4 organization, operating at 14 MHz clock frequency. It has a cycle time of 71.428 ns and supports an asynchronous mode. This CMOS technology device is ideal for automotive applications due to its wide temperature range and memory width of 4 bits.
74HC40105PW,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
74HC40105PW,118
74HC40105PW,118 by NXP Semiconductors is a FIFO device with a cycle time of 71.428 ns and an operating mode of asynchronous. It has a memory width of 4 and can be used in automotive applications due to its temperature grade.
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Access Time: 600 ns;
74HC7403D,512
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Access Time: 98 ns;
74HC40105NB
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Width: 7.62 mm;
74HC40105D
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
74HC40105PW
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
74HC40105PW-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
74HC40105DB,118
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
74HC40105DB-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2 V;
74HC40105D-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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