Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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74HC40105D,652 by NXP Semiconductors is a FIFO memory IC with a cycle time of 71.428 ns and an operating mode of asynchronous. It is commonly used in automotive applications due to its temperature grade and moisture sensitivity level.
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PLASTIC/EPOXY - This material choice ensures durability and protection for the product, making it suitable for various environments.
YES - The surface mount feature enables easy integration into electronic circuits, saving space and enhancing convenience during assembly.
71.428 ns - With a fast cycle time, this product can efficiently process data and handle high-speed operations.
1 - The product offers a single functional unit, simplifying its use and making it straightforward to incorporate into a system.
RECTANGULAR - The rectangular shape allows for efficient arrangement and placement of multiple units, maximizing space utilization.
ASYNCHRONOUS - The asynchronous operating mode enables independent operation, providing flexibility and adaptability for various applications.
4.5 - The nominal supply voltage ensures stable and reliable power delivery, consistent performance, and compatibility with a range of systems.
2/6 - The availability of multiple power supply options allows for compatibility with different voltage requirements, expanding the product's applicability.
16 - With a sufficient number of terminals, this product can efficiently interface with other components, facilitating seamless integration.
SMALL OUTLINE - The small outline package style enhances space-saving without compromising functionality, making it suitable for compact designs.
125 °C - The high maximum operating temperature ensures the product's reliability and performance even in demanding conditions.
16X4 - The 16X4 organization provides ample memory capacity for storing and accessing data, enabling robust data handling capabilities.
3-STATE - The 3-STATE output characteristics offer flexibility in controlling the product's output signal and allow easy integration into a system.
40 °C - The low minimum operating temperature ensures the product's functionality in extreme cold environments, making it suitable for various applications.
Nickel/Palladium/Gold (Ni/Pd/Au) - This terminal finish choice with a combination of metals ensures excellent connectivity and resistance to corrosion, enhancing the product's reliability and longevity.
DUAL - The dual terminal position provides versatility in circuit layout and connection options, accommodating various design requirements.
1.75 mm - With a low maximum seated height, this product offers a compact form factor and facilitates space-efficient designs.
14 MHz - The high maximum clock frequency allows for rapid data processing and efficient operation at high speeds.
3.9 mm - The narrow width dimension contributes to space-saving design possibilities, giving flexibility in layout and compact system integration.
2 V - The low minimum supply voltage ensures compatibility with low-power circuits and increases energy efficiency.
30 - The maximum time at peak reflow temperature provides a guideline for appropriate soldering techniques, ensuring proper assembly and reliability.
260 - The high peak reflow temperature ensures effective solder joint formation during assembly, enhancing reliability and product performance.
9.9 mm - The length dimension contributes to space-optimized designs and efficient utilization of available area in electronic systems.
AUTOMOTIVE - The automotive temperature grade indicates the product's suitability for automotive applications, ensuring performance under various temperature conditions.
CMOS - The CMOS technology used in this product provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.
PARALLEL - The parallel data transmission capability offers fast and simultaneous data processing, making it suitable for applications requiring high throughput.
GULL WING - The gull wing terminal form allows for simple and reliable soldering during assembly, ensuring secure connections and robust electrical performance.
16 words - With 16 words of memory, this product can efficiently store and retrieve data, offering ample capacity for data management.
4 - The memory width of 4 bits enables efficient processing and manipulation of data, supporting a wide range of applications.
1.27 mm - The small terminal pitch allows for compact and precise connections, enabling high-density circuit designs and reducing PCB size.
16 - The 16-word code capability adds versatility, allowing the product to handle different types of data or instructions effectively.
1 - The MSL level 1 indicates that the product has a low moisture absorption rate, ensuring performance stability and reliability during storage and assembly.
6 V - The high maximum supply voltage ensures compatibility with systems that require higher power levels, expanding the product's usability.
64 bit - With a memory density of 64 bits, this product offers substantial storage capacity for data-intensive applications.
OTHER FIFO - The specific memory IC type as a "FIFO" (First-In, First-Out) ensures efficient data management and retrieval, making it suitable for applications requiring data buffering.
YES - The output enable function allows for easy control and activation of the product's outputs, enhancing flexibility and enabling system-level control.
600 ns - With a fast maximum access time, this product can retrieve stored data quickly, enabling efficient and timely data processing.
FIFO 74HC40105D,652 attributes and parameters. Explore more FIFO devices from NXP Semiconductors
Maximum Access Time:
Additional Features:
Maximum Clock Frequency (fCLK):
Cycle Time:
JESD-30 Code:
JESD-609 Code:
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Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
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Temperature Grade:
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Width:
74HC40105D,652 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N2222A
Vishay Sprague
NPN; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JEDEC-95 Code: TO-18; Maximum Collector-Emitter Voltage: 40 V;
2N7002-7-F
Diodes Incorporated
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BSS138
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
BAV99
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Telefunken
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Kingwell Technonlogy
STM32H743XIH6
STMicroelectronics
STM32H743XIH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 36-Ch 16-Bit ADC, and 2-Ch 12-Bit DAC. It operates at up to 48 MHz, has 1085440 bytes of RAM, and offers connectivity options like CAN, I2C, USB. Ideal for industrial applications requiring high-performance processing and extensive peripheral support.
Excel (Suzhou) Semiconductor
MMBT3904-7-F
Diodes Inc. MMBT3904-7-F is a NPN BJT transistor for switching applications. Features include VCEsat of 0.3V, hFE of 30, and IC of 0.2A. With a max operating temp of 150°C, it's ideal for small outline SMT designs in automotive electronics.
LM317TG
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
Lite-on Semiconductor
Daco Semiconductor
SS14
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123-7-F
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
SN74ACT7205L25NP
Texas Instruments
SN74ACT7205L25NP by Texas Instruments is a FIFO memory IC with 8Kx9 organization, 35ns cycle time, and 28.5MHz max clock frequency. It operates asynchronously at a supply voltage of 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V241L10PFG8
Renesas Electronics
The Renesas Electronics 72V241L10PFG8 FIFO operates in synchronous mode with a cycle time of 10 ns and a clock frequency of 100 MHz. It has a memory density of 36864 bit, suitable for applications requiring fast data access such as networking equipment and telecommunications devices.
SN74ACT7206L-25DVR
SN74ACT7206L-25DVR by Texas Instruments is a 16Kx9 FIFO with 35ns cycle time, operating at 5V. It features a small outline package, asynchronous mode, and 3-STATE output. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
72V2111L15PFGI8
Integrated Device Technology
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Standby Current: .02 Amp;
CD74HC40105M
General Electric Solid State
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
IDT72V271LA10PFG8
The Renesas Electronics IDT72V271LA10PFG8 FIFO features 32Kx9 organization, 10ns cycle time, and 3.3V nominal voltage. Ideal for applications requiring fast synchronous operation in commercial temperature environments.
72V3650L6PFG8
The Renesas Electronics 72V3650L6PFG8 FIFO operates synchronously with a cycle time of 6 ns and clock frequency up to 166 MHz. It has an organization of 2KX36, suitable for applications requiring fast data processing such as networking equipment and telecommunications systems. With a low profile flatpack package style, it offers parallel operation with output enable functionality.
7202LA15JGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
5962-8952305EA
Teledyne E2v (uk)
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
7202LA25JGI8
Renesas Electronics 7202LA25JGI8 FIFO chip features 1Kx9 organization, 35ns cycle time, and operates at 5V. Ideal for industrial applications requiring fast access times and parallel operation. Package style is chip carrier with dimensions of 13.97mm x 11.43mm x 3.55mm, suitable for surface mount assembly in various electronic systems.
7201LA12SOG8
Renesas Electronics 7201LA12SOG8 FIFO features 512x9 organization, operates at 50 MHz clock frequency, and has a cycle time of 20 ns. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7202LA25JI8
7202LA25JI8 by Integrated Device Technology is a FIFO chip with 1KX9 organization, operating at 5V. It features a cycle time of 35ns and max clock frequency of 28.5MHz, suitable for industrial applications requiring fast data processing in parallel mode.
72V235L10TFG8
The Renesas Electronics 72V235L10TFG8 FIFO features a cycle time of 10 ns, operating at a max clock frequency of 100 MHz. With an organization of 2KX18, it is suitable for applications requiring fast data processing and synchronization in commercial-grade environments. The device offers parallel operation with a memory width of 18 bits and output enable functionality for efficient data management.
IDT72801L35PF
IDT72801L35PF FIFO by Integrated Device Technology features a cycle time of 35ns, synchronous operation, and 512x9 organization. Ideal for applications requiring fast data storage and retrieval, with a max clock frequency of 28.6MHz. This low-profile flatpack device operates at temperatures b/w 0-70°C, making it suitable for commercial-grade projects.
NTE74HC40105
Nte Electronics
NTE74HC40105 by Nte Electronics is a 16X4 FIFO memory IC with 64-bit memory density. It operates in synchronous mode at supply voltages ranging from 2V to 6V. With a max temperature of 85°C, it is ideal for industrial applications requiring a parallel output and 3-STATE characteristics.
7202LA50JG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
SN74ACT7205L-25DV
SN74ACT7205L-25DV by Texas Instruments is a FIFO with 8KX9 organization, 35 ns cycle time, and 28.5 MHz clock frequency. It operates at 5V, has a memory density of 73728 bit, and is ideal for commercial applications requiring fast data storage and retrieval.
SN74ACT72231L-25RJR
SN74ACT72231L-25RJR by Texas Instruments is a 2Kx9 FIFO chip with 25ns cycle time, operating at 5V. It features synchronous operation, 40MHz clock frequency, and 3-STATE output characteristics. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
CYF0018V18L-133BGXI
Cypress Semiconductor
CYF0018V18L-133BGXI by Cypress Semiconductor is a FIFO with 512KX36 organization, operating at 133 MHz clock frequency. It has a cycle time of 7.5 ns and can handle a max supply current of 600 mA. Ideal for industrial applications requiring fast synchronous data processing in compact designs.
SN74ABT3611-20PCB
SN74ABT3611-20PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 20ns cycle time, and 50MHz clock frequency. It operates synchronously at 5V, has a low profile flatpack package style, and is ideal for parallel data storage applications.
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74HC40105D,652
Nexperia
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
74HC40105D,653
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 9.9 mm;
NXP Semiconductors
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 14 MHz;
74HC40105DB,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; No. of Functions: 1;
74HC40105N
Philips Semiconductors
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T16;
74HC40105N,652
74HC40105N,652 by NXP Semiconductors is a FIFO IC with 16x4 organization, operating at 14 MHz clock frequency. It has a cycle time of 71.428 ns and supports an asynchronous mode. This CMOS technology device is ideal for automotive applications due to its wide temperature range and memory width of 4 bits.
74HC40105PW,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
74HC40105PW,118
74HC40105PW,118 by NXP Semiconductors is a FIFO device with a cycle time of 71.428 ns and an operating mode of asynchronous. It has a memory width of 4 and can be used in automotive applications due to its temperature grade.
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Access Time: 600 ns;
74HC7403D,512
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Access Time: 98 ns;
74HC40105NB
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Width: 7.62 mm;
74HC40105D
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
74HC40105PW
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
74HC40105PW-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
74HC40105DB,118
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
74HC40105DB-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2 V;
74HC40105D-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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