Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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74HC40105NB by NXP is a CMOS FIFO memory with a cycle time of 83.33 ns and operates asynchronously. It features a 16x4 organization, supports dual terminals, and functions within -40 °C to 125 °C, making it ideal for automotive applications.
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Native Components
Durable and reliable material choice enhances longevity and performance.
Fast cycle time ensures improved processing speeds, making it suitable for high-speed applications.
Rectangular shape allows for efficient PCB layout and integration.
Asynchronous operation provides flexibility in design and integration in various applications.
Standard supply voltage simplifies system design and compatibility with existing components.
Adequate number of terminals facilitates connectivity options while maintaining a compact form factor.
In-line package style is ideal for efficient assembly processes and improves space utilization.
High maximum temperature rating allows this product to function reliably in extreme conditions.
This memory organization supports multiple word lengths, enhancing data handling capabilities.
3-state output provides flexibility in resource sharing among multiple devices in a system.
Wide operating temperature range ensures functionality in harsh environments, making it suitable for automotive applications.
High-quality terminal finish enhances solderability and improves reliability in connections.
Dual terminal position allows for more flexible mounting options on PCBs.
Compact height aids in space-constrained designs, promoting efficient usage in various applications.
Narrow width facilitates integration into tight spaces on printed circuit boards.
Low minimum supply voltage allows compatibility with a wide range of power sources.
Reasonable length provides a good balance between footprint and performance.
Designed for automotive applications, ensuring durability and reliability in vehicles.
CMOS technology supports low power consumption and high speed, making it ideal for modern applications.
Parallel configuration allows for higher data throughput, beneficial in performance-critical applications.
Through-hole terminal form offers strong mechanical stability and is suitable for prototyping.
Adequate number of words for moderate data storage needs across various applications.
Width of 4 bits allows for optimal data handling while keeping within compact design parameters.
Standard terminal pitch simplifies PCB design and component placement.
Provides ample data storage capacity for various applications without excessive complexity.
Higher maximum supply voltage allows for greater performance adaptability in different circuit designs.
Sufficient memory density for effective data management and storage capabilities.
Output enable feature provides control over device activity, enhancing power management.
Adequate access time ensures compatibility with a range of applications while optimizing data retrieval.
FIFO 74HC40105NB attributes and parameters. Explore more FIFO devices from NXP Semiconductors
Maximum Access Time:
Additional Features:
Cycle Time:
JESD-30 Code:
JESD-609 Code:
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Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Qualification:
Maximum Seated Height:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
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Width:
74HC40105NB Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
MBR0520LT3G
Onsemi
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
Hitano Enterprise
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Vishay Telefunken
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
Toshiba
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
FDN5618P
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138BKW,115
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
BAV99
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
261
Deltrol Controls
Other Relays;
06035C103KAT2A
KYOCERA AVX
06035C103KAT2A by KYOCERA AVX is a SMT ceramic capacitor with 0.01uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and 10% tolerance. Ideal for applications requiring compact surface mount capacitors with stable performance in a wide temperature range.
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
STMicroelectronics
1N4148WT
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
1N4148WS
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SN74ACT7202LA25RJ
Texas Instruments
SN74ACT7202LA25RJ by Texas Instruments is a FIFO chip with 1KX9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is used in applications requiring fast asynchronous data transfer, such as communication systems and data storage devices.
SN74ABT7819-12PH
SN74ABT7819-12PH by Texas Instruments is a 512x18 FIFO with 80 terminals and operates at a max clock frequency of 80 MHz. It features a cycle time of 12.5 ns, synchronous operation, and output enable functionality. This memory IC type is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT3622-15PQ
SN74ACT3622-15PQ by Texas Instruments is a FIFO with 256x36 organization, operating at 66.7MHz cycle time of 15ns. It has a memory density of 9216 bit and is ideal for applications requiring fast synchronous data transfer in commercial temperature grades.
SN74ABT3611-30PQ
SN74ABT3611-30PQ by Texas Instruments is a FIFO memory IC with 64x36 organization, 30 ns cycle time, and 33.4 MHz clock frequency. It operates synchronously at 5V and has a commercial temperature grade. Ideal for applications requiring fast data storage and retrieval in parallel processing systems.
IDT7201LA25SOI8
Integrated Device Technology
IDT7201LA25SOI8 by Integrated Device Technology is a FIFO memory with 512x9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is ideal for industrial applications requiring fast and reliable data storage and retrieval in a compact small outline package.
IDT72V273L7-5BCGI8
Renesas Electronics
The Renesas Electronics IDT72V273L7-5BCGI8 is a FIFO with 16Kx18 organization, operating at 133.3MHz clock frequency and 7.5ns cycle time. It features a low profile grid array package suitable for industrial applications requiring synchronous operation and a memory density of 294912 bits.
IDT7203L12J8
IDT7203L12J8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 20ns cycle time and 50MHz clock frequency. It is used in applications requiring fast data storage and retrieval, such as networking equipment and communication systems.
SN74ACT2236-20FNR
SN74ACT2236-20FNR by Texas Instruments is a 2Kx9 FIFO chip with 20ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a memory density of 18432 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7204L12JG8
Renesas Electronics 7204L12JG8 is a FIFO chip carrier with 4Kx9 organization, operating at 50 MHz clock frequency. It has a cycle time of 20 ns and supports parallel mode. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT7200L-15RJR
SN74ACT7200L-15RJR by Texas Instruments is a FIFO chip with 256x9 organization, 25 ns cycle time, and 15 ns access time. It operates asynchronously at a supply voltage of 4.5V to 5.5V, making it ideal for high-speed data buffering applications in commercial temperature environments.
SN74ACT7202LA-15DVR
SN74ACT7202LA-15DVR by Texas Instruments is a FIFO with 1KX9 organization, 25 ns cycle time, and 5V nominal voltage. It operates in asynchronous mode and has a memory density of 9216 bit. This device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V82L15PAG8
The Renesas Electronics 72V82L15PAG8 is a FIFO memory IC with 1Kx9 organization, operating at 3.3V. It features a max access time of 15ns, parallel technology, and a small outline thin profile package shape. Ideal for applications requiring fast data transfer in commercial temperature environments.
IDT7202LA35SO8
IDT7202LA35SO8 by Integrated Device Technology is a FIFO with 1KX9 organization, 45 ns cycle time, and 22.2 MHz clock frequency. It operates at 5V, has a small outline package style, and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
5962-9560901NXD
The Texas Instruments 5962-9560901NXD FIFO operates synchronously at a clock frequency of up to 50 MHz with a cycle time of 20 ns. It features a memory width of 36 bits and a density of 36864 bits, making it ideal for military-grade applications requiring fast data processing and storage in harsh environments. The device is designed for parallel operation with low power consumption and high reliability, suitable for critical military systems where speed and efficiency are paramount.
SN74ABT3614-30PQR
SN74ABT3614-30PQR by Texas Instruments is a FIFO with 64x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and storage in synchronous operating mode.
SN74ACT7201LA50NP
SN74ACT7201LA50NP by Texas Instruments is a FIFO memory with 512x9 organization, operating at 15 MHz clock frequency. It has a cycle time of 65 ns and operates on a 5V supply voltage. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT2235FN
SN74ACT2235FN by Texas Instruments is a 2Kx9 BI-DIRECTIONAL FIFO chip carrier with 18432-bit memory density. It operates at up to 40MHz clock frequency and consumes a max of 230mA supply current. Ideal for applications requiring asynchronous operation, such as data buffering in commercial-grade systems.
SN74ACT3641-30PQ
SN74ACT3641-30PQ by Texas Instruments is a 1Kx36 CMOS FIFO memory with 30ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a max clock frequency of 33.4MHz. Ideal for applications requiring high-speed data storage and retrieval in commercial temperature environments.
7201LA25SOI8
7201LA25SOI8 by Integrated Device Technology is a FIFO memory with 512x9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is designed for industrial applications requiring fast data storage and retrieval in a compact small outline package.
IDT7202LA25TPI
Rochester Electronics
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
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74HC40105D,652
74HC40105D,652 by NXP Semiconductors is a FIFO memory IC with a cycle time of 71.428 ns and an operating mode of asynchronous. It is commonly used in automotive applications due to its temperature grade and moisture sensitivity level.
Nexperia
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
74HC40105D,653
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 9.9 mm;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 14 MHz;
74HC40105DB,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; No. of Functions: 1;
74HC40105N
Philips Semiconductors
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T16;
74HC40105N,652
74HC40105N,652 by NXP Semiconductors is a FIFO IC with 16x4 organization, operating at 14 MHz clock frequency. It has a cycle time of 71.428 ns and supports an asynchronous mode. This CMOS technology device is ideal for automotive applications due to its wide temperature range and memory width of 4 bits.
74HC40105PW,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
74HC40105PW,118
74HC40105PW,118 by NXP Semiconductors is a FIFO device with a cycle time of 71.428 ns and an operating mode of asynchronous. It has a memory width of 4 and can be used in automotive applications due to its temperature grade.
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Access Time: 600 ns;
74HC7403D,512
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Access Time: 98 ns;
74HC40105D
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
74HC40105PW
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
74HC40105PW-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
74HC40105DB,118
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
74HC40105DB-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2 V;
74HC40105D-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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