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74HC7403D,512

NXP Semiconductors

74HC7403D,512 by NXP Semiconductors

NXP Semiconductors' 74HC7403D,512 FIFO chip operates at 5V with a cycle time of 83.33ns and supports a max clock frequency of 12MHz. Ideal for automotive applications, it features a memory width of 4 bits, output enable function, and offers a memory density of 256 bits.

Median Price

$1.980

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.180

10k+ parts

$1.180

1,442

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-

$1.180

$1.180

Rochester

USA . 1,417 parts In-Stock

1+ parts

-

100+ parts

$1.980

1k+ parts

$1.770

10k+ parts

$1.660

1,417

-

$1.980

$1.770

$1.660

Verical

USA . 1,417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.212

10k+ parts

$2.075

1,417

-

-

$2.212

$2.075

Distributors (In-Stock)

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$1.046

100+ parts

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450

$1.046

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Digiode

USA . 3,542 parts In-Stock

1+ parts

$1.074

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3,542

$1.074

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VNN

France . 2,774 parts In-Stock

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2,774

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Anansix

USA . 1,631 parts In-Stock

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Vyrian

USA . 1,393 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,170 parts In-Stock

1+ parts

$0.960

100+ parts

$0.936

1k+ parts

$0.931

10k+ parts

-

1,170

$0.960

$0.936

$0.931

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Ampacity Inc.

Singapore . 1,040 parts In-Stock

1+ parts

$0.960

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1,040

$0.960

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Corphita

USA . 4,756 parts In-Stock

1+ parts

$1.017

100+ parts

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4,756

$1.017

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Continental Prestige Electronics

USA . 5,202 parts In-Stock

1+ parts

$1.046

100+ parts

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10k+ parts

$1.025

5,202

$1.046

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$1.025

Argo Parts USA

USA . 2,391 parts In-Stock

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$1.046

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2,391

$1.046

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Netroflash

USA . 500 parts In-Stock

1+ parts

$1.046

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500

$1.046

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Microchip USA

USA . 141 parts In-Stock

1+ parts

$1.958

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141

$1.958

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UNI Independent Distributors

Spain . 4,260 parts In-Stock

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Overview

Experience seamless data transfer and efficient memory management with the 74HC7403D,512 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch quality and reliability. This FIFO device is perfect for various applications, offering a high-speed cycle time of 83.33ns and an operating mode of asynchronous, ensuring smooth operation. With a nominal supply voltage of 5V and power supplies ranging from 2V to 6V, this product provides versatility and flexibility. Trust NXP Semiconductors to enhance your electronic projects with cutting-edge technology and exceptional performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy in the package body material ensures durability and protection for the internal components, making this product suitable for various environments.

Cycle Time: 83.33 ns

The fast cycle time of 83.33 ns allows for efficient data transfer and processing, making this FIFO product ideal for high-speed applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode provides flexibility in data transfer timing, allowing this FIFO product to work seamlessly with different clock frequencies and systems.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures stable and reliable operation of this FIFO product, making it suitable for a wide range of electronic devices and applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this FIFO product can withstand high-temperature environments, making it suitable for industrial and automotive applications.

Technology: CMOS

The CMOS technology used in this FIFO product offers low power consumption and high noise immunity, making it energy efficient and reliable for long-term use.

Technical Specifications

FIFO 74HC7403D,512 attributes and parameters. Explore more FIFO devices from NXP Semiconductors

Specs

Maximum Access Time:

98 ns

Additional Features:

REGISTER BASED; BUBBLE BACK 2.7US

Maximum Clock Frequency (fCLK):

12 MHz

Cycle Time:

83.33 ns

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Memory Density:

256 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X4

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FIFOs

Maximum Supply Current:

1 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

74HC7403D,512 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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