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CYF0018V18L-133BGXI

Cypress Semiconductor

CYF0018V18L-133BGXI by Cypress Semiconductor

CYF0018V18L-133BGXI by Cypress Semiconductor is a FIFO with 512KX36 organization, operating at 133 MHz clock frequency. It has a cycle time of 7.5 ns and can handle a max supply current of 600 mA. Ideal for industrial applications requiring fast synchronous data processing in compact designs.

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Overview

Unlock the power of seamless data transfer with the CYF0018V18L-133BGXI by Cypress Semiconductor. This cutting-edge FIFO device offers unparalleled quality and reliability, backed by a renowned manufacturer in the industry. Ideal for a wide range of applications, this FIFO ensures smooth operation and maximum efficiency. Experience lightning-fast cycle times and synchronous performance, all while enjoying the convenience of surface mount installation. Say goodbye to data bottlenecks and hello to effortless data management with the CYF0018V18L-133BGXI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for various operating conditions.

Cycle Time: 7.5 ns

With a fast cycle time of 7.5 ns, this FIFO device offers efficient data storage and retrieval, allowing for quick processing of data.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures reliable and synchronized data transfers, making this FIFO ideal for applications requiring precise timing.

Maximum Clock Frequency (fCLK): 133 MHz

The high maximum clock frequency of 133 MHz enables fast data throughput and high-speed operation, making this FIFO suitable for demanding applications.

Memory Density: 18874368 bit

With a high memory density of 18874368 bits, this FIFO device offers ample storage capacity for data-intensive applications, making it a versatile choice for various use cases.

Technical Specifications

FIFO CYF0018V18L-133BGXI attributes and parameters. Explore more FIFO devices from Cypress Semiconductor

Specs

Maximum Access Time:

10 ns

Additional Features:

ALSO REQUIRED 1.8V SUPPLY NOM, ALTERNATE MIN MEMORY WIDTH : 9

Maximum Clock Frequency (fCLK):

133 MHz

Cycle Time:

7.5 ns

JESD-30 Code:

R-PBGA-B209

JESD-609 Code:

e1

Length:

22 mm

Memory Density:

18874368 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

209

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA209,11X19,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.96 mm

Sub-Category:

FIFOs

Maximum Supply Current:

600 mA

Maximum Supply Voltage (Vsup):

1.575 V

Minimum Supply Voltage (Vsup):

1.425 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

CYF0018V18L-133BGXI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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