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SN74ABT7815-20PQ

Texas Instruments

SN74ABT7815-20PQ by Texas Instruments

SN74ABT7815-20PQ by Texas Instruments is a 128x36 bi-directional FIFO memory IC with a max clock frequency of 50 MHz. Operating at 5V, it has a max access time of 12 ns and operates in synchronous mode. This device is commonly used in applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,527 parts In-Stock

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7,527

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Digiode

USA . 1,407 parts In-Stock

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1,407

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Distributors (Availability)

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Parana Technologies

USA . 719 parts In-Stock

1+ parts

$2.890

100+ parts

-

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$3.383

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719

$2.890

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$3.383

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DigiPath Technology Company

USA . 940 parts In-Stock

1+ parts

$3.182

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940

$3.182

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ChromeModa Solutions

Germany . 2,043 parts In-Stock

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$3.247

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$2.663

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2,043

$3.247

$2.663

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IDEA Electronic Components Group

UK . 1,399 parts In-Stock

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$3.247

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$2.922

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1,399

$3.247

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$2.922

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One Stop Electronics

USA . 1,509 parts In-Stock

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$10.000

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1,509

$10.000

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AZTECH Wire

Italy . 416 parts In-Stock

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$14.224

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416

$14.224

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Corphita

USA . 2,251 parts In-Stock

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Overview

Enhance your electronic projects with the SN74ABT7815-20PQ by Texas Instruments, a top-of-the-line FIFO memory IC. Crafted with precision and expertise, Texas Instruments delivers unmatched quality and reliability in every product. This FIFO device is perfect for applications requiring data buffering, such as telecommunications and networking equipment. With its fast access time and synchronous operation, this IC ensures smooth and efficient data flow. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Upgrade your designs with the SN74ABT7815-20PQ and experience the unparalleled value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and lightweight design for easy handling and installation.

Surface Mount: YES

Allows for easy integration onto circuit boards without the need for additional hardware.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard 5V power supply, making it compatible with various systems.

Maximum Clock Frequency (fCLK): 50 MHz

Supports fast data processing with a maximum clock frequency of 50 MHz.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with a temperature range of 0 to 70°C.

Memory IC Type: BI-DIRECTIONAL FIFO

Features a bi-directional FIFO memory type for efficient data storage and retrieval.

Technical Specifications

FIFO SN74ABT7815-20PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

12 ns

Maximum Clock Frequency (fCLK):

50 MHz

JESD-30 Code:

S-PQFP-G132

Memory IC Type:

Memory Width:

36

No. of Terminals:

132

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128X36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

FIFOs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ABT7815-20PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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