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72V263L6BCG8

Integrated Device Technology

72V263L6BCG8 by Integrated Device Technology

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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VNN

France . 4,483 parts In-Stock

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Vyrian

USA . 499 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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AZTECH Wire

Italy . 646 parts In-Stock

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Ampacity Inc.

Singapore . 1,220 parts In-Stock

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Microchip USA

USA . 3,098 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,659 parts In-Stock

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Continental Prestige Electronics

USA . 1,891 parts In-Stock

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Argo Parts USA

USA . 1,523 parts In-Stock

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Aranea Global

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Technical Specifications

FIFO 72V263L6BCG8 attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

4 ns

Additional Features:

IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE

Cycle Time:

6 ns

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

11 mm

Memory Density:

147456 bit

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

11 mm

Trade Compliance

72V263L6BCG8 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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