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SN74ACT72231L-50RJ

Texas Instruments

SN74ACT72231L-50RJ by Texas Instruments

SN74ACT72231L-50RJ by Texas Instruments is a FIFO chip with 2Kx9 organization, 50ns cycle time, and 20MHz clock frequency. It operates synchronously at 5V and has a memory density of 18432 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$20.387

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,924 parts In-Stock

1+ parts

-

100+ parts

$16.310

1k+ parts

$14.590

10k+ parts

$13.740

15,924

-

$16.310

$14.590

$13.740

DigiKey

USA . 15,924 parts In-Stock

1+ parts

-

100+ parts

$21.460

1k+ parts

-

10k+ parts

-

15,924

-

$21.460

-

-

Verical

USA . 14,004 parts In-Stock

1+ parts

-

100+ parts

$20.387

1k+ parts

$18.238

10k+ parts

$17.175

14,004

-

$20.387

$18.238

$17.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 313 parts In-Stock

1+ parts

$17.224

100+ parts

-

1k+ parts

-

10k+ parts

-

313

$17.224

-

-

-

Vyrian

USA . 3,111 parts In-Stock

1+ parts

$18.130

100+ parts

-

1k+ parts

-

10k+ parts

-

3,111

$18.130

-

-

-

DigiKey Marketplace

USA . 48,338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

48,338

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 952 parts In-Stock

1+ parts

$4.701

100+ parts

-

1k+ parts

$5.188

10k+ parts

-

952

$4.701

-

$5.188

-

DigiPath Technology Company

USA . 1,756 parts In-Stock

1+ parts

$5.176

100+ parts

$4.762

1k+ parts

-

10k+ parts

-

1,756

$5.176

$4.762

-

-

ChromeModa Solutions

Germany . 6,329 parts In-Stock

1+ parts

$5.282

100+ parts

$4.331

1k+ parts

-

10k+ parts

-

6,329

$5.282

$4.331

-

-

IDEA Electronic Components Group

UK . 7 parts In-Stock

1+ parts

$5.282

100+ parts

-

1k+ parts

$4.754

10k+ parts

-

7

$5.282

-

$4.754

-

Ampacity Inc.

Singapore . 19,669 parts In-Stock

1+ parts

$15.410

100+ parts

-

1k+ parts

-

10k+ parts

-

19,669

$15.410

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-

-

Corphita

USA . 3,385 parts In-Stock

1+ parts

$16.317

100+ parts

-

1k+ parts

-

10k+ parts

-

3,385

$16.317

-

-

-

Overview

Upgrade your electronics with the Texas Instruments SN74ACT72231L-50RJ FIFO chip carrier. With a fast 50 ns cycle time and synchronous operation, this high-quality component is perfect for a wide range of applications. Enjoy the benefits of 3-state output characteristics, a 20 MHz clock frequency, and a commercial temperature grade. Trust in Texas Instruments' reputation for excellence and innovation to deliver reliable performance and value. Improve your system's efficiency and functionality with the SN74ACT72231L-50RJ FIFO from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FIFO, ensuring a longer lifespan.

Cycle Time: 50 ns

The quick cycle time of 50 ns allows for efficient processing and transfer of data, making this FIFO suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power systems, making integration easier.

Organization: 2KX9

With an organization of 2KX9, this FIFO can handle a large amount of data efficiently, making it ideal for applications requiring memory storage and retrieval.

Maximum Clock Frequency (fCLK): 20 MHz

The high maximum clock frequency of 20 MHz allows for fast data transfer rates, making this FIFO suitable for time-sensitive operations.

Memory IC Type: OTHER FIFO

The specific type of memory IC used in this FIFO ensures reliable performance and compatibility with various systems and applications.

Technical Specifications

FIFO SN74ACT72231L-50RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

25 ns

Maximum Clock Frequency (fCLK):

20 MHz

Cycle Time:

50 ns

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.995 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sub-Category:

FIFOs

Maximum Supply Current:

160 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4554 mm

Trade Compliance

SN74ACT72231L-50RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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