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IDT72T36135ML6BBI

Renesas Electronics

IDT72T36135ML6BBI by Renesas Electronics

IDT72T36135ML6BBI by Renesas Electronics is a FIFO memory with a cycle time of 6 ns and a max clock frequency of 166 MHz. It is commonly used in industrial applications that require synchronous or asynchronous operation, such as data buffering and data storage.

Median Price

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Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,669 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Corohmni

South Africa . 876 parts In-Stock

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$4.426

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$4.426

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Ampacity Inc.

Singapore . 1,181 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 742 parts In-Stock

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Semicontronic

India . 577 parts In-Stock

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$21.000

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$20.475

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$20.370

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Argo Parts USA

USA . 3,698 parts In-Stock

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Continental Prestige Electronics

USA . 2,416 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Discover the IDT72T36135ML6BBI by Renesas Electronics, a top-quality FIFO product that brings immense value to your projects. With its advanced technology and reliable performance, this product is perfect for various applications. Renesas Electronics, a renowned manufacturer, ensures exceptional quality and durability. The IDT72T36135ML6BBI offers seamless operation in both synchronous and asynchronous modes, giving you flexibility and convenience. Its high-speed cycle time of 6 ns and maximum clock frequency of 166 MHz guarantee efficient data transfer. Experience the benefits of this cutting-edge product and take your projects to new heights of success!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material provides durability and protection for the product, making it a reliable choice.

Surface Mount:

YES. With surface mount capability, this product can be easily integrated into circuit boards, saving space and simplifying assembly.

Cycle Time:

6 ns. The fast cycle time ensures quick data transfer, improving the overall performance of the product.

No. of Functions:

1. This product offers a single integrated function, simplifying its usage and reducing complexity in design.

Package Shape:

SQUARE. The square shape of the package allows for efficient space utilization, making it suitable for compact electronic devices.

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS. The product can operate in both synchronous and asynchronous modes, providing flexibility for different applications.

Nominal Supply Voltage / Vsup (V):

2.5. The nominal supply voltage ensures compatibility with standard power sources, enhancing ease of integration.

Power Supplies (V):

2.5. The product operates on a 2.5V power supply, which is commonly available, making it convenient for various setups.

No. of Terminals:

240. With a high number of terminals, this product allows for a wide range of connectivity options, enabling versatile usage.

Package Style (Meter):

GRID ARRAY. The grid array package style provides a reliable and secure mechanical connection, ensuring stable operation.

Maximum Operating Temperature:

85°C. The high maximum operating temperature allows for reliable performance in demanding environments.

Organization:

512KX36. The product has an organization of 512Kx36, providing a large storage capacity for data.

Minimum Operating Temperature:

40°C. The low minimum operating temperature ensures reliable functionality even in extreme temperature conditions.

Terminal Finish:

Tin/Lead (Sn63Pb37). The tin/lead terminal finish offers excellent solderability, facilitating easy assembly and maintenance.

Terminal Position:

BOTTOM. The bottom terminal position simplifies the integration of the product into circuit boards, reducing installation complexity.

Maximum Clock Frequency (fCLK):

166 MHz. The high maximum clock frequency enables fast data processing and efficient operation.

Minimum Supply Voltage (Vsup):

2.375 V. The low minimum supply voltage allows for energy-efficient operation, reducing power consumption.

Maximum Time At Peak Reflow Temperature (s):

30. The product can sustain peak reflow temperature for up to 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C:

225. The high peak reflow temperature tolerance allows for robust and reliable soldering, ensuring product integrity.

Temperature Grade:

INDUSTRIAL. This product is designed for industrial temperature environments, making it suitable for rugged applications.

Technology:

CMOS. The use of CMOS technology provides low power consumption, high noise immunity, and reliable operation.

Parallel or Serial:

PARALLEL. The product supports parallel data transfer, enabling fast and efficient communication between devices.

Terminal Form:

BALL. The ball terminal form ensures secure mechanical and electrical connections, enhancing the product's reliability.

Maximum Supply Current:

180 mA. The low maximum supply current consumption enables energy-efficient operation, reducing overall power requirements.

No. of Words:

524288 words. With a large word count, this product offers ample storage capacity for data-intensive applications.

Memory Width:

36. The 36-bit memory width allows for the efficient handling of large amounts of data, improving processing speed.

Terminal Pitch:

1 mm. The compact 1mm terminal pitch provides high-density interconnectivity options, making the product suitable for space-constrained designs.

No. of Words Code:

512K. The product has a word code of 512K, allowing for a large variation of data storage and retrieval.

Moisture Sensitivity Level (MSL):

3. With an MSL of 3, this product can withstand moderate moisture exposure during handling and assembly.

Maximum Supply Voltage (Vsup):

2.625 V. The high maximum supply voltage provides a wide operating range, ensuring compatibility with different power sources.

Memory Density:

18874368 bit. This product offers a high memory density, allowing for efficient storage and retrieval of large datasets.

Memory IC Type:

OTHER FIFO. The memory IC type being an FIFO enables efficient and organized data handling for various applications.

Output Enable:

YES. With output enable functionality, this product provides control over the data output, adding flexibility to the system design.

Maximum Standby Current:

0.14 Amp. The low maximum standby current consumption saves power during idle periods, increasing energy efficiency.

Maximum Access Time:

3.8 ns. The short maximum access time ensures quick data retrieval, enhancing overall system responsiveness.

Technical Specifications

FIFO IDT72T36135ML6BBI attributes and parameters. Explore more FIFO devices from Renesas Electronics

Specs

Maximum Access Time:

3.8 ns

Maximum Clock Frequency (fCLK):

166 MHz

Cycle Time:

6 ns

JESD-30 Code:

S-PBGA-B240

JESD-609 Code:

e0

Memory Density:

18874368 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

240

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA240,18X18,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

225

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Standby Current:

.14 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

180 mA

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

IDT72T36135ML6BBI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Renesas Electronics

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