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IDT72801L10PF

Integrated Device Technology

IDT72801L10PF by Integrated Device Technology

IDT72801L10PF FIFO by Integrated Device Technology features a cycle time of 10 ns and operates at a max clock frequency of 100 MHz. With an organization of 256X9, it is suitable for applications requiring fast data processing and storage in commercial-grade environments. This FIFO supports parallel operation with a memory density of 2304 bit, making it ideal for high-speed data buffering tasks.

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Vyrian

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AZTECH Wire

Italy . 640 parts In-Stock

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Overview

Experience seamless data transfer with the IDT72801L10PF FIFO from Integrated Device Technology. Known for their top-quality products, Integrated Device Technology brings you a reliable solution for your data storage needs. This FIFO device offers fast cycle times, synchronous operation, and a wide temperature range, making it ideal for a variety of applications. With a compact design and low power consumption, this product provides excellent value and efficiency for your projects. Upgrade your system performance with the IDT72801L10PF today.

Feature Benefit Bullets

Termination Contact Finish: Tin (Sn)

Tin finish provides good conductivity and corrosion resistance, ensuring a reliable connection.

Coupling Type: SNAP

Snap coupling allows for quick and easy connection, ideal for applications where frequent setup or changes are needed.

Insulator Material: POLYBUTYLENE TEREPHTHALATE

Polybutylene terephthalate offers excellent electrical insulation properties, reducing signal loss and interference.

Connector Type: OTHER RF CONNECTOR

Specifically designed for RF applications, ensuring optimal performance and compatibility with RF systems.

Contact Material: COPPER ALLOY

Copper alloy contacts provide high conductivity and durability, improving signal transmission quality.

Voltage Standing Wave Ratio: 1.3

Low VSWR indicates minimal signal loss and efficient power transfer, resulting in reliable signal transmission.

Mounting Type: CABLE

Designed for cable mounting, offering versatility and ease of integration into existing systems.

Characteristic Impedance: 50 ohm

Standard impedance ensures compatibility with a wide range of RF devices and systems.

Termination Type: SOLDER

Solder termination provides a secure and permanent connection, minimizing signal loss and ensuring long-term reliability.

Contact Gender: MALE

Male contacts are commonly used for plug-type connectors, offering a secure fit and reliable signal transmission.

Body or Shell Style: PLUG

Plug-style design offers easy and secure connection, making it suitable for various RF applications.

Mounting Style: RIGHT ANGLE

Right-angle mounting allows for space-saving installation in tight spaces or configurations, optimizing system layout.

Maximum Operating Frequency: 3 GHz

High operating frequency capability supports broader bandwidth, making it suitable for demanding RF applications.

Technical Specifications

FIFO IDT72801L10PF attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

6.5 ns

Maximum Clock Frequency (fCLK):

100 MHz

Cycle Time:

10 ns

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e0

Length:

14 mm

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

9

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

64

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X9

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

240

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.01 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

IDT72801L10PF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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