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IDT7203L25PI

Integrated Device Technology

IDT7203L25PI by Integrated Device Technology

IDT7203L25PI by Integrated Device Technology is a FIFO memory chip with 2Kx9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is designed for industrial applications requiring fast and reliable data storage and retrieval in parallel mode.

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Overview

Enhance your electronic designs with the IDT7203L25PI FIFO from Integrated Device Technology. This high-quality product offers fast cycle times, a wide operating temperature range, and a generous memory density of 18432 bits. Ideal for industrial applications, this FIFO is versatile and reliable, ensuring seamless data storage and retrieval. With a maximum clock frequency of 28.5 MHz and a low standby current of 0.002 Amp, this device provides exceptional performance while conserving energy. Trust in Integrated Device Technology's expertise to deliver top-notch solutions for your projects.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides a durable and lightweight casing for the FIFO, ensuring longevity and ease of handling.

Cycle Time:

35 ns - The fast cycle time of this FIFO allows for quick data transfer, making it ideal for high-speed applications.

Package Shape:

RECTANGULAR - The rectangular shape of the package allows for efficient use of space in a circuit board layout.

Operating Mode:

ASYNCHRONOUS - This asynchronous operating mode ensures flexibility in data transmission, accommodating varying speeds of input/output devices.

Nominal Supply Voltage / Vsup (V):

5 - With a stable supply voltage of 5V, this FIFO operates reliably within specified parameters.

Power Supplies (V):

5 - The consistent power supply of 5V maintains consistent performance of the FIFO.

No. of Terminals:

28 - The multiple terminals provide connectivity options for various systems and devices.

Package Style (Meter):

IN-LINE - The in-line package style allows for efficient placement on a circuit board, optimizing space utilization.

Maximum Operating Temperature:

85 °C - With a high maximum operating temperature, this FIFO can withstand harsh environmental conditions.

Organization:

2KX9 - The organization of 2KX9 allows for efficient storage and retrieval of data in a parallel fashion.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature ensures reliable performance in cold environments.

Terminal Finish:

Tin/Lead (Sn85Pb15) - The tin/lead terminal finish provides good solderability for easy integration into circuitry.

Terminal Position:

DUAL - The dual terminal position offers flexibility in connection options for diverse systems.

Maximum Seated Height:

4.699 mm - The low seated height of the FIFO allows for compact designs in electronic systems.

Maximum Clock Frequency (fCLK):

28.5 MHz - The high clock frequency enables fast data processing and transfer rates.

Width:

15.24 mm - The compact width of the FIFO allows for easy integration into circuit board layouts.

Minimum Supply Voltage (Vsup):

4.5 V - The low minimum supply voltage ensures compatibility with a range of power sources.

Maximum Time At Peak Reflow Temperature (s):

20 - The FIFO can withstand the peak reflow temperature for a maximum of 20 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C:

240 - The high peak reflow temperature of 240°C ensures efficient soldering in manufacturing processes.

Length:

36.576 mm - The length of the FIFO allows for flexibility in placement on a circuit board.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade ensures consistent performance in demanding environments.

Technology:

CMOS - The CMOS technology used in this FIFO provides low power consumption and high noise immunity.

Parallel or Serial:

PARALLEL - The parallel data transfer mode offers high-speed communication between the FIFO and connected devices.

Terminal Form:

THROUGH-HOLE - The through-hole terminal form provides strong mechanical connections for reliable data transfer.

Maximum Supply Current:

120 mA - The maximum supply current of 120 mA ensures proper operation of the FIFO within specified limits.

No. of Words:

2048 words - The large number of words that can be stored in the FIFO allows for ample data storage capacity.

Memory Width:

9 - The memory width of 9 bits provides flexibility in storing and accessing data in parallel.

Terminal Pitch:

2.54 mm - The terminal pitch of 2.54 mm allows for easy connections and soldering in circuit board designs.

No. of Words Code:

2K - The 2K code signifies the capacity of the FIFO to store 2048 words of data.

Maximum Supply Voltage (Vsup):

5.5 V - With a maximum supply voltage of 5.5V, the FIFO operates safely within specified voltage limits.

Memory Density:

18432 bit - The high memory density of 18432 bits allows for efficient storage and retrieval of data.

Memory IC Type:

OTHER FIFO - This indicates that the FIFO is specifically designed for memory functions in electronic systems.

Maximum Standby Current:

0.002 Amp - The low standby current consumption of 0.002 Amp ensures energy efficiency when the FIFO is not actively processing data.

Maximum Access Time:

25 ns - The fast maximum access time of 25 ns ensures quick retrieval of data from the FIFO.

Technical Specifications

FIFO IDT7203L25PI attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

25 ns

Additional Features:

RETRANSMIT

Maximum Clock Frequency (fCLK):

28.5 MHz

Cycle Time:

35 ns

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

Length:

36.576 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

9

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

240

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.699 mm

Maximum Standby Current:

.002 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

120 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15.24 mm

Trade Compliance

IDT7203L25PI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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