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SN74ACT7200L35NP

Texas Instruments

SN74ACT7200L35NP by Texas Instruments

SN74ACT7200L35NP by Texas Instruments is a FIFO memory with 256x9 organization, operating at 22.2 MHz clock frequency and 45 ns cycle time. It is designed for applications requiring fast asynchronous data storage and retrieval in commercial temperature environments.

Median Price

$4.444

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 450 parts In-Stock

1+ parts

-

100+ parts

$3.950

1k+ parts

$3.540

10k+ parts

$3.330

450

-

$3.950

$3.540

$3.330

Verical

USA . 450 parts In-Stock

1+ parts

-

100+ parts

$4.938

1k+ parts

$4.425

10k+ parts

$4.162

450

-

$4.938

$4.425

$4.162

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,535 parts In-Stock

1+ parts

$4.180

100+ parts

-

1k+ parts

-

10k+ parts

-

1,535

$4.180

-

-

-

Vyrian

USA . 7,685 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,685

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 618 parts In-Stock

1+ parts

$2.380

100+ parts

-

1k+ parts

$2.877

10k+ parts

-

618

$2.380

-

$2.877

-

DigiPath Technology Company

USA . 66 parts In-Stock

1+ parts

$2.621

100+ parts

$2.411

1k+ parts

-

10k+ parts

-

66

$2.621

$2.411

-

-

ChromeModa Solutions

Germany . 3,456 parts In-Stock

1+ parts

$2.674

100+ parts

$2.193

1k+ parts

-

10k+ parts

-

3,456

$2.674

$2.193

-

-

IDEA Electronic Components Group

UK . 1,263 parts In-Stock

1+ parts

$2.674

100+ parts

-

1k+ parts

$2.407

10k+ parts

-

1,263

$2.674

-

$2.407

-

Ampacity Inc.

Singapore . 20 parts In-Stock

1+ parts

$3.740

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$3.740

-

-

-

Corphita

USA . 2,642 parts In-Stock

1+ parts

$3.960

100+ parts

-

1k+ parts

-

10k+ parts

-

2,642

$3.960

-

-

-

Component Stockers USA

USA . 21 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

-

21

$4.500

-

-

-

Microchip USA

USA . 1,226 parts In-Stock

1+ parts

$27.430

100+ parts

$27.260

1k+ parts

$27.180

10k+ parts

$27.090

1,226

$27.430

$27.260

$27.180

$27.090

Overview

Experience seamless data transfer with the Texas Instruments SN74ACT7200L35NP FIFO. Known for their high-quality products, Texas Instruments delivers reliability and performance in every component they manufacture. The SN74ACT7200L35NP is perfect for applications requiring fast and efficient data storage and retrieval. With a maximum clock frequency of 22.2 MHz and a cycle time of just 45 ns, this FIFO offers unmatched speed and precision. Trust Texas Instruments to provide top-tier technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Cycle Time: 45 ns

This fast cycle time ensures efficient data transfer and processing, making it suitable for high-speed applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for flexible data transfers without requiring a synchronized clock signal, enhancing versatility.

Organization: 256X9

The 256 words of 9 bits each provide ample storage capacity for data organization and retrieval, making it suitable for various data handling tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the FIFO product.

Memory IC Type: OTHER FIFO

Being a FIFO (First-In-First-Out) memory type ensures the orderly processing of data, which is essential for applications that require proper data sequencing.

Technical Specifications

FIFO SN74ACT7200L35NP attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

35 ns

Maximum Clock Frequency (fCLK):

22.2 MHz

Cycle Time:

45 ns

JESD-30 Code:

R-PDIP-T28

Length:

34.545 mm

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.008 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

80 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74ACT7200L35NP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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