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SN74ABT3612-30PQ

Texas Instruments

SN74ABT3612-30PQ by Texas Instruments

SN74ABT3612-30PQ by Texas Instruments is a FIFO memory IC with 64x36 organization, 30 ns cycle time, and 33.4 MHz max clock frequency. It operates synchronously at 5V, suitable for commercial applications requiring fast data storage and retrieval in a compact square package.

Median Price

$14.550

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,635 parts In-Stock

1+ parts

-

100+ parts

$12.590

1k+ parts

$11.260

10k+ parts

$10.600

2,635

-

$12.590

$11.260

$10.600

DigiKey

USA . 2,635 parts In-Stock

1+ parts

-

100+ parts

$14.550

1k+ parts

-

10k+ parts

-

2,635

-

$14.550

-

-

Verical

USA . 1,980 parts In-Stock

1+ parts

-

100+ parts

$15.738

1k+ parts

$14.075

10k+ parts

$13.250

1,980

-

$15.738

$14.075

$13.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 89 parts In-Stock

1+ parts

$13.290

100+ parts

-

1k+ parts

-

10k+ parts

-

89

$13.290

-

-

-

Vyrian

USA . 2,835 parts In-Stock

1+ parts

$13.990

100+ parts

-

1k+ parts

-

10k+ parts

-

2,835

$13.990

-

-

-

DigiKey Marketplace

USA . 2,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,635

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,007 parts In-Stock

1+ parts

$2.927

100+ parts

-

1k+ parts

$3.427

10k+ parts

-

2,007

$2.927

-

$3.427

-

DigiPath Technology Company

USA . 1,729 parts In-Stock

1+ parts

$3.223

100+ parts

-

1k+ parts

-

10k+ parts

-

1,729

$3.223

-

-

-

IDEA Electronic Components Group

UK . 1,832 parts In-Stock

1+ parts

$3.289

100+ parts

-

1k+ parts

$2.960

10k+ parts

-

1,832

$3.289

-

$2.960

-

ChromeModa Solutions

Germany . 642 parts In-Stock

1+ parts

$3.289

100+ parts

$2.697

1k+ parts

-

10k+ parts

-

642

$3.289

$2.697

-

-

Ampacity Inc.

Singapore . 2,176 parts In-Stock

1+ parts

$11.890

100+ parts

-

1k+ parts

-

10k+ parts

-

2,176

$11.890

-

-

-

Corphita

USA . 805 parts In-Stock

1+ parts

$12.591

100+ parts

-

1k+ parts

-

10k+ parts

-

805

$12.591

-

-

-

Microchip USA

USA . 153 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

153

-

-

-

-

Overview

Experience seamless data transfer and reliable performance with the SN74ABT3612-30PQ FIFO by Texas Instruments. As a trusted leader in semiconductor manufacturing, Texas Instruments ensures top-quality products that meet the demands of various applications. Whether you need fast and efficient data storage in communication systems or industrial automation, this FIFO device offers a solution that is both versatile and dependable. Stay ahead of the competition with the value and benefits that this product brings to your projects. Trust Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the FIFO, ensuring reliable performance in various operating conditions.

Cycle Time: 30 ns

The fast cycle time of 30 ns allows for quick data transfer and processing, making this FIFO suitable for applications requiring high-speed operation.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems seamless.

Maximum Clock Frequency (fCLK): 33.4 MHz

With a maximum clock frequency of 33.4 MHz, this FIFO can handle high-speed data processing tasks efficiently, making it ideal for demanding applications.

Memory Density: 2304 bit

The high memory density of 2304 bits allows for storing a large amount of data in the FIFO, making it suitable for applications requiring extensive data buffering.

Technical Specifications

FIFO SN74ABT3612-30PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

PARITY GENERATOR/CHECKER; MAILBOX

Maximum Clock Frequency (fCLK):

33.4 MHz

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

24.13 mm

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

132

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK, BUMPER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FIFOs

Maximum Supply Current:

130 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.13 mm

Trade Compliance

SN74ABT3612-30PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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