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SN74V215-20PAG

Texas Instruments

SN74V215-20PAG by Texas Instruments

SN74V215-20PAG by Texas Instruments is a FIFO memory IC with 512x18 organization and 512 words code. It operates synchronously with a cycle time of 20 ns and has a max clock frequency of 133 MHz. This IC is commonly used in applications that require high-speed data buffering and storage.

Median Price

$7.555

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,094 parts In-Stock

1+ parts

$8.355

100+ parts

$7.298

1k+ parts

$5.033

10k+ parts

-

3,094

$8.355

$7.298

$5.033

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Rochester

USA . 4,307 parts In-Stock

1+ parts

-

100+ parts

$6.290

1k+ parts

$5.630

10k+ parts

$5.300

4,307

-

$6.290

$5.630

$5.300

DigiKey

USA . 4,307 parts In-Stock

1+ parts

-

100+ parts

$6.860

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4,307

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$6.860

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Verical

USA . 1,917 parts In-Stock

1+ parts

-

100+ parts

$8.250

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1,917

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$8.250

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Distributors (In-Stock)

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Digiode

USA . 951 parts In-Stock

1+ parts

$6.640

100+ parts

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951

$6.640

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$6.930

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300

$6.930

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Vyrian

USA . 3,487 parts In-Stock

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3,487

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 767 parts In-Stock

1+ parts

$4.209

100+ parts

-

1k+ parts

$4.646

10k+ parts

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767

$4.209

-

$4.646

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DigiPath Technology Company

USA . 792 parts In-Stock

1+ parts

$4.634

100+ parts

-

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792

$4.634

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-

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ChromeModa Solutions

Germany . 6,723 parts In-Stock

1+ parts

$4.729

100+ parts

$3.878

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-

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6,723

$4.729

$3.878

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IDEA Electronic Components Group

UK . 110 parts In-Stock

1+ parts

$4.729

100+ parts

-

1k+ parts

$4.256

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110

$4.729

-

$4.256

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Ampacity Inc.

Singapore . 3,692 parts In-Stock

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$5.940

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3,692

$5.940

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Corphita

USA . 2,722 parts In-Stock

1+ parts

$6.291

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2,722

$6.291

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Continental Prestige Electronics

USA . 4,963 parts In-Stock

1+ parts

$6.930

100+ parts

-

1k+ parts

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10k+ parts

$6.791

4,963

$6.930

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-

$6.791

Netroflash

USA . 100 parts In-Stock

1+ parts

$6.930

100+ parts

$6.791

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100

$6.930

$6.791

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Microchip USA

USA . 2,563 parts In-Stock

1+ parts

$20.360

100+ parts

$20.070

1k+ parts

$19.920

10k+ parts

$19.770

2,563

$20.360

$20.070

$19.920

$19.770

Argo Parts USA

USA . 2,456 parts In-Stock

1+ parts

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2,456

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Overview

Discover the SN74V215-20PAG, a high-quality FIFO product by Texas Instruments! As a leading manufacturer, Texas Instruments provides top-notch solutions for various applications. With its compact square package and thin profile, this product offers easy installation and space-saving benefits. Operating in synchronous mode with a cycle time of 20 ns, it ensures efficient data transfer. Boasting a 512x18 organization and 3-state output characteristics, it delivers reliable performance. With a maximum clock frequency of 133 MHz and a wide temperature range, it is perfect for commercial use. Experience the value and advantages of the SN74V215-20PAG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made of durable plastic/epoxy material, ensuring long-lasting performance and protection.

Surface Mount: YES

With surface mount capability, this product can be easily mounted onto circuit boards, saving space and simplifying the assembly process.

Cycle Time: 20 ns

The fast cycle time of 20 ns enables efficient data transfer, allowing for quick processing and improved overall system performance.

No. of Functions: 1

This product offers a single function, simplifying design and reducing complexity, making it easier to integrate into different applications.

Package Shape: SQUARE

The square package shape provides versatility and ease of installation, making it compatible with various system configurations.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures accurate and synchronized data transfer, minimizing errors and enhancing reliability.

Nominal Supply Voltage / Vsup (V): 3.3

With a nominal supply voltage of 3.3V, this product is compatible with standard power supply systems, making it easy to integrate into existing designs.

Power Supplies (V): 3.3

The 3.3V power supply support simplifies system compatibility and reduces the need for additional voltage regulation components.

No. of Terminals: 64

With 64 terminals, this product offers ample connectivity options, accommodating various input/output configurations.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style ensures space-efficient assembly and convenient integration into compact system designs.

Maximum Operating Temperature: 70 °C

This product can withstand high operating temperatures up to 70°C, allowing for reliable performance even in demanding environments.

Organization: 512X18

The organization of 512X18 provides ample memory capacity for storing and retrieving data efficiently.

Output Characteristics: 3-STATE

The 3-STATE output characteristics enable multiple devices to share the same bus, enhancing flexibility and simplifying system architecture.

Minimum Operating Temperature: 0 °C

Able to operate in temperatures as low as 0°C, this product remains functional in various environments, increasing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures superior conductivity, optimizing signal transmission and minimizing signal loss.

Terminal Position: QUAD

This product features quad terminal positioning, providing a sturdy and secure connection, minimizing the risk of disconnection or signal degradation.

Maximum Seated Height: 1.2 mm

With a low maximum seated height of 1.2 mm, this product allows for compact vertical assembly, optimizing space utilization in electronic systems.

Maximum Clock Frequency (fCLK): 133 MHz

The maximum clock frequency of 133 MHz enables high-speed data transfer and processing, ensuring efficient system operation.

Width: 10 mm

With a width of 10 mm, this product is compact and compatible with space-limited system designs.

Minimum Supply Voltage (Vsup): 3 V

This product operates with a minimum supply voltage of 3V, allowing for compatibility with a wide range of power supply systems.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product can withstand soldering processes, simplifying manufacturing and assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature tolerance of 260°C ensures the product's reliability during soldering, ensuring consistent performance after manufacturing.

Length: 10 mm

The 10 mm length of this product makes it suitable for compact system designs, saving valuable space.

Temperature Grade: COMMERCIAL

This product is designed for commercial temperature requirements, allowing for reliable operation in standard temperature environments.

Technology: CMOS

Based on CMOS technology, this product offers low power consumption and high noise immunity, ensuring efficient and reliable operation.

Parallel or Serial: PARALLEL

The parallel interface of this product enables simultaneous data transfer, providing high-speed communication and enhancing system performance.

Terminal Form: GULL WING

Featuring a gull wing terminal form, this product provides a secure mechanical connection, preventing terminal damage and ensuring reliable signal transmission.

Maximum Supply Current: 35 mA

With a maximum supply current of 35 mA, this product ensures power-efficient operation, reducing energy consumption and minimizing heat generation.

No. of Words: 512 words

The ample memory capacity of 512 words allows for efficient storage and retrieval of data, suitable for various applications.

Memory Width: 18

With a memory width of 18, this product supports larger data transfers, enabling faster and more efficient processing.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm provides precise and secure connectivity, ensuring reliable signal transmission in space-constrained systems.

No. of Words Code: 512

This product supports a code of 512 words, allowing for versatile data storage and retrieval capabilities.

Moisture Sensitivity Level (MSL): 3

Rated at MSL level 3, this product demonstrates stable performance and reliability even when exposed to limited moisture conditions.

Maximum Supply Voltage (Vsup): 3.6 V

Operating with a maximum supply voltage of 3.6V, this product can handle higher power requirements, ensuring stable and reliable operation.

Memory Density: 9216 bit

With a memory density of 9216 bit, this product offers ample storage capacity for various data-intensive applications.

Memory IC Type: OTHER FIFO

This product belongs to the FIFO (First-In-First-Out) memory IC type, offering efficient data storage and retrieval capabilities, ideal for data buffering or caching.

Output Enable: YES

The output enable feature allows for control over data output, enabling effective communication and integration with other components.

Maximum Access Time: 12 ns

With a fast maximum access time of 12 ns, this product ensures quick data retrieval and processing, enhancing overall system performance.

Technical Specifications

FIFO SN74V215-20PAG attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

12 ns

Maximum Clock Frequency (fCLK):

133 MHz

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

SN74V215-20PAG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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