Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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7203L25PI FIFO by Integrated Device Technology features a cycle time of 35ns, operating at 5V with an organization of 2KX9. Ideal for industrial applications, it offers a memory density of 18432 bits and operates in parallel mode at a max clock frequency of 28.5MHz.
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Provides good durability and protection for the internal components of the FIFO, ensuring a longer lifespan.
Fast cycle time allows for quick access and retrieval of data, making the FIFO efficient in data processing operations.
Rectangular shape allows for easy integration and placement within electronic devices or systems.
Asynchronous operation enables independent operation without the need for synchronized clock signals, offering flexibility in data transfer.
Standard supply voltage ensures compatibility with common power sources, making integration easier.
Lower power supply requirements result in energy-efficient operation, reducing overall power consumption.
Sufficient terminals provide multiple connection points for interfacing with other components or devices.
In-line package style is space-saving and allows for efficient use of circuit board real estate.
Wide operating temperature range ensures reliable performance in various environmental conditions.
Organized into 2K x 9 configuration, optimizing memory storage capacity and data retrieval efficiency.
Low minimum operating temperature allows for use in extreme cold conditions without compromising functionality.
Tin/Lead finish provides good solderability for easy assembly onto circuit boards.
Dual terminal position offers redundancy and improved reliability in data transmission.
Low seated height enables compact design and integration in space-constrained applications.
High clock frequency allows for rapid data processing and transfer speeds, enhancing overall system performance.
Narrow width facilitates easy installation and placement in tight spaces or crowded circuit layouts.
Low minimum supply voltage ensures compatibility with a wide range of power sources for versatile application.
Extended time at peak reflow temperature ensures proper solder joint formation during assembly.
High peak reflow temperature capability allows for reliable soldering of the FIFO onto circuit boards.
Optimal length provides a balanced form factor for easy integration into various electronic systems or devices.
Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions typically found in industrial settings.
CMOS technology offers low power consumption, high speed, and compatibility with various electronic systems, enhancing overall performance.
Parallel data transfer allows for simultaneous processing of multiple data bits, increasing data transfer efficiency.
Through-hole terminal form provides secure connections and mechanical stability in high-vibration environments.
Low maximum supply current requirement ensures energy-efficient operation and minimizes power consumption.
Ample memory capacity in terms of word storage allows for efficient data handling and processing within the FIFO.
Memory width of 9 bits allows for data storage and retrieval of data in 9-bit segments, enhancing data processing capabilities.
Optimal terminal pitch facilitates easy PCB layout and soldering of the FIFO onto circuit boards.
2K word code designation indicates the memory storage capacity of the FIFO, providing clarity on its data storage capability.
High maximum supply voltage tolerance ensures compatibility with a wide range of power sources, offering flexibility in power supply options.
High memory density enables storage of a large amount of data within the FIFO, enhancing its data processing capabilities.
Specific memory IC type designation indicates the FIFO's unique memory storage architecture and functionality.
Low maximum standby current consumption minimizes power usage during idle periods, contributing to energy efficiency.
Fast maximum access time ensures quick data retrieval and processing, optimizing overall system performance.
FIFO 7203L25PI attributes and parameters. Explore more FIFO devices from Integrated Device Technology
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7203L25PI Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
MBRA340T3G
Onsemi
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
2N2222A
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Fairchild Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
2N7002
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
FDV303N
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
1N4148
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
LL4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
OPA2227UA
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
SMBJ18CA
Bourns
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
Yangzhou Yangjie Electronics
International Devices
SN74V235-10PAG
SN74V235-10PAG by Texas Instruments is a 2Kx18 FIFO with a cycle time of 10ns and max clock frequency of 166MHz. It operates at a nominal voltage of 3.3V, suitable for commercial temperature grades. This FIFO features parallel operation and output enable functionality, making it ideal for high-speed data buffering applications.
72V05L15JG
Renesas Electronics
The Renesas Electronics 72V05L15JG is a FIFO chip with 8Kx9 organization, operating at 3.3V. It features a cycle time of 25ns and max access time of 15ns, suitable for applications requiring fast data processing in commercial-grade environments. The chip is designed in CMOS technology with parallel interface, making it ideal for high-speed memory applications.
SN74ACT7203L-50DVR
SN74ACT7203L-50DVR by Texas Instruments is a FIFO with 2KX9 organization, 65 ns cycle time, and 3-STATE output characteristics. It operates asynchronously at a supply voltage of 5V. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN54ALS233FK
SN54ALS233FK by Texas Instruments is a 16x5 FIFO chip with 20 terminals, operating at up to 20 MHz clock frequency. It is designed for military-grade applications, featuring TTL technology and a ceramic package suitable for surface mount assembly.
CD40105BEE4
CD40105BEE4 by Texas Instruments is a FIFO IC with 16x4 organization, operating at 1.5MHz clock frequency. It has a memory width of 4 bits and can operate in parallel mode. This CMOS technology device is ideal for military-grade applications requiring fast access times and low power consumption.
SN74ACT7206L-15RJR
SN74ACT7206L-15RJR by Texas Instruments is a 16Kx9 FIFO chip with 25ns cycle time, operating at 5V. It features 3-STATE output characteristics and operates in parallel mode. This CMOS technology chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT3651-15PCB
SN74ACT3651-15PCB by Texas Instruments is a FIFO with 2Kx36 organization, operating at 66.7MHz with 15ns cycle time. It features a memory density of 73728 bits and is ideal for applications requiring bi-directional FIFO memory ICs with synchronous operation.
SN74ACT2228DWR
SN74ACT2228DWR by Texas Instruments is a FIFO with 256x1 organization, operating at 22MHz clock frequency. It features a cycle time of 45.45ns and operates in synchronous mode. This small outline package is ideal for industrial applications requiring fast memory access.
72V841L15TFI8
Integrated Device Technology
72V841L15TFI8 by Integrated Device Technology is a FIFO with 4Kx9 organization, operating at 66.7MHz clock frequency and 15ns cycle time. Ideal for industrial applications requiring fast data processing, it features a low profile flatpack package with 64 terminals and operates on a nominal voltage of 3.3V.
1O7820-20PNG4
1O7820-20PNG4 by Texas Instruments is a 512x18 FIFO with 20ns cycle time and 5V nominal voltage. Ideal for applications requiring fast synchronous data transfer, such as networking equipment and telecommunications devices. Features include low profile flatpack package, parallel operation, and output enable functionality.
72V255LA15PFGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Width: 14 mm;
SN74ACT2235-60FNR
SN74ACT2235-60FNR by Texas Instruments is a FIFO chip with 1Kx9 organization, operating at 60 ns cycle time. It features 3-STATE output characteristics and operates in parallel mode. This chip is commonly used in applications requiring fast data storage and retrieval with a memory density of 9216 bits.
IDT7204L12JG8
The Renesas Electronics IDT7204L12JG8 is a FIFO chip with 4Kx9 organization, operating at 50 MHz with a cycle time of 20 ns. It features a parallel interface, 3-STATE output characteristics, and operates on a nominal voltage of 5V. This chip is commonly used in applications requiring fast data storage and retrieval in commercial-grade environments.
SN74ACT3632-20PCB
SN74ACT3632-20PCB by Texas Instruments is a FIFO memory IC with 512x36 organization, operating at 20 ns cycle time and 50 MHz clock frequency. It features a low profile flatpack package suitable for commercial temperature grade applications.
SN74ACT7201A-35N
SN74ACT7201A-35N by Texas Instruments is a FIFO with 512x9 organization, 45ns cycle time, and 22.2MHz max clock frequency. It operates synchronously at 5V and is ideal for parallel memory applications requiring fast access times in commercial temperature environments.
SN74ABT7819-30PNR
SN74ABT7819-30PNR by Texas Instruments is a FIFO with 512x18 organization, operating at 5V. It features a cycle time of 30.03 ns and offers 3-STATE output characteristics. This device is suitable for applications requiring synchronous operation and a memory density of 9216 bit in commercial temperature grade environments.
CV235-7PAGG4
CV235-7PAGG4 by Texas Instruments is a FIFO with 2Kx18 organization, operating at 133MHz clock frequency. It features 3.3V nominal voltage and 7.5ns cycle time, suitable for commercial applications requiring fast data processing in a compact form factor.
SN74ACT7200L-15NP
SN74ACT7200L-15NP by Texas Instruments is a FIFO memory IC with 256x9 organization, 25ns cycle time, and 40MHz clock frequency. It operates asynchronously at a supply voltage of 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
5962-8986305YA
Atmel
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
CY7C4235-15AXCT
Cypress Semiconductor
CY7C4235-15AXCT by Cypress Semiconductor is a 2Kx18 FIFO with 15ns cycle time, operating at 5V. It features synchronous mode and GULL WING terminals. Ideal for applications requiring fast data transfer in commercial temperature environments.
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7203L12JG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; No. of Words: 2048 words;
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
7203L15JI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Length: 13.9954 mm;
7203L25JI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Width: 11.43 mm;
7203L12JG
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Style (Meter): CHIP CARRIER;
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; JESD-30 Code: R-PQCC-J32;
7203L12J8
7203L12J8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 50 MHz clock frequency. It features a cycle time of 20 ns and can handle memory width of 9 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7203L15J8
7203L15J8 by Integrated Device Technology is a FIFO memory chip with a cycle time of 25 ns and an operating frequency of up to 40 MHz. It has a memory capacity of 2Kx9 and is commonly used in applications that require high-speed data buffering and storage.
7203L15JI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
7203L15PI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Width: 15.24 mm;
7203L15TPI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS;
7203L25J8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
7203L12LG
BI-DIRECTIONAL FIFO; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Output Enable: NO; Minimum Supply Voltage (Vsup): 4.5 V;
7203L12LG8
BI-DIRECTIONAL FIFO; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Maximum Supply Current: 120 mA; Minimum Supply Voltage (Vsup): 4.5 V;
7203L12DGB8
FIFOs;
7203L12LGB
7203L12LGB8
7203L12DG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
7203L12DGI
BI-DIRECTIONAL FIFO;
7203L25TPG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
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