Loading...

7203L25PI

Integrated Device Technology

7203L25PI by Integrated Device Technology

7203L25PI FIFO by Integrated Device Technology features a cycle time of 35ns, operating at 5V with an organization of 2KX9. Ideal for industrial applications, it offers a memory density of 18432 bits and operates in parallel mode at a max clock frequency of 28.5MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Vyrian

USA . 439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

439

-

-

-

-

VNN

France . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

350

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 881 parts In-Stock

1+ parts

$17.811

100+ parts

-

1k+ parts

-

10k+ parts

-

881

$17.811

-

-

-

Ampacity Inc.

Singapore . 1,425 parts In-Stock

1+ parts

$24.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,425

$24.000

-

-

-

Continental Prestige Electronics

USA . 5,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,885

-

-

-

-

Argo Parts USA

USA . 4,349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,349

-

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Microchip USA

USA . 147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

147

-

-

-

-

Overview

Discover the unparalleled reliability and performance of the 7203L25PI FIFO by Integrated Device Technology. As a trusted industry leader, IDT delivers top-notch quality and cutting-edge technology in every product. Ideal for a wide range of applications, this FIFO offers seamless operation and precision timing. Experience the value and benefits of fast cycle times, high memory density, and industrial-grade temperature tolerance. Elevate your projects with the superior advantages that only IDT can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the FIFO, ensuring a longer lifespan.

Cycle Time: 35 ns

Fast cycle time allows for quick access and retrieval of data, making the FIFO efficient in data processing operations.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement within electronic devices or systems.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables independent operation without the need for synchronized clock signals, offering flexibility in data transfer.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with common power sources, making integration easier.

Power Supplies (V): 5

Lower power supply requirements result in energy-efficient operation, reducing overall power consumption.

No. of Terminals: 28

Sufficient terminals provide multiple connection points for interfacing with other components or devices.

Package Style (Meter): IN-LINE

In-line package style is space-saving and allows for efficient use of circuit board real estate.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Organization: 2KX9

Organized into 2K x 9 configuration, optimizing memory storage capacity and data retrieval efficiency.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold conditions without compromising functionality.

Terminal Finish: Tin/Lead (Sn85Pb15)

Tin/Lead finish provides good solderability for easy assembly onto circuit boards.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved reliability in data transmission.

Maximum Seated Height: 4.699 mm

Low seated height enables compact design and integration in space-constrained applications.

Maximum Clock Frequency (fCLK): 28.5 MHz

High clock frequency allows for rapid data processing and transfer speeds, enhancing overall system performance.

Width: 15.24 mm

Narrow width facilitates easy installation and placement in tight spaces or crowded circuit layouts.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage ensures compatibility with a wide range of power sources for versatile application.

Maximum Time At Peak Reflow Temperature (s): 20

Extended time at peak reflow temperature ensures proper solder joint formation during assembly.

Peak Reflow Temperature °C: 240

High peak reflow temperature capability allows for reliable soldering of the FIFO onto circuit boards.

Length: 36.576 mm

Optimal length provides a balanced form factor for easy integration into various electronic systems or devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various electronic systems, enhancing overall performance.

Parallel or Serial: PARALLEL

Parallel data transfer allows for simultaneous processing of multiple data bits, increasing data transfer efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure connections and mechanical stability in high-vibration environments.

Maximum Supply Current: 120 mA

Low maximum supply current requirement ensures energy-efficient operation and minimizes power consumption.

No. of Words: 2048 words

Ample memory capacity in terms of word storage allows for efficient data handling and processing within the FIFO.

Memory Width: 9

Memory width of 9 bits allows for data storage and retrieval of data in 9-bit segments, enhancing data processing capabilities.

Terminal Pitch: 2.54 mm

Optimal terminal pitch facilitates easy PCB layout and soldering of the FIFO onto circuit boards.

No. of Words Code: 2K

2K word code designation indicates the memory storage capacity of the FIFO, providing clarity on its data storage capability.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance ensures compatibility with a wide range of power sources, offering flexibility in power supply options.

Memory Density: 18432 bit

High memory density enables storage of a large amount of data within the FIFO, enhancing its data processing capabilities.

Memory IC Type: OTHER FIFO

Specific memory IC type designation indicates the FIFO's unique memory storage architecture and functionality.

Maximum Standby Current: 0.002 Amp

Low maximum standby current consumption minimizes power usage during idle periods, contributing to energy efficiency.

Maximum Access Time: 25 ns

Fast maximum access time ensures quick data retrieval and processing, optimizing overall system performance.

Technical Specifications

FIFO 7203L25PI attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

25 ns

Additional Features:

RETRANSMIT

Maximum Clock Frequency (fCLK):

28.5 MHz

Cycle Time:

35 ns

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

Length:

36.576 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

9

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

240

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.699 mm

Maximum Standby Current:

.002 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

120 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15.24 mm

Trade Compliance

7203L25PI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20