Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IDT72V841L10TFG8 by Integrated Device Technology is a FIFO memory with 4Kx9 organization, operating at 3.3V. It features a cycle time of 10ns, synchronous mode, and parallel interface. This device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
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Provides durability and protection for the internal components, ensuring a long lifespan for the product.
Fast cycle time allows for quick data retrieval and processing, making this FIFO efficient for high-speed applications.
Compatible with common supply voltages, making it easy to integrate into existing systems.
Sufficient number of terminals for connecting to other components and systems.
Synchronous operation ensures that data is transferred at precise intervals, reducing the risk of errors.
Can withstand high temperatures, making it suitable for a variety of environments.
Operates reliably even in low-temperature conditions, enhancing its versatility.
Wide memory width allows for storing and accessing more data simultaneously.
Output enable feature provides greater control over the data output, enhancing flexibility in system design.
FIFO IDT72V841L10TFG8 attributes and parameters. Explore more FIFO devices from Integrated Device Technology
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IDT72V841L10TFG8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.
M39029/58-360
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
BSS138
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
BAV99
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
LM358D-T
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM555CM
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
USB2514BI-AEZG
Standard Microsystems
BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
Kec
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
SMBJ18CA
Eic Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
SN74ACT2235-40PAG
SN74ACT2235-40PAG by Texas Instruments is a FIFO memory with 1Kx9 organization, operating at 25MHz clock frequency and 40ns cycle time. It features a parallel interface, 3-STATE output characteristics, and GULL WING terminal form. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT7204L15SOI8
Integrated Device Technology
IDT7204L15SOI8 by Integrated Device Technology is a 4Kx9 FIFO memory IC with 25ns cycle time and 40MHz clock frequency. It operates at 5V, suitable for industrial applications requiring fast data storage and retrieval in parallel mode. With a compact small outline package, it offers reliable performance in harsh environments with temperatures ranging from -40 to 85°C.
SN74ACT7201LA20DV
SN74ACT7201LA20DV by Texas Instruments is a FIFO chip with 512x9 organization, operating in asynchronous mode at 5V. It features a small outline package, Gull Wing terminal form, and CMOS technology. Ideal for applications requiring parallel memory storage with a capacity of 4608 bits.
SN74ABT3614-30PQR
SN74ABT3614-30PQR by Texas Instruments is a FIFO with 64x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and storage in synchronous operating mode.
SN74ACT7204-40FM
SN74ACT7204-40FM by Texas Instruments is a FIFO chip with 4Kx9 organization, operating at 20MHz. It has a memory density of 36864 bits and operates on a 5V supply. This CMOS technology chip is ideal for applications requiring fast data transfer and storage in commercial temperature environments.
72V3650L6PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; Additional Features: RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE;
72V235L10TFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
74HC40105D,652
NXP Semiconductors
74HC40105D,652 by NXP Semiconductors is a FIFO memory IC with a cycle time of 71.428 ns and an operating mode of asynchronous. It is commonly used in automotive applications due to its temperature grade and moisture sensitivity level.
72V51446L6BB8
The Renesas Electronics 72V51446L6BB8 FIFO operates synchronously with a cycle time of 6 ns. It features 32Kx36 organization, 3.3V nominal voltage, and 256 terminals in a grid array package style. Ideal for applications requiring fast data processing and storage in commercial temperature environments.
SN74ACT2236-20FN
SN74ACT2236-20FN by Texas Instruments is a 2Kx9 FIFO chip carrier with 20ns cycle time, operating at 5V. It features synchronous operation, 50MHz clock frequency, and 3-STATE output characteristics. Ideal for industrial applications requiring bi-directional FIFO memory with parallel interface.
SN74ACT2235-40FNR
SN74ACT2235-40FNR by Texas Instruments is a FIFO chip with 1Kx9 organization, 40ns cycle time, and 35ns access time. It operates at 5V with output enable feature for parallel applications. Ideal for systems requiring fast data transfer and storage in commercial temperature environments.
SN54ABT3614PCB
SN54ABT3614PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, operating at 50 MHz clock frequency. It features a 20 ns cycle time, synchronous operation, and 3-STATE output characteristics. Ideal for military applications due to its -55 to 125 °C temperature range and low profile flatpack package style.
SN74ACT72235-40FN
SN74ACT72235-40FN by Texas Instruments is a FIFO chip with 1Kx9 organization, 40ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and communication systems. The chip comes in a square chip carrier package with surface mount capability.
SN54ALS233FK
SN54ALS233FK by Texas Instruments is a 16x5 FIFO chip with 20 terminals, operating at up to 20 MHz clock frequency. It is designed for military-grade applications, featuring TTL technology and a ceramic package suitable for surface mount assembly.
SN74ACT7205L25RJR
SN74ACT7205L25RJR by Texas Instruments is a FIFO chip with 8Kx9 organization, 35ns cycle time, and 28.5MHz max clock frequency. It operates at 5V, has a memory density of 73728 bits, and is used in applications requiring fast asynchronous data storage and retrieval.
7201LA12JG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
SN74V263PZAEP
SN74V263PZAEP by Texas Instruments is a FIFO memory with 8Kx18 organization, operating at 133 MHz. It features a cycle time of 7.5 ns and synchronous operation, suitable for military-grade applications requiring fast data processing and low power consumption. With a package style of flatpack and low profile design, it offers high memory density of 147456 bits in a compact form factor.
SN54ALS236FK
SN54ALS236FK by Texas Instruments is a 64x4 FIFO chip with 40ns cycle time, operating at 5V. It features totem pole output, asynchronous mode, and military-grade temperature range. Ideal for applications requiring fast data storage and retrieval in harsh environments.
SN74ABT3613-15PCBR
SN74ABT3613-15PCBR by Texas Instruments is a FIFO with 64x36 organization, 15 ns cycle time, and 10 ns max access time. It operates synchronously at 5V and has a memory density of 2304 bit. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT7201LA-25DV
SN74ACT7201LA-25DV by Texas Instruments is a FIFO with 512x9 organization, 35ns cycle time, and 28.5MHz max clock frequency. It operates asynchronously at 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
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IDT72801L15PF
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Functions: 2;
IDT72V05L25JGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
IDT72V2105L10PFG8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Length: 14 mm;
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
IDT72V05L25JGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Organization: 8KX9;
IDT72V2105L10PFG
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, LOW PROFILE;
IDT72V2105L10PFG by Renesas Electronics is a 256Kx18 FIFO with 10ns cycle time, operating in synchronous mode at 3.3V. It features a low profile flatpack package and Gull Wing terminals, suitable for commercial applications requiring fast data transfer and memory management.
IDT7201LA35JG
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Terminal Position: QUAD;
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
IDT7202LA12PDG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 1K;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
IDT72801L25PF
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
IDT7280L20PA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 512;
IDT72801L10PF
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
IDT72801L15PFI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, LOW PROFILE;
IDT72801L15PFI8
IDT72801L35PF
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 512 words;
IDT7280L15PA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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