Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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1M7807-15PAGG4 by Texas Instruments is a 2Kx9 FIFO with 15ns cycle time, operating at 67MHz. Ideal for commercial applications, it features a 64-terminal flatpack package with synchronous operation and parallel interface.
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The use of PLASTIC/EPOXY material ensures durability and reliability of the product.
The fast cycle time of 15 ns allows for quick data access and processing.
Operating in synchronous mode ensures efficient and accurate data transfers.
Operating at a standard voltage of 5V makes it compatible with many systems.
Having 64 terminals allows for high connectivity and interfacing options.
The high maximum operating temperature of 70°C improves the product's reliability in various environments.
Using CMOS technology ensures low power consumption and high noise immunity.
The ability to enable output allows for better control and management of data flow.
With a maximum access time of 12 ns, data can be retrieved quickly for efficient processing.
FIFO 1M7807-15PAGG4 attributes and parameters. Explore more FIFO devices from Texas Instruments
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Cycle Time:
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JESD-609 Code:
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No. of Words:
No. of Words Code:
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Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Enable:
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Package Code:
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Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
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Maximum Supply Voltage (Vsup):
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1M7807-15PAGG4 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
2N7002
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
LM358N
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Philips Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Diotec Semiconductor Ag
NC7WZ17P6X
Onsemi
The Onsemi NC7WZ17P6X is a logic gate with 2 functions, featuring a propagation delay of 13.1 ns at 1.8V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and has a max power supply current of 100mA. With Schmitt Trigger technology and small outline packaging, it suits compact electronic designs requiring fast signal processing.
SMBJ18CA
Daco Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
International Semiconductor
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
Sangdest Microelectronics (Nanjing)
ST3485EBDR
STMicroelectronics
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
SN74ABT7819A-20PH
SN74ABT7819A-20PH by Texas Instruments is a 512KX18 BI-DIRECTIONAL FIFO with 20 ns cycle time, operating at 50 MHz. It features a memory density of 9437184 bit and can operate in synchronous mode. This FIFO is suitable for applications requiring fast data transfer and high memory capacity.
74HC40105PW,112
NXP Semiconductors
NXP Semiconductors' 74HC40105PW,112 FIFO chip features 16x4 organization, 33 MHz clock frequency, and 600 ns access time. Ideal for automotive applications, it operates in parallel mode with a supply voltage range of 2-6V.
SN74ABT7819A-12PN
SN74ABT7819A-12PN by Texas Instruments is a 512Kx18 FIFO with 80 terminals and operates at 5V. It features a cycle time of 12ns, synchronous operation, and max clock frequency of 80MHz. Ideal for applications requiring high-speed data transfer in commercial temperature environments.
CD74HC40105MT
CD74HC40105MT by Texas Instruments is a FIFO memory IC with 16x4 organization, 64-bit memory density, and 10 MHz clock frequency. It operates in synchronous mode with a cycle time of 500 ns and is suitable for military-grade applications requiring fast data storage and retrieval.
SN74ACT7201LA50NP
SN74ACT7201LA50NP by Texas Instruments is a FIFO memory with 512x9 organization, operating at 15 MHz clock frequency. It has a cycle time of 65 ns and operates on a 5V supply voltage. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN54ABT7819HTR
SN54ABT7819HTR by Texas Instruments is a FIFO with 512x18 organization, operating at 5V. It has a cycle time of 20ns and max access time of 12ns. Ideal for military applications due to its MIL-graded temperature range and BICMOS technology, it offers fast parallel operation in a compact flatpack package.
IDT7203L12J8
Integrated Device Technology
IDT7203L12J8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 20ns cycle time and 50MHz clock frequency. It is used in applications requiring fast data storage and retrieval, such as networking equipment and communication systems.
SN74ABT7819-30PH
SN74ABT7819-30PH by Texas Instruments is a 512x18 FIFO with a cycle time of 30.03 ns and max clock frequency of 33.3 MHz. It operates synchronously, has a memory density of 9216 bit, and is ideal for commercial applications requiring fast data storage and retrieval.
72V3632L10PFG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 120; Package Code: LFQFP; Package Shape: SQUARE; Package Equivalence Code: QFP120,.63SQ,16;
IDT72V255LA10PFG8
Renesas Electronics
IDT72V255LA10PFG8 by Renesas Electronics is a 3.3V FIFO with 8Kx18 organization, operating at 100MHz clock frequency. Suitable for commercial applications, it offers a cycle time of 10ns, synchronous operation, and parallel interface for efficient data transfer.
72V2111L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Standby Current: .02 Amp;
IDT72V841L10TFG8
IDT72V841L10TFG8 by Integrated Device Technology is a FIFO memory with 4Kx9 organization, operating at 3.3V. It features a cycle time of 10ns, synchronous mode, and parallel interface. This device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
CD40105BF3AS2283
CD40105BF3AS2283 by Texas Instruments is a 16X4 FIFO with 64-bit memory density. Operating at -55 to 125 °C, it has an access time of 420 ns and supports parallel data transfer. Ideal for military applications requiring fast and reliable data storage and retrieval.
5962-8952305EA
Teledyne E2v (uk)
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
SN74ACT7201A-35N
SN74ACT7201A-35N by Texas Instruments is a FIFO with 512x9 organization, 45ns cycle time, and 22.2MHz max clock frequency. It operates synchronously at 5V and is ideal for parallel memory applications requiring fast access times in commercial temperature environments.
SN74ACT3622-30PQR
SN74ACT3622-30PQR by Texas Instruments is a FIFO with 256x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments.
72V271LA10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Memory Density: 294912 bit;
SN74ACT7204-50FM
SN74ACT7204-50FM by Texas Instruments is a FIFO chip with 4Kx9 organization, operating at 15MHz clock frequency. It has a memory density of 36864 bits and can operate in temperatures ranging from 0 to 70°C. This chip is commonly used in applications requiring asynchronous operation and a memory width of 9 bits.
72V211L15PFGI8
The Renesas Electronics 72V211L15PFGI8 FIFO operates synchronously with a cycle time of 15 ns. It features a memory density of 4608 bit and an organization of 512X9, making it ideal for industrial applications requiring fast data processing. With a low profile flatpack package style and GULL WING terminal form, this FIFO is suitable for surface mount PCB designs in various electronic systems.
IDT72V2105L10PFG8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
1M7802-60PNG4
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
1M7804-20DLG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Maximum Access Time: 15 ns;
1M7804-20DLRG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
1M7805-15DLG4
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Package Equivalence Code: SSOP56,.4;
1M7806-40DLG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
1M7813-25DLRG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
1M7814-40DLG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Maximum Access Time: 20 ns;
1M7881-20PNG4
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Terminal Finish: NICKEL PALLADIUM GOLD;
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