Loading...

SN54LS222J

Texas Instruments

SN54LS222J by Texas Instruments

SN54LS222J by Texas Instruments is a 16x4 FIFO memory IC with 3-STATE output characteristics. Operating at 5V, it has a temperature range of -55 to 125°C and is MILITARY grade. With parallel interface and synchronous mode, it's ideal for high-reliability applications in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,100

-

-

-

-

Digiode

USA . 997 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

997

-

-

-

-

Resion

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 664 parts In-Stock

1+ parts

$4.780

100+ parts

-

1k+ parts

$5.285

10k+ parts

-

664

$4.780

-

$5.285

-

DigiPath Technology Company

USA . 165 parts In-Stock

1+ parts

$5.264

100+ parts

-

1k+ parts

-

10k+ parts

-

165

$5.264

-

-

-

ChromeModa Solutions

Germany . 6,674 parts In-Stock

1+ parts

$5.371

100+ parts

$4.404

1k+ parts

-

10k+ parts

-

6,674

$5.371

$4.404

-

-

IDEA Electronic Components Group

UK . 2,344 parts In-Stock

1+ parts

$5.371

100+ parts

-

1k+ parts

$4.834

10k+ parts

-

2,344

$5.371

-

$4.834

-

One Stop Electronics

USA . 860 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

-

10k+ parts

-

860

$12.000

-

-

-

AZTECH Wire

Italy . 531 parts In-Stock

1+ parts

$12.501

100+ parts

-

1k+ parts

-

10k+ parts

-

531

$12.501

-

-

-

Corphita

USA . 453 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

453

-

-

-

-

Overview

Unlock the power of seamless data transfer with the SN54LS222J by Texas Instruments. As a trusted leader in semiconductor manufacturing, Texas Instruments delivers unmatched quality and reliability in their FIFO products. Ideal for a wide range of applications, this synchronous FIFO offers customers a valuable solution for efficient data storage and retrieval. Experience the benefits of faster processing speeds and improved performance with the SN54LS222J. Truly a game-changer in digital technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and reliability for the product, ensuring it can withstand harsh environments.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures smooth and synchronized data transfer, making the product efficient and reliable in handling data.

Nominal Supply Voltage (Vsup): 5V

The 5V nominal supply voltage ensures compatibility with standard power supplies, making it easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can be used in high-temperature applications without risk of overheating.

Memory Density: 64 bit

The high memory density of 64 bits allows for efficient storage and retrieval of data, making the product suitable for handling large amounts of information.

Technical Specifications

FIFO SN54LS222J attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

JESD-30 Code:

R-GDIP-T20

Length:

24.195 mm

Memory Density:

64 bit

Memory IC Type:

Memory Width:

4

No. of Functions:

1

No. of Terminals:

20

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

16X4

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN54LS222J Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20